JPS5762569A - Cooling type photoelectric converter - Google Patents

Cooling type photoelectric converter

Info

Publication number
JPS5762569A
JPS5762569A JP55137883A JP13788380A JPS5762569A JP S5762569 A JPS5762569 A JP S5762569A JP 55137883 A JP55137883 A JP 55137883A JP 13788380 A JP13788380 A JP 13788380A JP S5762569 A JPS5762569 A JP S5762569A
Authority
JP
Japan
Prior art keywords
base
cooling
infrared detector
photoelectric converter
type photoelectric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP55137883A
Other languages
Japanese (ja)
Inventor
Isao Arakawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP55137883A priority Critical patent/JPS5762569A/en
Publication of JPS5762569A publication Critical patent/JPS5762569A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/024—Arrangements for cooling, heating, ventilating or temperature compensation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Abstract

PURPOSE:To enhance the cooling efficiency of a cooling type photoelectric converter by mounting pin electrodes on a support plate for supporting infrared detector and inserting the pin electrodes into a socket provided partly in an inner cylinder, thereby increasing the vacuum degree. CONSTITUTION:An infrared detector 1 is placed fixedly on a support base 2. The base has side walls 2a, and electrode pins 4a, 4b are mounted on the outside. The electrode pins are electrically connected to the detector via metallized layers 5a, 5b and bonding pads 6a, 6b on the base. This structure A is contained in a double- walled cooling container, and is inserted fixedly into the pin electrode inserting inlet of a socket 9 mounted on a cooling base 8 in an inner cylinder B. In this manner, it can be assembled in vacuum, thereby eliminating the contamination, performing mounting in high vacuum degree and obtaining the infrared detector of high quality.
JP55137883A 1980-09-30 1980-09-30 Cooling type photoelectric converter Pending JPS5762569A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55137883A JPS5762569A (en) 1980-09-30 1980-09-30 Cooling type photoelectric converter

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55137883A JPS5762569A (en) 1980-09-30 1980-09-30 Cooling type photoelectric converter

Publications (1)

Publication Number Publication Date
JPS5762569A true JPS5762569A (en) 1982-04-15

Family

ID=15208907

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55137883A Pending JPS5762569A (en) 1980-09-30 1980-09-30 Cooling type photoelectric converter

Country Status (1)

Country Link
JP (1) JPS5762569A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63153868A (en) * 1986-12-17 1988-06-27 Fujitsu Ltd Photoelectric transducer
US4880979A (en) * 1987-02-27 1989-11-14 Mitisubishi Denki Kabushiki Kaisha Infrared ray detector
FR2651315A1 (en) * 1989-08-22 1991-03-01 Detecteurs Infra Rouges Ste Fs INFRARED DETECTION DEVICE.

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63153868A (en) * 1986-12-17 1988-06-27 Fujitsu Ltd Photoelectric transducer
US4880979A (en) * 1987-02-27 1989-11-14 Mitisubishi Denki Kabushiki Kaisha Infrared ray detector
FR2651315A1 (en) * 1989-08-22 1991-03-01 Detecteurs Infra Rouges Ste Fs INFRARED DETECTION DEVICE.
US5103097A (en) * 1989-08-22 1992-04-07 Societe Francaise De Detecteurs Infrarouges - Sofradir Infrared detection device

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