JPS4941854A - - Google Patents

Info

Publication number
JPS4941854A
JPS4941854A JP8630872A JP8630872A JPS4941854A JP S4941854 A JPS4941854 A JP S4941854A JP 8630872 A JP8630872 A JP 8630872A JP 8630872 A JP8630872 A JP 8630872A JP S4941854 A JPS4941854 A JP S4941854A
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8630872A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP8630872A priority Critical patent/JPS4941854A/ja
Publication of JPS4941854A publication Critical patent/JPS4941854A/ja
Pending legal-status Critical Current

Links

Landscapes

  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP8630872A 1972-08-30 1972-08-30 Pending JPS4941854A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8630872A JPS4941854A (en) 1972-08-30 1972-08-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8630872A JPS4941854A (en) 1972-08-30 1972-08-30

Publications (1)

Publication Number Publication Date
JPS4941854A true JPS4941854A (en) 1974-04-19

Family

ID=13883190

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8630872A Pending JPS4941854A (en) 1972-08-30 1972-08-30

Country Status (1)

Country Link
JP (1) JPS4941854A (en)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS529862A (en) * 1975-07-14 1977-01-25 Nippon Telegraph & Telephone Multilayered ceramic substrate
JPS5273376A (en) * 1975-12-17 1977-06-20 Fujitsu Ltd Method of producing multiilayer ceramic substrate
JPS5298155U (en) * 1976-01-23 1977-07-23
JPS52154074A (en) * 1976-06-18 1977-12-21 Fujitsu Ltd Method of producing multilayer alumina substrate
JPS5335160A (en) * 1976-09-11 1978-04-01 Fujitsu Ltd Method of wiring multilayer
JPS5335960A (en) * 1976-09-16 1978-04-03 Fujitsu Ltd Method of producing multilayer ceramic substrate
JPS5341765A (en) * 1976-09-28 1978-04-15 Nippon Electric Co Method of producing high density multilayer circuit board
JPS54108271A (en) * 1978-02-14 1979-08-24 Toppan Printing Co Ltd Substrate for multiilayer printed circuit board
JPS5522814A (en) * 1978-08-04 1980-02-18 Shigeki Shimamura Method of manufacturing printed board
JPS5550685A (en) * 1978-10-11 1980-04-12 Shigeki Shimamura Method of manufacturing printed board
JPS5743497A (en) * 1980-08-29 1982-03-11 Fujitsu Ltd Method of connecting between layers of multilayer circuit
JPS57184233A (en) * 1981-05-08 1982-11-12 Nec Corp Semiconductor device
JPS57186178U (en) * 1981-05-19 1982-11-26
JPH04239748A (en) * 1991-01-14 1992-08-27 Samsung Electron Co Ltd Method of forming multilayer interconnection of semiconductor device

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS529862A (en) * 1975-07-14 1977-01-25 Nippon Telegraph & Telephone Multilayered ceramic substrate
JPS5726440B2 (en) * 1975-07-14 1982-06-04
JPS5273376A (en) * 1975-12-17 1977-06-20 Fujitsu Ltd Method of producing multiilayer ceramic substrate
JPS5850039B2 (en) * 1975-12-17 1983-11-08 富士通株式会社 Tasouseramitsukukibanoseizouhouhou
JPS5298155U (en) * 1976-01-23 1977-07-23
JPS5546077B2 (en) * 1976-06-18 1980-11-21
JPS52154074A (en) * 1976-06-18 1977-12-21 Fujitsu Ltd Method of producing multilayer alumina substrate
JPS5335160A (en) * 1976-09-11 1978-04-01 Fujitsu Ltd Method of wiring multilayer
JPS5335960A (en) * 1976-09-16 1978-04-03 Fujitsu Ltd Method of producing multilayer ceramic substrate
JPS5754956B2 (en) * 1976-09-16 1982-11-20
JPS5819158B2 (en) * 1976-09-28 1983-04-16 日本電気株式会社 Manufacturing method for high-density multilayer wiring board
JPS5341765A (en) * 1976-09-28 1978-04-15 Nippon Electric Co Method of producing high density multilayer circuit board
JPS54108271A (en) * 1978-02-14 1979-08-24 Toppan Printing Co Ltd Substrate for multiilayer printed circuit board
JPS5826200B2 (en) * 1978-02-14 1983-06-01 凸版印刷株式会社 multilayer printed wiring board
JPS5522814A (en) * 1978-08-04 1980-02-18 Shigeki Shimamura Method of manufacturing printed board
JPS5550685A (en) * 1978-10-11 1980-04-12 Shigeki Shimamura Method of manufacturing printed board
JPS5743497A (en) * 1980-08-29 1982-03-11 Fujitsu Ltd Method of connecting between layers of multilayer circuit
JPS5841800B2 (en) * 1980-08-29 1983-09-14 富士通株式会社 Method of forming ceramic multilayer substrate
JPS57184233A (en) * 1981-05-08 1982-11-12 Nec Corp Semiconductor device
JPS57186178U (en) * 1981-05-19 1982-11-26
JPH04239748A (en) * 1991-01-14 1992-08-27 Samsung Electron Co Ltd Method of forming multilayer interconnection of semiconductor device

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