JPS5789230A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5789230A
JPS5789230A JP55164559A JP16455980A JPS5789230A JP S5789230 A JPS5789230 A JP S5789230A JP 55164559 A JP55164559 A JP 55164559A JP 16455980 A JP16455980 A JP 16455980A JP S5789230 A JPS5789230 A JP S5789230A
Authority
JP
Japan
Prior art keywords
tub
resin
wire
pellet
lessen
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP55164559A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6248375B2 (online.php
Inventor
Kazuo Shimizu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP55164559A priority Critical patent/JPS5789230A/ja
Publication of JPS5789230A publication Critical patent/JPS5789230A/ja
Publication of JPS6248375B2 publication Critical patent/JPS6248375B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/50—
    • H10W72/07554—
    • H10W72/5449—
    • H10W72/932—
    • H10W74/00—
    • H10W90/756—

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP55164559A 1980-11-25 1980-11-25 Semiconductor device Granted JPS5789230A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55164559A JPS5789230A (en) 1980-11-25 1980-11-25 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55164559A JPS5789230A (en) 1980-11-25 1980-11-25 Semiconductor device

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP63194403A Division JPH01315149A (ja) 1988-08-05 1988-08-05 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPS5789230A true JPS5789230A (en) 1982-06-03
JPS6248375B2 JPS6248375B2 (online.php) 1987-10-13

Family

ID=15795458

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55164559A Granted JPS5789230A (en) 1980-11-25 1980-11-25 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5789230A (online.php)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5072279A (en) * 1990-10-29 1991-12-10 Delco Electronics Corporation Electrical interconnection having angular lead design
US5162265A (en) * 1990-10-29 1992-11-10 Delco Electronics Corporation Method of making an electrical interconnection having angular lead design
WO1994027320A1 (en) * 1993-05-07 1994-11-24 National Semiconductor Corporation Plastic encapsulated integrated circuit package and method of manufacturing the same
WO2001043205A1 (en) * 1999-12-09 2001-06-14 Rohm Co., Ltd. Light-emitting chip device with case and method of manufacture thereof

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5072279A (en) * 1990-10-29 1991-12-10 Delco Electronics Corporation Electrical interconnection having angular lead design
US5162265A (en) * 1990-10-29 1992-11-10 Delco Electronics Corporation Method of making an electrical interconnection having angular lead design
WO1994027320A1 (en) * 1993-05-07 1994-11-24 National Semiconductor Corporation Plastic encapsulated integrated circuit package and method of manufacturing the same
US5437095A (en) * 1993-05-07 1995-08-01 National Semiconductor Corporation Method of making plastic encapsulated integrated circuit package
WO2001043205A1 (en) * 1999-12-09 2001-06-14 Rohm Co., Ltd. Light-emitting chip device with case and method of manufacture thereof

Also Published As

Publication number Publication date
JPS6248375B2 (online.php) 1987-10-13

Similar Documents

Publication Publication Date Title
FR2635107B1 (fr) Composition de resine epoxy, et dispositif a semi-conducteurs encapsule avec cette composition
JPS5789230A (en) Semiconductor device
JPS5676542A (en) Resin-sealed semiconductor device
DE3482267D1 (de) Thermoplastisches harz mit hoher stoss- und waermefestigkeit.
JPS57176751A (en) Semiconductor device
JPS57187945A (en) Manufacture of semiconductor device
JPS52156560A (en) Semiconductor device and its production
FR2379910B1 (online.php)
JPS533165A (en) Wire bonding apparatus
JPS53105175A (en) Lead frame for resin sealing semiconductor device
JPS5788752A (en) Lead frame and semiconductor device prepared by using the same
JPS57211259A (en) Semiconductor device
JPS5258469A (en) Resin-molded type semiconductor device
JPS51129177A (en) Resin hook type semi conductor device
JPS5610950A (en) Lead wire for semiconductor device
JPS57148355A (en) Manufacture of semiconductor device
JPS55121657A (en) Manufacture of semiconductor device
JPS5723254A (en) Semiconductor device
JPS526083A (en) Production method of semiconductor device
JPS5414676A (en) Carrier tape and electronic parts using it
JPS57192055A (en) Semiconductor device and leadframe used for assembling said semiconductor
JPS57210649A (en) Semiconductor device and lead frame used for assembling the same
JPS5650545A (en) Resin molded type semiconductor device
JPS574149A (en) Lead frame for semiconductor device
JPS57211284A (en) Lead frame for semiconductor device