JPS586378U - Structure of ground lead part of electronic equipment base - Google Patents
Structure of ground lead part of electronic equipment baseInfo
- Publication number
- JPS586378U JPS586378U JP10019581U JP10019581U JPS586378U JP S586378 U JPS586378 U JP S586378U JP 10019581 U JP10019581 U JP 10019581U JP 10019581 U JP10019581 U JP 10019581U JP S586378 U JPS586378 U JP S586378U
- Authority
- JP
- Japan
- Prior art keywords
- electronic equipment
- ground lead
- lead part
- equipment base
- lead wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
゛ 第１図は本考案の実施例の断面図、第２図は同
、 しく分解斜視図、第３図は従来の断面図である。
１、 １・・・金属ベース、２・・・アースリード線
挿通孔、３・・・アースリード線、４・・・導電性パイ
プ、５・・・導電性パイプのアースリード線挿通孔、６
・・・鑞着材。Fig. 1 is a sectional view of an embodiment of the present invention, Fig. 2 is an exploded perspective view of the same, and Fig. 3 is a sectional view of a conventional device. 1, 1... Metal base, 2... Earth lead wire insertion hole, 3... Earth lead wire, 4... Conductive pipe, 5... Earth lead wire insertion hole of conductive pipe, 6
...Brazing material.
Claims (1)
ベース１の厚さよりも背低で中央部にアースリード線３
の挿通孔５を有する導電性パイプ４とよりなり、アース
リード線挿通孔２にアースリード線３を挿通した導電性
パイプ４をはめ込み金属ベース１のアースリード線挿通
孔２の内周と導電性パイプ４の外周面との間および導電
性パイプ４とアースリード線３との間に鑞着材６を充て
ん七で一体に固結したことを特徴とする電子機器ベース
のアースリード部の構造。A metal base 1 with a ground lead wire insertion hole 2, and a ground lead wire 3 in the center with a height lower than the thickness of the metal base 1.
The conductive pipe 4 has an insertion hole 5 of A structure of an earth lead part of an electronic equipment base, characterized in that a soldering material 6 is filled between the outer circumferential surface of a pipe 4 and between a conductive pipe 4 and an earth lead wire 3, and they are solidified into one body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10019581U JPS586378U (en) | 1981-07-07 | 1981-07-07 | Structure of ground lead part of electronic equipment base |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10019581U JPS586378U (en) | 1981-07-07 | 1981-07-07 | Structure of ground lead part of electronic equipment base |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS586378U true JPS586378U (en) | 1983-01-17 |
| JPS6217990Y2 JPS6217990Y2 (en) | 1987-05-08 |
Family
ID=29894899
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10019581U Granted JPS586378U (en) | 1981-07-07 | 1981-07-07 | Structure of ground lead part of electronic equipment base |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS586378U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5552779U (en) * | 1978-10-05 | 1980-04-08 |
-
1981
- 1981-07-07 JP JP10019581U patent/JPS586378U/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5552779U (en) * | 1978-10-05 | 1980-04-08 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6217990Y2 (en) | 1987-05-08 |
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