JPS60211952A - Wire-bonding method - Google Patents

Wire-bonding method

Info

Publication number
JPS60211952A
JPS60211952A JP59068464A JP6846484A JPS60211952A JP S60211952 A JPS60211952 A JP S60211952A JP 59068464 A JP59068464 A JP 59068464A JP 6846484 A JP6846484 A JP 6846484A JP S60211952 A JPS60211952 A JP S60211952A
Authority
JP
Japan
Prior art keywords
wire
gas
ball
capillary
point
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP59068464A
Other languages
Japanese (ja)
Inventor
Koichiro Atsumi
幸一郎 渥美
Tetsuo Ando
安藤　鉄男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP59068464A priority Critical patent/JPS60211952A/en
Publication of JPS60211952A publication Critical patent/JPS60211952A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/78268—Discharge electrode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85009—Pre-treatment of the connector or the bonding area
    • H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
    • H01L2224/85035—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
    • H01L2224/85045—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85053—Bonding environment
    • H01L2224/85054—Composition of the atmosphere
    • H01L2224/85065—Composition of the atmosphere being reducing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85053—Bonding environment
    • H01L2224/85054—Composition of the atmosphere
    • H01L2224/85075—Composition of the atmosphere being inert
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01007—Nitrogen [N]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01018—Argon [Ar]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To prevent a ball from oxidizing and to contrive to improve the bonding property of wire by a method wherein, when the ball is formed on the point of the wire, gas, wherein H2 gas has been mixed with inactive gas, such as N2 gas, at a ratio of 0.01-1.0vol%, is used as shielding gas for oxidation prevention, which is sprayed on the region embracing the point of the wire. CONSTITUTION:In case a wire 13 is bonded on the pad part of a pellet 17, firstly, the main body 14 of a torch is made to advance in such a way that a torch electrode 16 opposes to the lower end of a capillary 12. At this time, the point of the wire 13 inserted in the capillary 12 is made to approach the lower end of the capillary 12. On the other hand, shielding gas, which is fed from a shielding gas feed source, is blowing off from a feeding port body 14. Therefore, the region embracing the torch electrode 16 and the point of the wire 13 has been shielded from the atmosphere by the shielding gas. When voltage is impressed on the torch electrode 16 under this condition, sparks generate and a ball 18 is formed on the point of the wire 13. As a result, the surface oxidation of the ball 18 can be prevented, because the ball 18 has been covered with shielding gas, wherein H2 gas has been mixed with inactive gas at a ratio of 0.01-1.0vol%.

Description

【発明の詳細な説明】 〔発明の技術分野〕 この発明はたとえばＬＳＩなどの集積回路の組立て工程
においてペレットに対してワイヤをボンディングするワ
イヤボンディング方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a wire bonding method for bonding a wire to a pellet in the assembly process of an integrated circuit such as an LSI.

〔発明の技術的背景とその問題点〕[Technical background of the invention and its problems]

一般に集積回路等の組立てに用いられるワイヤボンディ
ング装置は、ボンディングツールに設けられたキャピラ
リにワイヤを挿通し、このワイヤの先端を第１のボンデ
ィング点であるペレットのパッドに押付けてボンディン
グしたのち、キャピラリもしくはリードフレームを移動
して第２のボンディング点であるリードフレームのリー
ド部に圧着するようになっている。このとき、上記第１
のボンディング点に圧着する前に上記ワイヤの先端にス
パーク用トーチによってボールを形成し、このボールを
パッドに圧着している。ところで、上記ワイヤはアルミ
ニュウムなどの卑金属を用いる場合、ボールが酸化しゃ
すく、酸化するとボンディング性が極度に低下するとい
う不都合がある。Wire bonding equipment, which is generally used for assembling integrated circuits, inserts a wire into a capillary provided in a bonding tool, presses the tip of the wire against the pad of a pellet, which is the first bonding point, and performs bonding. Alternatively, the lead frame is moved and crimped to the lead portion of the lead frame, which is the second bonding point. At this time, the first
Before crimping the wire to the bonding point, a ball is formed at the tip of the wire using a spark torch, and this ball is crimped to the pad. By the way, when the wire is made of a base metal such as aluminum, there is a disadvantage that the balls are easily oxidized, and when oxidized, the bonding properties are extremely deteriorated.

そこで従来においては、キャピラリから導出するワイヤ
の先端に向けてシールドガス供給管を設置しシールドガ
スをワイヤの先端に向けて吹付け、トーチ電極とワイヤ
の先端の領域を大気からシールドし、ボールの酸化を防
止している。Conventionally, a shielding gas supply pipe is installed toward the tip of the wire led out from the capillary, and shielding gas is sprayed toward the tip of the wire to shield the torch electrode and the tip of the wire from the atmosphere. Prevents oxidation.

しかしながら、シールドが局部的であるため、大気中の
酸素を巻込みやすいく、確実な酸化防止ができないとい
う欠点がある。However, since the shield is localized, oxygen from the atmosphere is likely to be drawn in, and oxidation cannot be prevented reliably.

〔発明の目的〕[Purpose of the invention]

この発明は、・上記事情に着目してなされたもので、そ
の目的とするところは、゛トーチ電極とワイヤの先端の
領域を大気から確実にシールドすることができ、ボール
の酸化を防止することができるワイヤボンディング方法
を提供しようとするものである。This invention was made in view of the above-mentioned circumstances, and its purpose is to ``reliably shield the area of the torch electrode and the tip of the wire from the atmosphere, thereby preventing oxidation of the ball. The present invention aims to provide a wire bonding method that allows for

〔発明の概要〕[Summary of the invention]

この発明は上記目的を達成するために、ワイヤの先端に
ボールを形成させる際に、そのワイヤの先端の領域に吹
付ける酸化防止用シールドガスとしてＮ２などの不活性
ガスに０−００１〜１・Ｏ体積％のＮ２を混合したガス
を用いることにある。In order to achieve the above object, the present invention uses an inert gas such as N2 as an oxidation-preventing shielding gas to be sprayed onto the tip area of the wire when forming a ball at the tip of the wire. The purpose is to use a gas mixed with N2 and O volume %.

〔発明の実施例〕[Embodiments of the invention]

以下、この発明の実施例を図面にもとづいて説明する。 Embodiments of the present invention will be described below based on the drawings.

図面はこの発明の一実施例を示すもので、１１はボンデ
ィングツールであり、この先端にはキャピラリ１２が設
けられている。そして、このキャピラリ１２にはアルミ
ニュウム線からなるワイヤ１３が挿通され、この先端は
キャピラリ１２から突出されている。そして、このキャ
ピラリ１２はボンディングツール１１と一体に上下動す
るようになっている。このボンディングツール１１の隣
側には電気１・−チまたは水素炎１・−チからなるトー
チ本体１４が設けられ、これはキャピラリ１２に対して
進退するようになっている。また、キャピラリ１２から
導出するワイヤ１３の先端に向けてシールドガスの供給
管１５が設けられ、トーチ本体１４のトーチ電極１６と
ワイヤ１３の先端の領域にシールドガスを吹付けるよう
になっている。The drawing shows one embodiment of the present invention, and 11 is a bonding tool, the tip of which is provided with a capillary 12. A wire 13 made of an aluminum wire is inserted through the capillary 12, and its tip protrudes from the capillary 12. This capillary 12 is designed to move up and down together with the bonding tool 11. A torch body 14 consisting of an electric torch or a hydrogen flame torch is provided adjacent to the bonding tool 11, and is adapted to move forward and backward with respect to the capillary 12. Further, a shielding gas supply pipe 15 is provided toward the tip of the wire 13 led out from the capillary 12, and the shielding gas is sprayed onto the torch electrode 16 of the torch body 14 and the area of the tip of the wire 13.

この場合、上記シールドガスとして、Ｎ２、Ａｒ”。In this case, the shielding gas is N2, Ar''.

Ｈｅなどの不活性ガスに０−００１〜１・０体積％のＮ
２を混合したガスを用いている。0-001 to 1.0% by volume of N in an inert gas such as He
A gas mixture of 2 is used.

しかして、ベレット１７のパッド部にボンディングする
場合には、まずトーチ本体１４が前進してトーチ電極１
６がキャピラリ１２の下端に対向する。このとき、キャ
ピラリ１２に挿通されたワイヤ１３の先端はキャピラリ
１２の下端に近接する。一方、シールドガス供給源から
のシールドガスは供給口体１４から吹出しているため、
トーチ電極１６のワイヤ１３の領域はシールドガスによ
って大気から遮断されている。この状態てトーチ電極１
６に電圧が印加されると、スパークが発生し、ワイヤ１
３の先端にボール１８が形成される。Therefore, when bonding is performed to the pad portion of the pellet 17, the torch body 14 moves forward and the torch electrode 1
6 faces the lower end of the capillary 12. At this time, the tip of the wire 13 inserted into the capillary 12 comes close to the lower end of the capillary 12. On the other hand, since the shielding gas from the shielding gas supply source is blown out from the supply port body 14,
The area of the wire 13 of the torch electrode 16 is shielded from the atmosphere by a shielding gas. In this state, torch electrode 1
When voltage is applied to 6, a spark is generated and the wire 1
A ball 18 is formed at the tip of 3.

すなわち、ボール１８は不活性ガスにＮ２ガスを混合し
たシールドガスによって覆われているため、水素ガスに
よる還元作用によりシールドガスが巻込んだ大気中の酸
素を除去するのでボール１８の表面酸化を防止すること
ができ、ペレット１７のパッド部へのボンディング性が
向上し、確実に圧着する。That is, since the ball 18 is covered with a shielding gas that is a mixture of inert gas and N2 gas, the reducing action of the hydrogen gas removes atmospheric oxygen entrained by the shielding gas, thereby preventing surface oxidation of the ball 18. This improves the bonding properties of the pellet 17 to the pad portion and ensures reliable pressure bonding.

また、Ｎ２を１．０％以下に押さえることによってボー
ル中に空洞が発生することもなく、良好なボールが形成
される。Ｎ２が０．００１％未満では還元作用の効果が
現われない。Further, by keeping N2 to 1.0% or less, a good ball is formed without forming cavities in the ball. If the N2 content is less than 0.001%, the reducing effect will not appear.

〔発明の効果〕〔Effect of the invention〕

以上説明したように、この発明によれば、トーチによっ
てワイヤの先端にボールを形成させる際、そのワイヤの
先端の領域に吹付ける酸化防止用シールドガスとしてＮ
２などの歩活性ガスに０１ＯＯ１〜１．０体積％のＮ２
を混合したガスを用いることにより、シールドガスが巻
込んだ大気中の酸素を除去するので、ボールの酸化を防
止することができ、ボンディング性を向上することがで
きる。As explained above, according to the present invention, when a ball is formed at the tip of a wire using a torch, N
01OO1~1.0% by volume of N2 in active gas such as 2
By using a mixed gas, oxygen in the atmosphere entrained by the shielding gas is removed, so oxidation of the ball can be prevented and bonding properties can be improved.

【図面の簡単な説明】[Brief explanation of drawings]

図面はこの発明の一実施例を示すボンディング装置の正
面図である。 １２・・・キャピラリ、１３・・・ワイヤ、１４・・・
トーチ本体、１８・・・ボール、１７・・・トーチ電極
。 出願人代理人　弁理士　鈴江武彦The drawing is a front view of a bonding device showing an embodiment of the present invention. 12... Capillary, 13... Wire, 14...
Torch body, 18...ball, 17...torch electrode. Applicant's agent Patent attorney Takehiko Suzue

Claims (1)

【特許請求の範囲】[Claims] キャピラリに挿通されたワイヤの先端にボールを形成し
、このボールを被接合部材に圧着させるワイヤボンディ
ング方法において、トーチによって上記ワイヤの先端に
ボールを形成させる際に、そのワイヤの先端の領域に吹
付ける酸化防止用シールドガスとしてＮ２　、Ａｒ　、
　１−１ｅなどの不活性ガスに０−００１〜１・Ｏ体積
％のＮ２を混合したガスを用いることを特徴とするワイ
ヤボンディング方法。In a wire bonding method in which a ball is formed at the tip of a wire inserted into a capillary and this ball is crimped onto a member to be bonded, when forming a ball at the tip of the wire using a torch, a blow is applied to the area of the tip of the wire. N2, Ar,
A wire bonding method characterized by using a gas in which N2 of 0-001 to 1.0 volume % is mixed with an inert gas such as 1-1e.
JP59068464A 1984-04-06 1984-04-06 Wire-bonding method Pending JPS60211952A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59068464A JPS60211952A (en) 1984-04-06 1984-04-06 Wire-bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59068464A JPS60211952A (en) 1984-04-06 1984-04-06 Wire-bonding method

Publications (1)

Publication Number Publication Date
JPS60211952A true JPS60211952A (en) 1985-10-24

Family

ID=13374433

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59068464A Pending JPS60211952A (en) 1984-04-06 1984-04-06 Wire-bonding method

Country Status (1)

Country Link
JP (1) JPS60211952A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2014054305A1 (en) * 2012-10-05 2016-08-25 株式会社新川 Antioxidant gas blowing unit

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2014054305A1 (en) * 2012-10-05 2016-08-25 株式会社新川 Antioxidant gas blowing unit

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