JPS5759341A - Automatic bonding method for device - Google Patents

Automatic bonding method for device

Info

Publication number
JPS5759341A
JPS5759341A JP55134839A JP13483980A JPS5759341A JP S5759341 A JPS5759341 A JP S5759341A JP 55134839 A JP55134839 A JP 55134839A JP 13483980 A JP13483980 A JP 13483980A JP S5759341 A JPS5759341 A JP S5759341A
Authority
JP
Japan
Prior art keywords
devices
wiring substrate
tapes
inspected
coded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP55134839A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6216540B2 (cg-RX-API-DMAC10.html
Inventor
Yuichi Yoshida
Yuji Matsuda
Masaru Iwasaki
Takashi Nukui
Shigeo Nakatake
Katsuteru Awane
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sharp Corp
Original Assignee
Sharp Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sharp Corp filed Critical Sharp Corp
Priority to JP55134839A priority Critical patent/JPS5759341A/ja
Publication of JPS5759341A publication Critical patent/JPS5759341A/ja
Publication of JPS6216540B2 publication Critical patent/JPS6216540B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/0711—
    • H10W72/701—

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Wire Bonding (AREA)
JP55134839A 1980-09-26 1980-09-26 Automatic bonding method for device Granted JPS5759341A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55134839A JPS5759341A (en) 1980-09-26 1980-09-26 Automatic bonding method for device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55134839A JPS5759341A (en) 1980-09-26 1980-09-26 Automatic bonding method for device

Publications (2)

Publication Number Publication Date
JPS5759341A true JPS5759341A (en) 1982-04-09
JPS6216540B2 JPS6216540B2 (cg-RX-API-DMAC10.html) 1987-04-13

Family

ID=15137662

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55134839A Granted JPS5759341A (en) 1980-09-26 1980-09-26 Automatic bonding method for device

Country Status (1)

Country Link
JP (1) JPS5759341A (cg-RX-API-DMAC10.html)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63173670A (ja) * 1987-01-13 1988-07-18 Alps Electric Co Ltd 光書き込みヘッド
US5542600A (en) * 1991-11-07 1996-08-06 Omron Corporation Automatic soldering apparatus, apparatus and method for teaching same, soldering inspection apparatus and method, and apparatus and method for automatically correcting soldering

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63173670A (ja) * 1987-01-13 1988-07-18 Alps Electric Co Ltd 光書き込みヘッド
US5542600A (en) * 1991-11-07 1996-08-06 Omron Corporation Automatic soldering apparatus, apparatus and method for teaching same, soldering inspection apparatus and method, and apparatus and method for automatically correcting soldering

Also Published As

Publication number Publication date
JPS6216540B2 (cg-RX-API-DMAC10.html) 1987-04-13

Similar Documents

Publication Publication Date Title
DE3475994D1 (en) Method of tape-automated bonding
GB2076223B (en) A carrier element for an integrated circuit chip
EP0130207A4 (en) SEMICONDUCTOR CHIP PACKAGE.
GB2088635B (en) Encapsulation for semiconductor integrated circuit chip
GB2077036B (en) Multi-layer ceramic package for semiconductor chip
JPS53149763A (en) Mounting method of semiconductor integrate circuit
EP0473796A4 (en) Semiconductor device having a plurality of chips
DE3852291D1 (de) Automatische Bandmontagen-Packung für einen Halbleiterchip mit Entkupplung.
KR850004353A (ko) 반도체 집적회로 장치의 제조방법
JPS56125864A (en) Device for bonding tape to and testing integrated circuit chip and method therefor
DE3278844D1 (en) A semiconductor device having a leadless chip carrier
DE3370407D1 (en) Package for a semiconductor chip with lead terminals
DE69206331D1 (de) Klebeband zum Befestigen von Halbleiterplättchen.
JPS5759341A (en) Automatic bonding method for device
DE3165345D1 (en) Method for manufacturing a semiconductor integrated circuit device
DE3264336D1 (en) Contact pad for semiconductor chips
JPS57102063A (en) Lead-tape
JPS5745263A (en) Package for semiconductor device
JPS5691439A (en) Method and device for bonding pellet
JPS5758332A (en) Manufacture of semiconductor device
KR860001486A (ko) 칩온칩(chip on chip)형 반도체 집적회로
DE3175776D1 (en) Semiconductor memory chip, and a memory device including such chips
JPS5443678A (en) Semiconductor element bonding method and its bonding unit
JPS5553433A (en) Manufacture of semiconductor device
EP0116927A3 (en) An interconnection change pad for use on a ceramic substrate receiving integrated circuit chips