JPS573214A - Manufacture of nagnetic head - Google Patents
Manufacture of nagnetic headInfo
- Publication number
- JPS573214A JPS573214A JP7573080A JP7573080A JPS573214A JP S573214 A JPS573214 A JP S573214A JP 7573080 A JP7573080 A JP 7573080A JP 7573080 A JP7573080 A JP 7573080A JP S573214 A JPS573214 A JP S573214A
- Authority
- JP
- Japan
- Prior art keywords
- wafers
- track
- couple
- mold
- restricting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/187—Structure or manufacture of the surface of the head in physical contact with, or immediately adjacent to the recording medium; Pole pieces; Gap features
- G11B5/1871—Shaping or contouring of the transducing or guiding surface
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Magnetic Heads (AREA)
Abstract
PURPOSE:To manufacture a magnetic head free from a fear of crosstalk by forming a common side groove for restricting the width of a track in a couple of core halves, and by butting and using a couple of wafer obtained from the core half. CONSTITUTION:One-side surfaces 3 and 4 of wafers 1 and 2 of single crystal ferrite are worked into mirror surfaces, which are arranged facing the surface 6 of a jig 5. Then, the wafers are united together with a molding material 7 by using a mold 8. The molded wafers 1 and 2 are taken out of the mold and in the mirror-finished surfaces, grooves 10 for restricting track width 9 are cut. According to a usual method, a winding groove, a glass insertion groove, etc., are made and after the wafers 1 and 2 are meltstuck together while butted so that their track widths coincide with each other, a tape contact surface is rounded by being polished and the body is sliced along the broken lines to obtain magnetic head cores.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7573080A JPS573214A (en) | 1980-06-04 | 1980-06-04 | Manufacture of nagnetic head |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7573080A JPS573214A (en) | 1980-06-04 | 1980-06-04 | Manufacture of nagnetic head |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS573214A true JPS573214A (en) | 1982-01-08 |
Family
ID=13584672
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7573080A Pending JPS573214A (en) | 1980-06-04 | 1980-06-04 | Manufacture of nagnetic head |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS573214A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6062124A (en) * | 1983-09-14 | 1985-04-10 | Toshiba Corp | Reactive-ion etching method |
-
1980
- 1980-06-04 JP JP7573080A patent/JPS573214A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6062124A (en) * | 1983-09-14 | 1985-04-10 | Toshiba Corp | Reactive-ion etching method |
JPH0465526B2 (en) * | 1983-09-14 | 1992-10-20 | Tokyo Shibaura Electric Co |
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