JPS5743497A - Method of connecting between layers of multilayer circuit - Google Patents

Method of connecting between layers of multilayer circuit

Info

Publication number
JPS5743497A
JPS5743497A JP11932180A JP11932180A JPS5743497A JP S5743497 A JPS5743497 A JP S5743497A JP 11932180 A JP11932180 A JP 11932180A JP 11932180 A JP11932180 A JP 11932180A JP S5743497 A JPS5743497 A JP S5743497A
Authority
JP
Japan
Prior art keywords
layers
multilayer circuit
multilayer
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11932180A
Other languages
Japanese (ja)
Other versions
JPS5841800B2 (en
Inventor
Kishio Yokouchi
Nobuo Kamehara
Kouichi Niwa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP55119321A priority Critical patent/JPS5841800B2/en
Publication of JPS5743497A publication Critical patent/JPS5743497A/en
Publication of JPS5841800B2 publication Critical patent/JPS5841800B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP55119321A 1980-08-29 1980-08-29 Method of forming ceramic multilayer substrate Expired JPS5841800B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55119321A JPS5841800B2 (en) 1980-08-29 1980-08-29 Method of forming ceramic multilayer substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55119321A JPS5841800B2 (en) 1980-08-29 1980-08-29 Method of forming ceramic multilayer substrate

Publications (2)

Publication Number Publication Date
JPS5743497A true JPS5743497A (en) 1982-03-11
JPS5841800B2 JPS5841800B2 (en) 1983-09-14

Family

ID=14758557

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55119321A Expired JPS5841800B2 (en) 1980-08-29 1980-08-29 Method of forming ceramic multilayer substrate

Country Status (1)

Country Link
JP (1) JPS5841800B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62172795A (en) * 1986-01-24 1987-07-29 松下電器産業株式会社 Ceramic multilayer substrate

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2020017532A1 (en) 2018-07-17 2020-01-23 株式会社アマダホールディングス Tool for press brake
US12036599B2 (en) 2019-05-07 2024-07-16 Amada Co., Ltd. Press brake
JP6741824B1 (en) 2019-05-16 2020-08-19 株式会社アマダ Bending system and die transfer method
WO2020230731A1 (en) 2019-05-16 2020-11-19 株式会社アマダ Bending system and mold misalignment correction method
JP7182535B2 (en) 2019-10-11 2022-12-02 株式会社アマダ Bending system and lubrication unit

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS498757A (en) * 1972-05-20 1974-01-25
JPS4941854A (en) * 1972-08-30 1974-04-19
JPS5578585A (en) * 1978-12-07 1980-06-13 Matsushita Electric Ind Co Ltd Printed circuit board

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS498757A (en) * 1972-05-20 1974-01-25
JPS4941854A (en) * 1972-08-30 1974-04-19
JPS5578585A (en) * 1978-12-07 1980-06-13 Matsushita Electric Ind Co Ltd Printed circuit board

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62172795A (en) * 1986-01-24 1987-07-29 松下電器産業株式会社 Ceramic multilayer substrate

Also Published As

Publication number Publication date
JPS5841800B2 (en) 1983-09-14

Similar Documents

Publication Publication Date Title
JPS56157358A (en) Method of forming multilayer film
JPS56158468A (en) Method of manufacturing itnegrated circuit
JPS5731199A (en) Multilayer circuit board and method of producing same
DE3469097D1 (en) Method of manufacturing multilayer capacitors
JPS56144523A (en) Method of manufacturing laminated capacitor
JPS5586195A (en) Method of fabricating multilayer circuit board
JPS56118394A (en) Method of manufacturing multilayer circuit board
JPS5743497A (en) Method of connecting between layers of multilayer circuit
JPS56116697A (en) Method of forming conductor layer on multilayer circuit board
JPS56147499A (en) Method of manufacturing multilayer ceramic board
JPS56150897A (en) Method of manufacturing multilayer printed board
JPS56111296A (en) Method of forming multilayer wire
JPS56118395A (en) Method of forming multilayer wire
JPS5731197A (en) Method of producing multilayer circuit board
JPS5541708A (en) Method of fabricating multilayer circuit board
JPS5586197A (en) Method of fabricating multilayer circuit board
JPS5792894A (en) Method of producing multilayer printed circuit
JPS56157095A (en) Method of manufacturing thick film multilayer board
JPS5712600A (en) Method of producing thick film multilayer circuit board
JPS56107592A (en) Method of manufacturing copperrlined laminated board
JPS56104496A (en) Method of manufacturing multilayer circuit board
JPS5585097A (en) Method of fabricating multilayer circuit board
JPS56122187A (en) Method of manufacturing oneeside metallic foil laminated board
JPS56122188A (en) Method of manufacturing oneeside metallic foil laminated board
JPS5797692A (en) Method of producing multilayer circuit board