JPS5778416A - Thermosetting resin composition - Google Patents
Thermosetting resin compositionInfo
- Publication number
- JPS5778416A JPS5778416A JP15463980A JP15463980A JPS5778416A JP S5778416 A JPS5778416 A JP S5778416A JP 15463980 A JP15463980 A JP 15463980A JP 15463980 A JP15463980 A JP 15463980A JP S5778416 A JPS5778416 A JP S5778416A
- Authority
- JP
- Japan
- Prior art keywords
- carboxylic acid
- partially esterified
- anhydride
- thermosetting resin
- resin composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011342 resin composition Substances 0.000 title abstract 2
- 229920001187 thermosetting polymer Polymers 0.000 title abstract 2
- 150000001244 carboxylic acid anhydrides Chemical class 0.000 abstract 3
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 abstract 2
- 125000002723 alicyclic group Chemical group 0.000 abstract 2
- 125000001931 aliphatic group Chemical group 0.000 abstract 2
- -1 aromatic diol Chemical class 0.000 abstract 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 abstract 2
- 239000003822 epoxy resin Substances 0.000 abstract 2
- 229920000647 polyepoxide Polymers 0.000 abstract 2
- 150000008064 anhydrides Chemical class 0.000 abstract 1
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 abstract 1
- 239000003795 chemical substances by application Substances 0.000 abstract 1
- 238000005336 cracking Methods 0.000 abstract 1
- IFDVQVHZEKPUSC-UHFFFAOYSA-N cyclohex-3-ene-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCC=CC1C(O)=O IFDVQVHZEKPUSC-UHFFFAOYSA-N 0.000 abstract 1
- 238000006297 dehydration reaction Methods 0.000 abstract 1
- 150000002009 diols Chemical class 0.000 abstract 1
- 239000000203 mixture Substances 0.000 abstract 1
- UFDHBDMSHIXOKF-UHFFFAOYSA-N tetrahydrophthalic acid Natural products OC(=O)C1=C(C(O)=O)CCCC1 UFDHBDMSHIXOKF-UHFFFAOYSA-N 0.000 abstract 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15463980A JPS5778416A (en) | 1980-11-05 | 1980-11-05 | Thermosetting resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15463980A JPS5778416A (en) | 1980-11-05 | 1980-11-05 | Thermosetting resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5778416A true JPS5778416A (en) | 1982-05-17 |
| JPS6136846B2 JPS6136846B2 (enrdf_load_stackoverflow) | 1986-08-20 |
Family
ID=15588602
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15463980A Granted JPS5778416A (en) | 1980-11-05 | 1980-11-05 | Thermosetting resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5778416A (enrdf_load_stackoverflow) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6253327A (ja) * | 1985-08-31 | 1987-03-09 | Res Dev Corp Of Japan | 硬化性組成物 |
| JPS6287288A (ja) * | 1985-08-19 | 1987-04-21 | ピ−ピ−ジ−・インダストリ−ズ・インコ−ポレイテツド | 基材にコンポジツトフイルムを提供する方法 |
| JPS62212416A (ja) * | 1986-03-12 | 1987-09-18 | Res Dev Corp Of Japan | 架橋性重合体組成物 |
| JPS63159478A (ja) * | 1986-09-26 | 1988-07-02 | ユニオン・カーバイド・コーポレーシヨン | 改良された成形適性を有するエポキシ亜鉛リッチコーティング |
| JPH11302401A (ja) * | 1998-04-17 | 1999-11-02 | Matsushita Electric Works Ltd | エポキシ樹脂組成物およびこのエポキシ樹脂組成物を用いた絶縁基板 |
| JP2018095765A (ja) * | 2016-12-15 | 2018-06-21 | 新日本理化株式会社 | エポキシ樹脂組成物及びエポキシ薄膜硬化物 |
-
1980
- 1980-11-05 JP JP15463980A patent/JPS5778416A/ja active Granted
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6287288A (ja) * | 1985-08-19 | 1987-04-21 | ピ−ピ−ジ−・インダストリ−ズ・インコ−ポレイテツド | 基材にコンポジツトフイルムを提供する方法 |
| JPS6253327A (ja) * | 1985-08-31 | 1987-03-09 | Res Dev Corp Of Japan | 硬化性組成物 |
| JPS62212416A (ja) * | 1986-03-12 | 1987-09-18 | Res Dev Corp Of Japan | 架橋性重合体組成物 |
| JPS63159478A (ja) * | 1986-09-26 | 1988-07-02 | ユニオン・カーバイド・コーポレーシヨン | 改良された成形適性を有するエポキシ亜鉛リッチコーティング |
| JPH11302401A (ja) * | 1998-04-17 | 1999-11-02 | Matsushita Electric Works Ltd | エポキシ樹脂組成物およびこのエポキシ樹脂組成物を用いた絶縁基板 |
| JP2018095765A (ja) * | 2016-12-15 | 2018-06-21 | 新日本理化株式会社 | エポキシ樹脂組成物及びエポキシ薄膜硬化物 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6136846B2 (enrdf_load_stackoverflow) | 1986-08-20 |
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