JPS5773947A - Formation of hybrid ic module - Google Patents

Formation of hybrid ic module

Info

Publication number
JPS5773947A
JPS5773947A JP14941580A JP14941580A JPS5773947A JP S5773947 A JPS5773947 A JP S5773947A JP 14941580 A JP14941580 A JP 14941580A JP 14941580 A JP14941580 A JP 14941580A JP S5773947 A JPS5773947 A JP S5773947A
Authority
JP
Japan
Prior art keywords
solder
chip
fusing point
substrate
joined
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14941580A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6122878B2 (enrdf_load_stackoverflow
Inventor
Masaru Sakaguchi
Ichiro Ishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP14941580A priority Critical patent/JPS5773947A/ja
Publication of JPS5773947A publication Critical patent/JPS5773947A/ja
Publication of JPS6122878B2 publication Critical patent/JPS6122878B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13—Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001—Core members of the bump connector
    • H01L2224/13099—Material
    • H01L2224/131—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H01L2224/13101—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of less than 400°C
    • H01L2224/13111—Tin [Sn] as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0105—Tin [Sn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19041—Component type being a capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901—Structure
    • H01L2924/1904—Component type
    • H01L2924/19043—Component type being a resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)
JP14941580A 1980-10-27 1980-10-27 Formation of hybrid ic module Granted JPS5773947A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14941580A JPS5773947A (en) 1980-10-27 1980-10-27 Formation of hybrid ic module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14941580A JPS5773947A (en) 1980-10-27 1980-10-27 Formation of hybrid ic module

Publications (2)

Publication Number Publication Date
JPS5773947A true JPS5773947A (en) 1982-05-08
JPS6122878B2 JPS6122878B2 (enrdf_load_stackoverflow) 1986-06-03

Family

ID=15474611

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14941580A Granted JPS5773947A (en) 1980-10-27 1980-10-27 Formation of hybrid ic module

Country Status (1)

Country Link
JP (1) JPS5773947A (enrdf_load_stackoverflow)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6065594A (ja) * 1983-09-20 1985-04-15 株式会社富士通ゼネラル 回路基板の接続方法
JPS63152136A (ja) * 1986-12-17 1988-06-24 Fuji Electric Co Ltd 半導体チツプの実装方法
JPS6428931A (en) * 1987-07-24 1989-01-31 Nec Corp Semiconductor device
EP1289013A1 (en) * 2001-08-15 2003-03-05 Datamars SA A method for applying a semiconductor chip to a substrate and an assembly obtained thereby
EP1294217A4 (en) * 2000-06-15 2004-10-13 Murata Manufacturing Co METHOD FOR ASSEMBLING AN ELECTRONIC COMPONENT

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6065594A (ja) * 1983-09-20 1985-04-15 株式会社富士通ゼネラル 回路基板の接続方法
JPS63152136A (ja) * 1986-12-17 1988-06-24 Fuji Electric Co Ltd 半導体チツプの実装方法
JPS6428931A (en) * 1987-07-24 1989-01-31 Nec Corp Semiconductor device
EP1294217A4 (en) * 2000-06-15 2004-10-13 Murata Manufacturing Co METHOD FOR ASSEMBLING AN ELECTRONIC COMPONENT
EP1289013A1 (en) * 2001-08-15 2003-03-05 Datamars SA A method for applying a semiconductor chip to a substrate and an assembly obtained thereby

Also Published As

Publication number Publication date
JPS6122878B2 (enrdf_load_stackoverflow) 1986-06-03

Similar Documents

Publication Publication Date Title
KR100398716B1 (ko) 반도체 모듈 및 반도체 장치를 접속한 회로 기판
US6402881B1 (en) Process for electrically interconnecting electrodes
DE69832324T2 (de) Herstellungsverfahren für einen Halbleiter
KR960013143A (ko) 합금 납땜 접속 조립체 및 그 접속 방법
JPS57210638A (en) Hybrid integrated circuit
JPH06103703B2 (ja) 半田付け方法
US3665590A (en) Semiconductor flip-chip soldering method
JPH09139559A (ja) 回路基板の接続構造
EP1229583A4 (en) SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
JPH10303473A (ja) 多段電子冷却装置及びその製造方法
US20180315725A1 (en) Package structure having bump with protective anti-oxidation coating
GB1444997A (en) Method of soldering a circuit component to a substrate
US4760948A (en) Leadless chip carrier assembly and method
FR2392758A1 (fr) Procede de soudage sur couches d'or
JPS5773947A (en) Formation of hybrid ic module
JP3867768B2 (ja) ハンダ付け方法及びハンダ付け装置並びに電子回路モジュールの製造方法及び製造装置
AU653945B2 (en) Attaching integrated circuits to circuit boards
US3535486A (en) Electrical printed circuit assemblies
JPS617692A (ja) 導体ピンの固着方法および導体ピン固着のプリント配線板
JPS62279645A (ja) はんだ接続方法
JPS5512762A (en) Glass sealing type semiconductor device manufacturing method
JPH0783929B2 (ja) ハンダ付け方法
JPS6491118A (en) Liquid crystal display element mounting flip chip
US5537739A (en) Method for electoconductively connecting contacts
JPS6444054A (en) Manufacture of hybrid integrated circuit substrate