JPS5763833A - Fabrication of semicondutor device - Google Patents

Fabrication of semicondutor device

Info

Publication number
JPS5763833A
JPS5763833A JP13937380A JP13937380A JPS5763833A JP S5763833 A JPS5763833 A JP S5763833A JP 13937380 A JP13937380 A JP 13937380A JP 13937380 A JP13937380 A JP 13937380A JP S5763833 A JPS5763833 A JP S5763833A
Authority
JP
Japan
Prior art keywords
lead frame
wire bonding
atmosphere
bonding process
during
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13937380A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6410092B2 (enExample
Inventor
Toshihiro Kato
Kazuhide Sato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP13937380A priority Critical patent/JPS5763833A/ja
Publication of JPS5763833A publication Critical patent/JPS5763833A/ja
Publication of JPS6410092B2 publication Critical patent/JPS6410092B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W95/00—Packaging processes not covered by the other groups of this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
JP13937380A 1980-10-07 1980-10-07 Fabrication of semicondutor device Granted JPS5763833A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13937380A JPS5763833A (en) 1980-10-07 1980-10-07 Fabrication of semicondutor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13937380A JPS5763833A (en) 1980-10-07 1980-10-07 Fabrication of semicondutor device

Publications (2)

Publication Number Publication Date
JPS5763833A true JPS5763833A (en) 1982-04-17
JPS6410092B2 JPS6410092B2 (enExample) 1989-02-21

Family

ID=15243805

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13937380A Granted JPS5763833A (en) 1980-10-07 1980-10-07 Fabrication of semicondutor device

Country Status (1)

Country Link
JP (1) JPS5763833A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63314839A (ja) * 1987-06-18 1988-12-22 Mitsubishi Electric Corp 半導体製造装置
JPS63314837A (ja) * 1987-06-18 1988-12-22 Mitsubishi Electric Corp 半導体製造装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63314839A (ja) * 1987-06-18 1988-12-22 Mitsubishi Electric Corp 半導体製造装置
JPS63314837A (ja) * 1987-06-18 1988-12-22 Mitsubishi Electric Corp 半導体製造装置

Also Published As

Publication number Publication date
JPS6410092B2 (enExample) 1989-02-21

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