JPS5783056A - Manufacture of electrostatic type semicondutor device - Google Patents

Manufacture of electrostatic type semicondutor device

Info

Publication number
JPS5783056A
JPS5783056A JP15824880A JP15824880A JPS5783056A JP S5783056 A JPS5783056 A JP S5783056A JP 15824880 A JP15824880 A JP 15824880A JP 15824880 A JP15824880 A JP 15824880A JP S5783056 A JPS5783056 A JP S5783056A
Authority
JP
Japan
Prior art keywords
region
gate
main surface
epitaxial layer
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15824880A
Other languages
Japanese (ja)
Inventor
Akio Mimura
Saburo Oikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP15824880A priority Critical patent/JPS5783056A/en
Publication of JPS5783056A publication Critical patent/JPS5783056A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/70Bipolar devices
    • H01L29/72Transistor-type devices, i.e. able to continuously respond to applied control signals
    • H01L29/739Transistor-type devices, i.e. able to continuously respond to applied control signals controlled by field-effect, e.g. bipolar static induction transistors [BSIT]
    • H01L29/7391Gated diode structures
    • H01L29/7392Gated diode structures with PN junction gate, e.g. field controlled thyristors (FCTh), static induction thyristors (SITh)

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Thyristors (AREA)
  • Junction Field-Effect Transistors (AREA)

Abstract

PURPOSE:To improve the unsatisfactory withstand voltage and to increase the yielding rate of a high-powered element for the subject semicondutor device by a method wherein a gate region is formed on one main surface of a substrate, and after a cathode region has been formed by providing an epitaxial layer, the defective crystal section located in the vicinity of the gate is removed. CONSTITUTION:For example, after a number of P<+> gate regions 12 have been formed by diffusion on one main surface of the N<-> substrate and P<+> anode region has been formed by diffusion on the other main surface of the N<-> substrate, an N type epitaxial layer is grown on the gate side main surface. Then, an N<+> layer is diffused on a region 11, a selective etching is performed on the epitaxial layer on the circumference of a channel region 14, and an electrostatic conductor type thyristor is obtained. Then, the defective part A of the cathode gate junction 16 generated due to the defective crystal and the like on the epitaxial layer is detected and it is removed (or short-circuited and closed by injecting a P<+> impurity in the channel region 14b having the defective part A). Through these procedures, the poor withstand voltage in the element with large capacity can be improved and the yielding rate of the device can also be increased.
JP15824880A 1980-11-12 1980-11-12 Manufacture of electrostatic type semicondutor device Pending JPS5783056A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15824880A JPS5783056A (en) 1980-11-12 1980-11-12 Manufacture of electrostatic type semicondutor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15824880A JPS5783056A (en) 1980-11-12 1980-11-12 Manufacture of electrostatic type semicondutor device

Publications (1)

Publication Number Publication Date
JPS5783056A true JPS5783056A (en) 1982-05-24

Family

ID=15667482

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15824880A Pending JPS5783056A (en) 1980-11-12 1980-11-12 Manufacture of electrostatic type semicondutor device

Country Status (1)

Country Link
JP (1) JPS5783056A (en)

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