JPS5769767A - Resin sealed type semiconductor device - Google Patents

Resin sealed type semiconductor device

Info

Publication number
JPS5769767A
JPS5769767A JP55146421A JP14642180A JPS5769767A JP S5769767 A JPS5769767 A JP S5769767A JP 55146421 A JP55146421 A JP 55146421A JP 14642180 A JP14642180 A JP 14642180A JP S5769767 A JPS5769767 A JP S5769767A
Authority
JP
Japan
Prior art keywords
semiconductor element
semiconductor device
resin
bonding wires
leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP55146421A
Other languages
English (en)
Inventor
Toru Nomura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP55146421A priority Critical patent/JPS5769767A/ja
Publication of JPS5769767A publication Critical patent/JPS5769767A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3135—Double encapsulation or coating and encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
JP55146421A 1980-10-20 1980-10-20 Resin sealed type semiconductor device Pending JPS5769767A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55146421A JPS5769767A (en) 1980-10-20 1980-10-20 Resin sealed type semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55146421A JPS5769767A (en) 1980-10-20 1980-10-20 Resin sealed type semiconductor device

Publications (1)

Publication Number Publication Date
JPS5769767A true JPS5769767A (en) 1982-04-28

Family

ID=15407301

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55146421A Pending JPS5769767A (en) 1980-10-20 1980-10-20 Resin sealed type semiconductor device

Country Status (1)

Country Link
JP (1) JPS5769767A (ja)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0102058A2 (de) * 1982-08-30 1984-03-07 Siemens Aktiengesellschaft Halbleiterbauelement mit Druckkontakt
JPS60208846A (ja) * 1984-04-02 1985-10-21 Oki Electric Ind Co Ltd 耐熱プラスチツクｉｃ
US4821148A (en) * 1985-06-14 1989-04-11 Hitachi, Ltd. Resin packaged semiconductor device having a protective layer made of a metal-organic matter compound
JP2009206222A (ja) * 2008-02-27 2009-09-10 Stanley Electric Co Ltd 半導体発光装置
JP2019009171A (ja) * 2017-06-21 2019-01-17 スタンレー電気株式会社 半導体装置
WO2020240790A1 (ja) * 2019-05-30 2020-12-03 三菱電機株式会社 パワー半導体モジュール及び電力変換装置

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0102058A2 (de) * 1982-08-30 1984-03-07 Siemens Aktiengesellschaft Halbleiterbauelement mit Druckkontakt
EP0102058A3 (de) * 1982-08-30 1985-06-19 Siemens Aktiengesellschaft Halbleiterbauelement mit Druckkontakt
JPS60208846A (ja) * 1984-04-02 1985-10-21 Oki Electric Ind Co Ltd 耐熱プラスチツクｉｃ
US4821148A (en) * 1985-06-14 1989-04-11 Hitachi, Ltd. Resin packaged semiconductor device having a protective layer made of a metal-organic matter compound
JP2009206222A (ja) * 2008-02-27 2009-09-10 Stanley Electric Co Ltd 半導体発光装置
JP2019009171A (ja) * 2017-06-21 2019-01-17 スタンレー電気株式会社 半導体装置
WO2020240790A1 (ja) * 2019-05-30 2020-12-03 三菱電機株式会社 パワー半導体モジュール及び電力変換装置
JPWO2020240790A1 (ja) * 2019-05-30 2020-12-03

Similar Documents

Publication Publication Date Title
JPS5745259A (en) Resin sealing type semiconductor device
IE831279L (en) Resin-sealed semiconductor devices
JPS56104459A (en) Semiconductor device
JPS5769767A (en) Resin sealed type semiconductor device
IE822564L (en) Fabrication a semiconductor device having a phosphosilicate glass layer
JPS57210646A (en) Resin-sealed semiconductor device
JPS5710951A (en) Semiconductor device
JP2970211B2 (ja) 樹脂封止型半導体装置
JPH08204066A (ja) 半導体装置
JPS55138241A (en) Sealing structure for semiconductor device
JPS5795651A (en) Semiconductor device
JPS57173948A (en) Manufacture of semiconductor device
FR2309979A1 (fr) Circuit integre a semi-conducteurs comportant des connexions de fils electriques proteges
JPS642399A (en) Semiconductor device
JPS5521175A (en) Semiconductor device
JPS5480679A (en) Manufacture for semiconductor device
JPS56105670A (en) Semiconductor device
JPS641262A (en) Electronic device and manufacture thereof
JPS57136339A (en) Resin sealing type semiconductor device
JPS5588358A (en) Resin-sealed semiconductor device
JPS6482652A (en) Manufacture of semiconductor device
JPS6451642A (en) Sealing structure of semiconductor
JPS57139949A (en) Resin sealing type semiconductor device
JPS57145346A (en) Resin-sealed semiconductor device
JPS57154857A (en) Semiconductor integrated circuit device