JPS5748858B2 - - Google Patents
Info
- Publication number
- JPS5748858B2 JPS5748858B2 JP49102085A JP10208574A JPS5748858B2 JP S5748858 B2 JPS5748858 B2 JP S5748858B2 JP 49102085 A JP49102085 A JP 49102085A JP 10208574 A JP10208574 A JP 10208574A JP S5748858 B2 JPS5748858 B2 JP S5748858B2
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP49102085A JPS5748858B2 (cg-RX-API-DMAC7.html) | 1974-09-06 | 1974-09-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP49102085A JPS5748858B2 (cg-RX-API-DMAC7.html) | 1974-09-06 | 1974-09-06 |
Related Child Applications (5)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16961180A Division JPS56107566A (en) | 1980-12-03 | 1980-12-03 | Resin sealing method for semiconductor device |
| JP16961080A Division JPS56107568A (en) | 1980-12-03 | 1980-12-03 | Resin sealing method for semiconductor device |
| JP56174578A Division JPS57103340A (en) | 1981-11-02 | 1981-11-02 | Resin sealing method for semiconductor device and lead frame used therefor |
| JP56174579A Division JPS57103341A (en) | 1981-11-02 | 1981-11-02 | Resin sealed semiconductor device |
| JP58120363A Division JPS5941861A (ja) | 1983-07-04 | 1983-07-04 | リ−ドフレ−ム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5129086A JPS5129086A (cg-RX-API-DMAC7.html) | 1976-03-11 |
| JPS5748858B2 true JPS5748858B2 (cg-RX-API-DMAC7.html) | 1982-10-19 |
Family
ID=14317922
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP49102085A Expired JPS5748858B2 (cg-RX-API-DMAC7.html) | 1974-09-06 | 1974-09-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5748858B2 (cg-RX-API-DMAC7.html) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5521124A (en) * | 1978-08-02 | 1980-02-15 | Hitachi Ltd | Lead frame |
| JPS5571051A (en) * | 1978-11-24 | 1980-05-28 | Hitachi Ltd | Semiconductor device |
| JPS579859A (en) * | 1980-06-17 | 1982-01-19 | Toshiba Corp | Corrosion-resistant material |
| JPS57205296A (en) * | 1981-06-15 | 1982-12-16 | Toshiba Corp | Propeller for ship and production thereof |
| JPS58170834U (ja) * | 1982-05-07 | 1983-11-15 | 日本電気株式会社 | リ−ドフレ−ムのアイランド吊り構造 |
| JPS6163047A (ja) * | 1985-06-28 | 1986-04-01 | Hitachi Ltd | 樹脂封止型形半導体装置用リ−ドフレ−ム |
| JP2667538B2 (ja) * | 1989-12-11 | 1997-10-27 | 川崎製鉄株式会社 | 腐食ないし侵食環境における耐疲労特性に優れる高強度マルテンサイトステンレス圧延鋼板 |
| KR0149740B1 (ko) * | 1992-09-04 | 1998-11-16 | 코오노 미찌아끼 | 스테인레스 가아제수중익 등의 구조부재 및 그 제조방법 및 그를 사용한 선박 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE2328798A1 (de) * | 1972-06-23 | 1974-01-17 | Philips Nv | Halbleiteranordnung |
| JPS5624375B2 (cg-RX-API-DMAC7.html) * | 1972-10-04 | 1981-06-05 |
-
1974
- 1974-09-06 JP JP49102085A patent/JPS5748858B2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5129086A (cg-RX-API-DMAC7.html) | 1976-03-11 |