JPS6260277A - Semiconductor light emitting device - Google Patents
Semiconductor light emitting deviceInfo
- Publication number
- JPS6260277A JPS6260277A JP60200024A JP20002485A JPS6260277A JP S6260277 A JPS6260277 A JP S6260277A JP 60200024 A JP60200024 A JP 60200024A JP 20002485 A JP20002485 A JP 20002485A JP S6260277 A JPS6260277 A JP S6260277A
- Authority
- JP
- Japan
- Prior art keywords
- light
- optical fiber
- lens
- light emitting
- led chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Optical Couplings Of Light Guides (AREA)
- Led Device Packages (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の技術分野〕
本発明は半導体発光装置に関し、特に光通信用光源に使
用される発光ダイオードランプの改良に係る。DETAILED DESCRIPTION OF THE INVENTION [Technical Field of the Invention] The present invention relates to a semiconductor light emitting device, and particularly to an improvement in a light emitting diode lamp used as a light source for optical communications.
［発明の技術的背景〕
第２図は光通信用光源として用いられている従来の発光
ダイオードランプ（以下ＬＥＤランプという）の断面図
である。同図において、１はステムである。該ステムに
は絶縁物層２によりステムから電気的に絶縁されたリー
ド３１と、ステム１に電気的に接続されたリード３２が
設けられている。前記ステム１上には面発光型のＬＥＤ
チップ４がダイボンディングされ、該ＬＥＤチップの表
面に形成された電極はボンディングワイヤ５を介して前
記リード３１に接続されている。そして、ＬＥＤチップ
４の上には、エポキシ樹脂等により球レンズ７が接着固
定されている。[Technical Background of the Invention] FIG. 2 is a sectional view of a conventional light emitting diode lamp (hereinafter referred to as an LED lamp) used as a light source for optical communication. In the figure, 1 is a stem. The stem is provided with a lead 31 electrically insulated from the stem by the insulating layer 2 and a lead 32 electrically connected to the stem 1. A surface-emitting LED is mounted on the stem 1.
A chip 4 is die-bonded, and electrodes formed on the surface of the LED chip are connected to the leads 31 via bonding wires 5. A ball lens 7 is adhesively fixed onto the LED chip 4 using epoxy resin or the like.
上記のＬＥＤランプにおいて、チップ１の表面に球レン
ズ７が固定されているのは、面発光型のＬＥＤチップ１
から光を有効に光フアイバー内に入射させるためである
。In the above LED lamp, the ball lens 7 is fixed to the surface of the chip 1 because it is a surface emitting type LED chip 1.
This is to allow light to enter the optical fiber effectively.
一般に球レンズの焦点は球の表面近傍にあるため、上記
従来のＬＥＤランプには次のような問題がある。Since the focal point of a spherical lens is generally located near the surface of the sphere, the conventional LED lamp described above has the following problems.
即ち、ＬＥＤチップ４の発光面が球レンズ７に対して充
分に小さければチップ４がらの光は平行光になるが、実
際のレンズ径は発光径の２〜３倍に過ぎないため光は広
がってしまう。その結果、光ファイバーとの結合効率が
悪くなってしまう。That is, if the light emitting surface of the LED chip 4 is sufficiently small compared to the ball lens 7, the light from the chip 4 will become parallel light, but since the actual lens diameter is only 2 to 3 times the light emitting diameter, the light will spread out. I end up. As a result, the coupling efficiency with the optical fiber deteriorates.
本発明は上記事情に鑑みてなされたもので、光を高効率
で光ファイバーに結合することができる発光半導体装置
を提供するものである。The present invention has been made in view of the above circumstances, and provides a light emitting semiconductor device that can couple light to an optical fiber with high efficiency.
既述のように、球レンズを用いたＬＥＤランプの場合、
発光面が理想的な点光源であれば光を平行光とすること
が可能であるが、実際には発光面の大きさはレンズに対
して充分に小さいとは言えないことが多い。そのため、
発光面を焦点近傍に設ｆｆ しても光を充分に絞ること
ができず、むしろ焦点よりも遠くに発光面を設置した方
が一定の有限な面積に入射する光量を多くすることがで
きる。As mentioned above, in the case of an LED lamp using a ball lens,
If the light emitting surface is an ideal point light source, it is possible to convert the light into parallel light; however, in reality, the size of the light emitting surface is often not sufficiently small compared to the lens. Therefore,
Even if the light-emitting surface is set near the focal point, the light cannot be focused sufficiently; rather, the amount of light incident on a certain finite area can be increased by setting the light-emitting surface farther away than the focal point.
そこで、本発明ではＬＥＤチップと′球レンズとの間に
光透過性の板を介在させて発光面をレンズ焦点よりも遠
くに設置し、光を有限な距離で絞ると共にその絞られた
位置に光ファイバーを設置することによって、光を効率
良く光ファイバーに結合することとした。Therefore, in the present invention, a light-transmitting plate is interposed between the LED chip and the spherical lens, and the light-emitting surface is placed farther than the focal point of the lens. By installing optical fibers, we decided to efficiently couple light into the optical fibers.
即ち、本発明による発光半導体装置は、ステム上にダイ
ボンディングされ且つワイヤボンディングされた発光ダ
イオードチップの上に、透光性の板を介在させて球レン
ズを接着したことを特徴とするものである。That is, the light-emitting semiconductor device according to the present invention is characterized in that a ball lens is bonded to a light-emitting diode chip that is die-bonded and wire-bonded onto a stem, with a light-transmitting plate interposed therebetween. .
第１図は本発明の一実施例になる光通信用ＬＥＤランプ
の断面図である。同図において、１は金メッキを施した
ステム、３１は絶縁物層２によりステムから電気的に絶
縁されたリード、３２はステムに電気的に接続されたリ
ードである。ステム４上にはＬＥＤチップ４がダイボン
ディングされ、該ＬＥＤチップの表面に形成された電極
はボンディングワイヤ５を介して前記リード３１に接続
されている。そして、この実施例ではＬＥＤチップ６の
上にエポキシ樹脂等の接着剤層８を介して屈折率約１．
５の透明なガラス板９が接着固定され、該ガラス板９の
上にエポキシ樹脂層６を介して屈折率約１．５ 、ｒ−
１００ｐｙａの球レンズ７が接着固定されている。FIG. 1 is a sectional view of an LED lamp for optical communication according to an embodiment of the present invention. In the figure, 1 is a gold-plated stem, 31 is a lead electrically insulated from the stem by an insulating layer 2, and 32 is a lead electrically connected to the stem. An LED chip 4 is die-bonded onto the stem 4, and electrodes formed on the surface of the LED chip are connected to the leads 31 via bonding wires 5. In this embodiment, an adhesive layer 8 such as epoxy resin is placed on the LED chip 6 with a refractive index of about 1.
A transparent glass plate 9 with a refractive index of about 1.5 and an r-
A ball lens 7 of 100 pya is fixed with adhesive.
上記実施例では、ＬＥＤチップ４と球レンズ７との間に
介在された透明なガラス板９により発光面とレンズ焦点
が離間されているため、球レンズ７を通過した光は所定
の位置に結像する。従って、この結像位置に光ファイバ
ーを設置して光を入射させれば光のロスが低減され、光
ファイバーとの結合効率を向上することができる。因み
に、上記実施例における結合効率は、第２図の従来例に
比較して２０％向上した。In the above embodiment, the light emitting surface and the focal point of the lens are separated by the transparent glass plate 9 interposed between the LED chip 4 and the ball lens 7, so that the light passing through the ball lens 7 is focused at a predetermined position. Image. Therefore, if an optical fiber is installed at this imaging position and light is made incident thereon, the loss of light can be reduced and the coupling efficiency with the optical fiber can be improved. Incidentally, the coupling efficiency in the above example was improved by 20% compared to the conventional example shown in FIG.
以上詳述したように、本発明にによる半導体発光装置は
光を高効率で光ファイバーに結合することができ、光通
信用光源とし、て顕著な効果を発揮するものである。As described in detail above, the semiconductor light emitting device according to the present invention can couple light to an optical fiber with high efficiency, and exhibits remarkable effects as a light source for optical communication.
第１図は本発明の一実施例になるＬＥＤランプの断面図
、第２図は従来のＬＥＤランプの断面図である。
１・・・ステム、２・・・絶縁物層、３１．３２・・・
リード、４・・・ＬＥＤチップ、５・・・ボンディング
ワイヤ、６．８・・・エポキシ樹脂層、７・・・球レン
ズ、９・・・ガラス板。
１ｓ１図
１に２図FIG. 1 is a sectional view of an LED lamp according to an embodiment of the present invention, and FIG. 2 is a sectional view of a conventional LED lamp. 1... Stem, 2... Insulator layer, 31.32...
Lead, 4... LED chip, 5... Bonding wire, 6.8... Epoxy resin layer, 7... Ball lens, 9... Glass plate. 1s1 figure 1 to 2 figures
Claims (1)
グされた発光ダイオードチップの上に、透光性の板を介
在させて球レンズを接着したことを特徴とする半導体発
光装置。1. A semiconductor light-emitting device comprising a light-emitting diode chip die-bonded and wire-bonded onto a stem, and a ball lens bonded to the stem with a light-transmitting plate interposed therebetween.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60200024A JPS6260277A (en) | 1985-09-10 | 1985-09-10 | Semiconductor light emitting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP60200024A JPS6260277A (en) | 1985-09-10 | 1985-09-10 | Semiconductor light emitting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6260277A true JPS6260277A (en) | 1987-03-16 |
Family
ID=16417543
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP60200024A Pending JPS6260277A (en) | 1985-09-10 | 1985-09-10 | Semiconductor light emitting device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6260277A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001086730A2 (en) * | 2000-05-12 | 2001-11-15 | Osram Opto Semiconductors Gmbh | Optoelectronic component and method for the production thereof |
| US8227821B2 (en) | 2004-09-22 | 2012-07-24 | Osram Opto Semiconductors Gmbh | Housing for an optoelectronic component, optoelectronic component and method for the production of an optoelectronic component |
| JP2021015910A (en) * | 2019-07-12 | 2021-02-12 | Ｄｏｗａエレクトロニクス株式会社 | Light emitting element lamp and method for manufacturing the same |
-
1985
- 1985-09-10 JP JP60200024A patent/JPS6260277A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001086730A2 (en) * | 2000-05-12 | 2001-11-15 | Osram Opto Semiconductors Gmbh | Optoelectronic component and method for the production thereof |
| WO2001086730A3 (en) * | 2000-05-12 | 2002-06-27 | Osram Opto Semiconductors Gmbh | Optoelectronic component and method for the production thereof |
| US7455461B2 (en) | 2000-05-12 | 2008-11-25 | Osram Opto Semiconductors Gmbh | Optoelectronic component and method for the production thereof |
| US8227821B2 (en) | 2004-09-22 | 2012-07-24 | Osram Opto Semiconductors Gmbh | Housing for an optoelectronic component, optoelectronic component and method for the production of an optoelectronic component |
| JP2021015910A (en) * | 2019-07-12 | 2021-02-12 | Ｄｏｗａエレクトロニクス株式会社 | Light emitting element lamp and method for manufacturing the same |
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