JPS5758369A - Photo device - Google Patents

Photo device

Info

Publication number
JPS5758369A
JPS5758369A JP55132844A JP13284480A JPS5758369A JP S5758369 A JPS5758369 A JP S5758369A JP 55132844 A JP55132844 A JP 55132844A JP 13284480 A JP13284480 A JP 13284480A JP S5758369 A JPS5758369 A JP S5758369A
Authority
JP
Japan
Prior art keywords
package
fixed
fiber
sleeve
light receiving
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP55132844A
Other languages
Japanese (ja)
Inventor
Ei Yamada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP55132844A priority Critical patent/JPS5758369A/en
Publication of JPS5758369A publication Critical patent/JPS5758369A/en
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4202—Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4248—Feed-through connections for the hermetical passage of fibres through a package wall
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Abstract

PURPOSE:To decrease reflective loss on the end surface of an optical fiber and on the surface of a light receiving element by a method wherein a light receiving or light emitting element is fixed on the end of an optical fiber passing through a package and of a sleeve which are placed in the package. CONSTITUTION:A circuit substrate 15 is attached 2 to a stem 1, and lead wires 6, 7 are sealed and fixed by solder glass. And a frame 13 is sealed and fixed to the stem by means of resistance welding or the like, and a sleeve 10 which has an optical fiber 9 within it passes through the side of the frame 13 to reach the interior of the package and it is sealed hermetically by solder glass 12. And a light receiving or light emitting element 3 is fixed by an adhesive agent 14 which is an optically transparent substance and has a nearly equal refractive index to the fiber core onto the fiber 9 and onto the end surface of the sleeve 10 which are positioned inside the package. Each lead wire 4, 5 is taken out from front and back planes by means of soldering in this element 3 before attaching them, and through fixing the chip onto the surface of the fiber and attching them by soldering to a proper pad on the substrate 15 a circuit is completed.
JP55132844A 1980-09-26 1980-09-26 Photo device Pending JPS5758369A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55132844A JPS5758369A (en) 1980-09-26 1980-09-26 Photo device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55132844A JPS5758369A (en) 1980-09-26 1980-09-26 Photo device

Publications (1)

Publication Number Publication Date
JPS5758369A true JPS5758369A (en) 1982-04-08

Family

ID=15090830

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55132844A Pending JPS5758369A (en) 1980-09-26 1980-09-26 Photo device

Country Status (1)

Country Link
JP (1) JPS5758369A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5942052U (en) * 1982-09-13 1984-03-17 日本電気ホームエレクトロニクス株式会社 integrated circuit device
JPH03500506A (en) * 1988-07-29 1991-02-07 スペツィアルノエ　コンストルクトルスコエ　ビュロ　ビオロギチェスコゴ　プリボロストロエニア　アカデミイ　ナウク　エスエスエスエル How to monitor the process of solid-phase synthesis of biopolymers
US5177806A (en) * 1986-12-05 1993-01-05 E. I. Du Pont De Nemours And Company Optical fiber feedthrough
US5262657A (en) * 1992-01-24 1993-11-16 The United States Of America As Represented By The Secretary Of The Army Optically activated wafer-scale pulser with AlGaAs epitaxial layer
EP1154298A1 (en) * 2000-05-09 2001-11-14 Alcatel Arrangement consisting of a photodiode and an optical fiber
JP2016153733A (en) * 2015-02-20 2016-08-25 日本電信電話株式会社 Device of measuring amount of emission light and method of measuring optical fiber connection loss using the same

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5942052U (en) * 1982-09-13 1984-03-17 日本電気ホームエレクトロニクス株式会社 integrated circuit device
US5177806A (en) * 1986-12-05 1993-01-05 E. I. Du Pont De Nemours And Company Optical fiber feedthrough
JPH03500506A (en) * 1988-07-29 1991-02-07 スペツィアルノエ　コンストルクトルスコエ　ビュロ　ビオロギチェスコゴ　プリボロストロエニア　アカデミイ　ナウク　エスエスエスエル How to monitor the process of solid-phase synthesis of biopolymers
US5262657A (en) * 1992-01-24 1993-11-16 The United States Of America As Represented By The Secretary Of The Army Optically activated wafer-scale pulser with AlGaAs epitaxial layer
EP1154298A1 (en) * 2000-05-09 2001-11-14 Alcatel Arrangement consisting of a photodiode and an optical fiber
US6524017B2 (en) 2000-05-09 2003-02-25 Alcatel Arrangement consisting of a photodiode and an optical fiber
JP2016153733A (en) * 2015-02-20 2016-08-25 日本電信電話株式会社 Device of measuring amount of emission light and method of measuring optical fiber connection loss using the same

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