JPS5773958A - Method of mounting semiconductor element - Google Patents

Method of mounting semiconductor element

Info

Publication number
JPS5773958A
JPS5773958A JP15096480A JP15096480A JPS5773958A JP S5773958 A JPS5773958 A JP S5773958A JP 15096480 A JP15096480 A JP 15096480A JP 15096480 A JP15096480 A JP 15096480A JP S5773958 A JPS5773958 A JP S5773958A
Authority
JP
Japan
Prior art keywords
base plate
receiving stand
electrodes
lead portions
heating head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15096480A
Other languages
Japanese (ja)
Inventor
Nobuo Ukon
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SEIKO KEIYO KOGYO KK
SEIKOO KEIYO KOGYO KK
SEIKOO KEIYOU KOGYO KK
Original Assignee
SEIKO KEIYO KOGYO KK
SEIKOO KEIYO KOGYO KK
SEIKOO KEIYOU KOGYO KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SEIKO KEIYO KOGYO KK, SEIKOO KEIYO KOGYO KK, SEIKOO KEIYOU KOGYO KK filed Critical SEIKO KEIYO KOGYO KK
Priority to JP15096480A priority Critical patent/JPS5773958A/en
Publication of JPS5773958A publication Critical patent/JPS5773958A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/291—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/83801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Abstract

PURPOSE:To reduce the number of steps in mounting process and to prevent the reduction of yield due to deformation of leads, thus permitting the lower cost, by a method wherein a vertically movable receiving stand bearing a base plate and an element thereon is raised up, lead portions of a substrate are aligned with electrodes of the element, and a heating head is lowered to be brought into press-contact therewith. CONSTITUTION:A heating head 14 and a receiving stand 13 are disposed above and below a circuit substrate 10, respectively, to be movable in the vertical direction. An element 16 is placed on the receiving stand 13 via a base plate 15 with its electrodes 16a looking upward. The base plate 15 comprises two layers the upper one of which is formed of thermoplastic resin 15a and the lower one of which is formed on thermosetting resin 15b of low thermal conductivity. Then, the receiving stand 13 is raised up and lead portions 12 of the substrate 10 are alighed with the element electrodes 16a, respectively. Thereafter, the heating head 14 is lowered to be brought into press- contact therewith, so that the lead portions are bonded to the electrdes. During this bonding process, the upper layer 15a of the base plate is softened and melted in order to secure the element 16. Subsequently, the element is sealed by resin 17. Two processes of bonding and securing can be performed in one step, so that the number of processes is reduced and deformation of the leads is prevented.
JP15096480A 1980-10-28 1980-10-28 Method of mounting semiconductor element Pending JPS5773958A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15096480A JPS5773958A (en) 1980-10-28 1980-10-28 Method of mounting semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15096480A JPS5773958A (en) 1980-10-28 1980-10-28 Method of mounting semiconductor element

Publications (1)

Publication Number Publication Date
JPS5773958A true JPS5773958A (en) 1982-05-08

Family

ID=15508280

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15096480A Pending JPS5773958A (en) 1980-10-28 1980-10-28 Method of mounting semiconductor element

Country Status (1)

Country Link
JP (1) JPS5773958A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0204102A2 (en) * 1985-06-03 1986-12-10 Motorola, Inc. Direct connection of lead frame having flexible, tapered leads and mechanical die support
US4942140A (en) * 1987-03-25 1990-07-17 Mitsubishi Denki Kabushiki Kaisha Method of packaging semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0204102A2 (en) * 1985-06-03 1986-12-10 Motorola, Inc. Direct connection of lead frame having flexible, tapered leads and mechanical die support
EP0204102A3 (en) * 1985-06-03 1987-11-19 Motorola, Inc. Direct connection of lead frame having flexible, tapered leads and mechanical die support
US4942140A (en) * 1987-03-25 1990-07-17 Mitsubishi Denki Kabushiki Kaisha Method of packaging semiconductor device

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