JPS5753989A - Photo semiconductor device - Google Patents

Photo semiconductor device

Info

Publication number
JPS5753989A
JPS5753989A JP12990080A JP12990080A JPS5753989A JP S5753989 A JPS5753989 A JP S5753989A JP 12990080 A JP12990080 A JP 12990080A JP 12990080 A JP12990080 A JP 12990080A JP S5753989 A JPS5753989 A JP S5753989A
Authority
JP
Japan
Prior art keywords
transparent ball
led
light emitting
fixed
terminal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12990080A
Other languages
Japanese (ja)
Inventor
Osamu Hasegawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP12990080A priority Critical patent/JPS5753989A/en
Publication of JPS5753989A publication Critical patent/JPS5753989A/en
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4248—Feed-through connections for the hermetical passage of fibres through a package wall
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909—Post-treatment of the connector or wire bonding area
    • H01L2224/8592—Applying permanent coating, e.g. protective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58—Optical field-shaping elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)

Abstract

PURPOSE:To improve directional property of a light emitting or light receiving element by positioning a transparent ball with a plurality of thin wires which are disposed on a photo semiconductor element. CONSTITUTION:A terminal 33 is fixed to a metal stem 31 using a glass material 32, the terminal 33 is connected by welding, and a LED40 is fixed at the center of the stem facing the negative electrode's 15 side of a light emitting surface outward. Continuously connection 34 between the electrode 15 and the terminal 33 is performed, and a lead wire 35 is fixed. A spacing between lead wires is taken to be a little smaller than a diameter of a transparent ball 50. A transparent ball 50 is placed on the LED40 and positioned by means of support of lead wires 34, 35, so other mechanical support is unnecessary. The spacing between the LED and the transparent ball is taken in correspondence with refractive indices of the LED, resin and the transparent ball and a light emitting region is placed at the focus of the optical system. The device is completed through filling and fixing the space between the light emitting surface of the LED and the transparent ball with epoxy family resin 36 and sealing an optical fiber 37 hermetically by a fixed cap 39. Consequently the transparent ball can be easily adjusted by thin wires so that its center may coincide the optical axis of the LED, and a device of high light transmitting efficiency is obtained.
JP12990080A 1980-09-17 1980-09-17 Photo semiconductor device Pending JPS5753989A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12990080A JPS5753989A (en) 1980-09-17 1980-09-17 Photo semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12990080A JPS5753989A (en) 1980-09-17 1980-09-17 Photo semiconductor device

Publications (1)

Publication Number Publication Date
JPS5753989A true JPS5753989A (en) 1982-03-31

Family

ID=15021148

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12990080A Pending JPS5753989A (en) 1980-09-17 1980-09-17 Photo semiconductor device

Country Status (1)

Country Link
JP (1) JPS5753989A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4841344A (en) * 1985-09-13 1989-06-20 Siemens Atiengesellschaft Light-emitting-diode (LED) with spherical lens

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4841344A (en) * 1985-09-13 1989-06-20 Siemens Atiengesellschaft Light-emitting-diode (LED) with spherical lens

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