JPS5768061A - Lead material for semiconductor device - Google Patents

Lead material for semiconductor device

Info

Publication number
JPS5768061A
JPS5768061A JP55143908A JP14390880A JPS5768061A JP S5768061 A JPS5768061 A JP S5768061A JP 55143908 A JP55143908 A JP 55143908A JP 14390880 A JP14390880 A JP 14390880A JP S5768061 A JPS5768061 A JP S5768061A
Authority
JP
Japan
Prior art keywords
strength
heat resistance
elements
alloy
contained
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP55143908A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6332854B2 (cs
Inventor
Kiichi Akasaka
Kozo Yamato
Shigeo Shinozaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Priority to JP55143908A priority Critical patent/JPS5768061A/ja
Publication of JPS5768061A publication Critical patent/JPS5768061A/ja
Publication of JPS6332854B2 publication Critical patent/JPS6332854B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49579—Lead-frames or other flat leads characterised by the materials of the lead frames or layers thereon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Conductive Materials (AREA)
JP55143908A 1980-10-15 1980-10-15 Lead material for semiconductor device Granted JPS5768061A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55143908A JPS5768061A (en) 1980-10-15 1980-10-15 Lead material for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55143908A JPS5768061A (en) 1980-10-15 1980-10-15 Lead material for semiconductor device

Publications (2)

Publication Number Publication Date
JPS5768061A true JPS5768061A (en) 1982-04-26
JPS6332854B2 JPS6332854B2 (cs) 1988-07-01

Family

ID=15349871

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55143908A Granted JPS5768061A (en) 1980-10-15 1980-10-15 Lead material for semiconductor device

Country Status (1)

Country Link
JP (1) JPS5768061A (cs)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59140341A (ja) * 1983-01-29 1984-08-11 Furukawa Electric Co Ltd:The リ−ドフレ−ム用銅合金
JPS605550A (ja) * 1983-06-24 1985-01-12 Toshiba Corp 電子部品
US5853505A (en) * 1997-04-18 1998-12-29 Olin Corporation Iron modified tin brass
US5882442A (en) * 1995-10-20 1999-03-16 Olin Corporation Iron modified phosphor-bronze
US6132528A (en) * 1997-04-18 2000-10-17 Olin Corporation Iron modified tin brass

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06304889A (ja) * 1993-04-21 1994-11-01 Nakatetsuku Kk 吸着ユニット及びこれを用いたキャップ箱詰め装置

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5424811A (en) * 1977-07-27 1979-02-24 Hitachi Cable Ltd Copper alloy for lead conductor of semiconductor device
JPS5426219A (en) * 1977-07-30 1979-02-27 Furukawa Electric Co Ltd:The Electric conductive copper alloy of superior solderability

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5424811A (en) * 1977-07-27 1979-02-24 Hitachi Cable Ltd Copper alloy for lead conductor of semiconductor device
JPS5426219A (en) * 1977-07-30 1979-02-27 Furukawa Electric Co Ltd:The Electric conductive copper alloy of superior solderability

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59140341A (ja) * 1983-01-29 1984-08-11 Furukawa Electric Co Ltd:The リ−ドフレ−ム用銅合金
JPS605550A (ja) * 1983-06-24 1985-01-12 Toshiba Corp 電子部品
US5882442A (en) * 1995-10-20 1999-03-16 Olin Corporation Iron modified phosphor-bronze
US5853505A (en) * 1997-04-18 1998-12-29 Olin Corporation Iron modified tin brass
US6132528A (en) * 1997-04-18 2000-10-17 Olin Corporation Iron modified tin brass

Also Published As

Publication number Publication date
JPS6332854B2 (cs) 1988-07-01

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