JPS4941854A - - Google Patents
Info
- Publication number
- JPS4941854A JPS4941854A JP8630872A JP8630872A JPS4941854A JP S4941854 A JPS4941854 A JP S4941854A JP 8630872 A JP8630872 A JP 8630872A JP 8630872 A JP8630872 A JP 8630872A JP S4941854 A JPS4941854 A JP S4941854A
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8630872A JPS4941854A (en) | 1972-08-30 | 1972-08-30 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8630872A JPS4941854A (en) | 1972-08-30 | 1972-08-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS4941854A true JPS4941854A (en) | 1974-04-19 |
Family
ID=13883190
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8630872A Pending JPS4941854A (en) | 1972-08-30 | 1972-08-30 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS4941854A (en) |
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS529862A (en) * | 1975-07-14 | 1977-01-25 | Nippon Telegraph & Telephone | Multilayered ceramic substrate |
JPS5273376A (en) * | 1975-12-17 | 1977-06-20 | Fujitsu Ltd | Method of producing multiilayer ceramic substrate |
JPS5298155U (en) * | 1976-01-23 | 1977-07-23 | ||
JPS52154074A (en) * | 1976-06-18 | 1977-12-21 | Fujitsu Ltd | Method of producing multilayer alumina substrate |
JPS5335160A (en) * | 1976-09-11 | 1978-04-01 | Fujitsu Ltd | Method of wiring multilayer |
JPS5335960A (en) * | 1976-09-16 | 1978-04-03 | Fujitsu Ltd | Method of producing multilayer ceramic substrate |
JPS5341765A (en) * | 1976-09-28 | 1978-04-15 | Nippon Electric Co | Method of producing high density multilayer circuit board |
JPS54108271A (en) * | 1978-02-14 | 1979-08-24 | Toppan Printing Co Ltd | Substrate for multiilayer printed circuit board |
JPS5522814A (en) * | 1978-08-04 | 1980-02-18 | Shigeki Shimamura | Method of manufacturing printed board |
JPS5550685A (en) * | 1978-10-11 | 1980-04-12 | Shigeki Shimamura | Method of manufacturing printed board |
JPS5743497A (en) * | 1980-08-29 | 1982-03-11 | Fujitsu Ltd | Method of connecting between layers of multilayer circuit |
JPS57184233A (en) * | 1981-05-08 | 1982-11-12 | Nec Corp | Semiconductor device |
JPS57186178U (en) * | 1981-05-19 | 1982-11-26 | ||
JPH04239748A (en) * | 1991-01-14 | 1992-08-27 | Samsung Electron Co Ltd | Method of forming multilayer interconnection of semiconductor device |
-
1972
- 1972-08-30 JP JP8630872A patent/JPS4941854A/ja active Pending
Cited By (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS529862A (en) * | 1975-07-14 | 1977-01-25 | Nippon Telegraph & Telephone | Multilayered ceramic substrate |
JPS5726440B2 (en) * | 1975-07-14 | 1982-06-04 | ||
JPS5273376A (en) * | 1975-12-17 | 1977-06-20 | Fujitsu Ltd | Method of producing multiilayer ceramic substrate |
JPS5850039B2 (en) * | 1975-12-17 | 1983-11-08 | 富士通株式会社 | Tasouseramitsukukibanoseizouhouhou |
JPS5298155U (en) * | 1976-01-23 | 1977-07-23 | ||
JPS5546077B2 (en) * | 1976-06-18 | 1980-11-21 | ||
JPS52154074A (en) * | 1976-06-18 | 1977-12-21 | Fujitsu Ltd | Method of producing multilayer alumina substrate |
JPS5335160A (en) * | 1976-09-11 | 1978-04-01 | Fujitsu Ltd | Method of wiring multilayer |
JPS5335960A (en) * | 1976-09-16 | 1978-04-03 | Fujitsu Ltd | Method of producing multilayer ceramic substrate |
JPS5754956B2 (en) * | 1976-09-16 | 1982-11-20 | ||
JPS5819158B2 (en) * | 1976-09-28 | 1983-04-16 | 日本電気株式会社 | Manufacturing method for high-density multilayer wiring board |
JPS5341765A (en) * | 1976-09-28 | 1978-04-15 | Nippon Electric Co | Method of producing high density multilayer circuit board |
JPS54108271A (en) * | 1978-02-14 | 1979-08-24 | Toppan Printing Co Ltd | Substrate for multiilayer printed circuit board |
JPS5826200B2 (en) * | 1978-02-14 | 1983-06-01 | 凸版印刷株式会社 | multilayer printed wiring board |
JPS5522814A (en) * | 1978-08-04 | 1980-02-18 | Shigeki Shimamura | Method of manufacturing printed board |
JPS5550685A (en) * | 1978-10-11 | 1980-04-12 | Shigeki Shimamura | Method of manufacturing printed board |
JPS5743497A (en) * | 1980-08-29 | 1982-03-11 | Fujitsu Ltd | Method of connecting between layers of multilayer circuit |
JPS5841800B2 (en) * | 1980-08-29 | 1983-09-14 | 富士通株式会社 | Method of forming ceramic multilayer substrate |
JPS57184233A (en) * | 1981-05-08 | 1982-11-12 | Nec Corp | Semiconductor device |
JPS57186178U (en) * | 1981-05-19 | 1982-11-26 | ||
JPH04239748A (en) * | 1991-01-14 | 1992-08-27 | Samsung Electron Co Ltd | Method of forming multilayer interconnection of semiconductor device |