Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
  • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body (electrodes)
  • H01L23/485—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body (electrodes) consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
  • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/0001—Technical content checked by a classifier
  • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

• Engineering & Computer Science (AREA)
• Physics & Mathematics (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• General Physics & Mathematics (AREA)
• Computer Hardware Design (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Power Engineering (AREA)
• Manufacturing & Machinery (AREA)
• Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
• Production Of Multi-Layered Print Wiring Board (AREA)
• Weting (AREA)

Applications Claiming Priority (1)

Publications (2)

Family

ID=9142928

Family Applications (1)

Country Status (10)

Families Citing this family (3)

Family Cites Families (8)

• 1974
  • 1974-09-10 FR FR7430623A patent/FR2284981A1/fr active Granted
• 1975
  • 1975-08-28 DE DE2538264A patent/DE2538264C3/de not_active Expired
  • 1975-09-04 NL NL7510427A patent/NL7510427A/xx not_active Application Discontinuation
  • 1975-09-04 CA CA234,787A patent/CA1035470A/en not_active Expired
  • 1975-09-05 IT IT26982/75A patent/IT1042339B/it active
  • 1975-09-05 GB GB36624/75A patent/GB1518988A/en not_active Expired
  • 1975-09-05 CH CH1153875A patent/CH591163A5/xx not_active IP Right Cessation
  • 1975-09-06 JP JP50107586A patent/JPS5744017B2/ja not_active Expired
  • 1975-09-08 SE SE7509970A patent/SE415421B/xx unknown
  • 1975-09-08 AT AT692075A patent/AT359562B/de not_active IP Right Cessation

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