JPS5759368A - Method of removing flash on lead frame and cutting dam - Google Patents
Method of removing flash on lead frame and cutting damInfo
- Publication number
- JPS5759368A JPS5759368A JP55134426A JP13442680A JPS5759368A JP S5759368 A JPS5759368 A JP S5759368A JP 55134426 A JP55134426 A JP 55134426A JP 13442680 A JP13442680 A JP 13442680A JP S5759368 A JPS5759368 A JP S5759368A
- Authority
- JP
- Japan
- Prior art keywords
- dam
- lead frame
- laser light
- mask
- flash
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 abstract 3
- 229920005989 resin Polymers 0.000 abstract 3
- 239000003082 abrasive agent Substances 0.000 abstract 1
- 230000001678 irradiating effect Effects 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
- H01L21/4835—Cleaning, e.g. removing of solder
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55134426A JPS5759368A (en) | 1980-09-29 | 1980-09-29 | Method of removing flash on lead frame and cutting dam |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP55134426A JPS5759368A (en) | 1980-09-29 | 1980-09-29 | Method of removing flash on lead frame and cutting dam |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5759368A true JPS5759368A (en) | 1982-04-09 |
Family
ID=15128096
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP55134426A Pending JPS5759368A (en) | 1980-09-29 | 1980-09-29 | Method of removing flash on lead frame and cutting dam |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5759368A (ja) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6189654A (ja) * | 1984-10-04 | 1986-05-07 | アマダ、エンジニアリング アンド サ−ビス カンパニ− インコ−ポレ−テツド | デユアル・インライン・パツケ−ジ形半導体加工装置 |
| JPS63500062A (ja) * | 1985-06-11 | 1988-01-07 | アメリカン テレフオン アンド テレグラフ カムパニ− | リ−ドフレ−ムのばり取り |
| JPS6332957A (ja) * | 1986-07-25 | 1988-02-12 | Matsushita Electronics Corp | 半導体装置の製造方法 |
| JPH02143552A (ja) * | 1988-11-25 | 1990-06-01 | Nec Corp | 樹脂封止型半導体装置の製造方法 |
-
1980
- 1980-09-29 JP JP55134426A patent/JPS5759368A/ja active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6189654A (ja) * | 1984-10-04 | 1986-05-07 | アマダ、エンジニアリング アンド サ−ビス カンパニ− インコ−ポレ−テツド | デユアル・インライン・パツケ−ジ形半導体加工装置 |
| JPS63500062A (ja) * | 1985-06-11 | 1988-01-07 | アメリカン テレフオン アンド テレグラフ カムパニ− | リ−ドフレ−ムのばり取り |
| JPS6332957A (ja) * | 1986-07-25 | 1988-02-12 | Matsushita Electronics Corp | 半導体装置の製造方法 |
| JPH02143552A (ja) * | 1988-11-25 | 1990-06-01 | Nec Corp | 樹脂封止型半導体装置の製造方法 |
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