JPS5926246U - Spark electrode for aluminum ball forming - Google Patents

Spark electrode for aluminum ball forming

Info

Publication number
JPS5926246U
JPS5926246U JP1982120556U JP12055682U JPS5926246U JP S5926246 U JPS5926246 U JP S5926246U JP 1982120556 U JP1982120556 U JP 1982120556U JP 12055682 U JP12055682 U JP 12055682U JP S5926246 U JPS5926246 U JP S5926246U
Authority
JP
Japan
Prior art keywords
tip
spark electrode
ball forming
aluminum ball
spark
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1982120556U
Other languages
Japanese (ja)
Inventor
市山　雄三
Original Assignee
海上電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 海上電機株式会社 filed Critical 海上電機株式会社
Priority to JP1982120556U priority Critical patent/JPS5926246U/en
Publication of JPS5926246U publication Critical patent/JPS5926246U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
    • H01L2224/45124—Aluminium (Al) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/78268—Discharge electrode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H01L2224/78302—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85009—Pre-treatment of the connector or the bonding area
    • H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
    • H01L2224/85035—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
    • H01L2224/85045—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85053—Bonding environment
    • H01L2224/85054—Composition of the atmosphere
    • H01L2224/85075—Composition of the atmosphere being inert
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は実施例の斜視図。第２図の実施の態様を示す説
明図である。 １・・・パイプ、２・・・切口端面、３・・・スパーク
ロッド、４・・・ボンディングツール、５・・・挿通孔
、６・・・アルミニウム線、７・・・不活性ガス。FIG. 1 is a perspective view of the embodiment. FIG. 3 is an explanatory diagram showing an embodiment of FIG. 2; DESCRIPTION OF SYMBOLS 1... Pipe, 2... Cut end surface, 3... Spark rod, 4... Bonding tool, 5... Insertion hole, 6... Aluminum wire, 7... Inert gas.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ボンディングツールの挿通孔を通り、上記ボンディング
ツールの先端より突出したアルミニウム線の先端部を、
不活性ガスで遮蔽した状態で放電によって上記アルミニ
ウム線の先端に球状を形成させる装置において、パイプ
先端の所定の長さにわたって半月形に切り除かれ、この
切り除かれ部分にスパークロッドが嵌入固定されてなる
アルミボール成形用スパーク電極。Pass through the insertion hole of the bonding tool and insert the tip of the aluminum wire that protrudes from the tip of the bonding tool.
In a device that forms a spherical shape at the tip of the aluminum wire by electric discharge while shielded with an inert gas, a half-moon shape is cut out over a predetermined length of the tip of the pipe, and a spark rod is inserted and fixed into this cut out part. Spark electrode for forming aluminum balls.
JP1982120556U 1982-08-10 1982-08-10 Spark electrode for aluminum ball forming Pending JPS5926246U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982120556U JPS5926246U (en) 1982-08-10 1982-08-10 Spark electrode for aluminum ball forming

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982120556U JPS5926246U (en) 1982-08-10 1982-08-10 Spark electrode for aluminum ball forming

Publications (1)

Publication Number Publication Date
JPS5926246U true JPS5926246U (en) 1984-02-18

Family

ID=30276257

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982120556U Pending JPS5926246U (en) 1982-08-10 1982-08-10 Spark electrode for aluminum ball forming

Country Status (1)

Country Link
JP (1) JPS5926246U (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51147174A (en) * 1975-05-15 1976-12-17 Welding Inst Method and apparatus for connecting wires
JPS5789232A (en) * 1980-11-26 1982-06-03 Hitachi Ltd Forming device of spherical lump

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51147174A (en) * 1975-05-15 1976-12-17 Welding Inst Method and apparatus for connecting wires
JPS5789232A (en) * 1980-11-26 1982-06-03 Hitachi Ltd Forming device of spherical lump

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