JPS5728375A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS5728375A JPS5728375A JP10342980A JP10342980A JPS5728375A JP S5728375 A JPS5728375 A JP S5728375A JP 10342980 A JP10342980 A JP 10342980A JP 10342980 A JP10342980 A JP 10342980A JP S5728375 A JPS5728375 A JP S5728375A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- type
- light emitting
- grown
- epitaxial growth
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title abstract 4
- 238000004519 manufacturing process Methods 0.000 title 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 abstract 3
- 239000007791 liquid phase Substances 0.000 abstract 3
- 239000000758 substrate Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
- Led Devices (AREA)
Abstract
PURPOSE:To improve light emitting efficiency and the characteristics of modulation by a method wherein a PN junction of a light emitting diode is prepared through liquid-phase epitaxial growth, and a semi-insulating semiconductor layer and an active layer of a FET are formed through a molecular beam epitaxial method in the semiconductor device controlling the light emitting output of the diode by the input signals of the FET connected in series. CONSTITUTION:The light emitting diode is manufactured in such a manner than an N<+> type Ga0.8Al0.2As layer 12 and a P type Ga0.9Al0.1 As layer 13 are laminated and deposited on an N<+> type GaAs substrate 11 through the slide board type liquid-phase epitaxial growth method and the PN junction is formed between the layers 12 and 13. A P<+> type Ga0.7Al0.3As layer 14 is further grown on the layer 13 in a liquid phase in order to decrease contact resistance. The element is admitted into another device and grown through the molecular beam epitaxial growth method, but an N type or undoped GaAs layer 15 is shaped previously in order to prevent contact with air and the discontinuance of the layer 14 at that time. A GaAs layer 16 is grown through the molecular epitaxial growth method and used as the semi-insulating semiconductor layer, and an N type CaAs layer 17 functioning as the active layer of the FET is grown on the layer through the same method.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10342980A JPS5728375A (en) | 1980-07-28 | 1980-07-28 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10342980A JPS5728375A (en) | 1980-07-28 | 1980-07-28 | Manufacture of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5728375A true JPS5728375A (en) | 1982-02-16 |
Family
ID=14353787
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10342980A Pending JPS5728375A (en) | 1980-07-28 | 1980-07-28 | Manufacture of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5728375A (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4439910A (en) * | 1980-09-29 | 1984-04-03 | Hughes Aircraft Company | Process for fabrication of monolithic transistor coupled electroluminescent diode |
US4491264A (en) * | 1982-06-01 | 1985-01-01 | Rca Corporation | Method of soldering a light emitting device to a substrate |
JPS61142464U (en) * | 1985-02-25 | 1986-09-03 | ||
US4921817A (en) * | 1987-07-09 | 1990-05-01 | Mitsubishi Monsanto Chemical Co. | Substrate for high-intensity led, and method of epitaxially growing same |
EP2378555A3 (en) * | 2010-04-13 | 2015-12-30 | LG Innotek Co., Ltd. | Light emitting device and light emitting device package |
CN105870277A (en) * | 2016-04-20 | 2016-08-17 | 华灿光电(苏州)有限公司 | Light-emitting diode epitaxial wafer and growth method thereof |
CN106935579A (en) * | 2012-02-23 | 2017-07-07 | 尼斯迪格瑞科技环球公司 | Active light emissive diode (led) module |
US10270436B2 (en) | 2014-11-14 | 2019-04-23 | The Hong Kong University Of Science And Technology | Transistors having on-chip integrated photon source or photonic-ohmic drain to facilitate de-trapping electrons trapped in deep traps of transistors |
-
1980
- 1980-07-28 JP JP10342980A patent/JPS5728375A/en active Pending
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4439910A (en) * | 1980-09-29 | 1984-04-03 | Hughes Aircraft Company | Process for fabrication of monolithic transistor coupled electroluminescent diode |
US4491264A (en) * | 1982-06-01 | 1985-01-01 | Rca Corporation | Method of soldering a light emitting device to a substrate |
JPS61142464U (en) * | 1985-02-25 | 1986-09-03 | ||
US4921817A (en) * | 1987-07-09 | 1990-05-01 | Mitsubishi Monsanto Chemical Co. | Substrate for high-intensity led, and method of epitaxially growing same |
EP2378555A3 (en) * | 2010-04-13 | 2015-12-30 | LG Innotek Co., Ltd. | Light emitting device and light emitting device package |
US9281342B2 (en) | 2010-04-13 | 2016-03-08 | Lg Innotek Co., Ltd. | Light emitting device and light emitting device package |
CN106935579A (en) * | 2012-02-23 | 2017-07-07 | 尼斯迪格瑞科技环球公司 | Active light emissive diode (led) module |
US10270436B2 (en) | 2014-11-14 | 2019-04-23 | The Hong Kong University Of Science And Technology | Transistors having on-chip integrated photon source or photonic-ohmic drain to facilitate de-trapping electrons trapped in deep traps of transistors |
CN105870277A (en) * | 2016-04-20 | 2016-08-17 | 华灿光电(苏州)有限公司 | Light-emitting diode epitaxial wafer and growth method thereof |
CN105870277B (en) * | 2016-04-20 | 2018-05-29 | 华灿光电(苏州)有限公司 | A kind of LED epitaxial slice and its growing method |
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