JPS5728347A - Lead frame - Google Patents
Lead frameInfo
- Publication number
- JPS5728347A JPS5728347A JP10345780A JP10345780A JPS5728347A JP S5728347 A JPS5728347 A JP S5728347A JP 10345780 A JP10345780 A JP 10345780A JP 10345780 A JP10345780 A JP 10345780A JP S5728347 A JPS5728347 A JP S5728347A
- Authority
- JP
- Japan
- Prior art keywords
- tie
- frame
- leads
- regions
- bar
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10345780A JPS5728347A (en) | 1980-07-28 | 1980-07-28 | Lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10345780A JPS5728347A (en) | 1980-07-28 | 1980-07-28 | Lead frame |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5728347A true JPS5728347A (en) | 1982-02-16 |
| JPH02859B2 JPH02859B2 (enExample) | 1990-01-09 |
Family
ID=14354548
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10345780A Granted JPS5728347A (en) | 1980-07-28 | 1980-07-28 | Lead frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5728347A (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0395664U (enExample) * | 1990-01-11 | 1991-09-30 |
-
1980
- 1980-07-28 JP JP10345780A patent/JPS5728347A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0395664U (enExample) * | 1990-01-11 | 1991-09-30 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02859B2 (enExample) | 1990-01-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20170358523A1 (en) | Leadframe strip with vertically offset die attach pads between adjacent vertical leadframe columns | |
| FR2305937A1 (fr) | Procede de fabrication d'un chocolat au lait | |
| JPS5728347A (en) | Lead frame | |
| FR2302692A1 (fr) | Procede de fabrication d'un chocolat au lait | |
| DE3263797D1 (en) | Process for manufacturing a plastic token, and token manufactured by said process | |
| BE833870A (fr) | Procede de fabrication de pieces detachees electromagnetiques, en particulier d'inductances | |
| JPS5391577A (en) | Manufacture of semiconductor device of resinsealing type | |
| JPS6450454A (en) | Manufacture of lead frame and semiconductor device | |
| JPS5637909A (en) | Processing method of link plate in chain conveyor | |
| JPS5710955A (en) | Manufacture of semiconductor device | |
| KR950000144Y1 (ko) | 리드 프레임 | |
| BE874648A (fr) | Procede de fabrication des grilles pour plaques a tubes d'accumulateurs au plomb | |
| KR100347133B1 (ko) | 리드 프레임 및 그 제조방법 | |
| JPS5593245A (en) | Lead frame | |
| JPS57196554A (en) | Manufacture of lead frame | |
| JPS575340A (en) | Manufacture of semiconductor device | |
| JPS57118658A (en) | Lead frame | |
| EP0127798A3 (en) | Method for making freezer baskets | |
| JPS55157235A (en) | Manufacture of semiconductor integrated circuit | |
| JPS5596663A (en) | Method of fabricating semiconductor device | |
| GB2019401B (en) | Process for manufacturing 4- hydroxy-3,5-dimethokybenzoic acid from 3,4,5- trimethoxybenzoic acid | |
| SU1099946A1 (ru) | Способ изготовлени щетки с проволочным ворсом | |
| JPS5512764A (en) | Semiconductor device manufacturing method | |
| Bruhl | Effect of the Straightening Process on the Characteristics of Wire | |
| JPS57208166A (en) | Lead frame for semiconductor device |