JPS5728340A - Sticking tool - Google Patents

Sticking tool

Info

Publication number
JPS5728340A
JPS5728340A JP10252580A JP10252580A JPS5728340A JP S5728340 A JPS5728340 A JP S5728340A JP 10252580 A JP10252580 A JP 10252580A JP 10252580 A JP10252580 A JP 10252580A JP S5728340 A JPS5728340 A JP S5728340A
Authority
JP
Japan
Prior art keywords
pellet
collet
pyramidal
observe
dent
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10252580A
Other languages
Japanese (ja)
Inventor
Osamu Tachibana
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP10252580A priority Critical patent/JPS5728340A/en
Publication of JPS5728340A publication Critical patent/JPS5728340A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)

Abstract

PURPOSE:To make it possible to observe a part of the peripheral surface of the matter to be stuck, by a method wherein a part of the dent formed at an end of a pyramidal body is opened sidewardly. CONSTITUTION:One face 10 of a pyramidal sticking dent formed in the bottom face of a collet 8 is partially cut to make it possible to observe a pellet 11 in the collet. Thereby, when the pellet is fixed to a substrate, vibration in the Y directin can be applied, so that good eutectic crystallization is obtained and mounting precision of the pellet can be measured through a cut-off 12. Accordingly, the collet 8 is moved in the X, Y directions by using three faces of the pyramidal dent according to the measured value, in order to correct the pellet position, so that it can be mounted with high precision.
JP10252580A 1980-07-28 1980-07-28 Sticking tool Pending JPS5728340A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10252580A JPS5728340A (en) 1980-07-28 1980-07-28 Sticking tool

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10252580A JPS5728340A (en) 1980-07-28 1980-07-28 Sticking tool

Publications (1)

Publication Number Publication Date
JPS5728340A true JPS5728340A (en) 1982-02-16

Family

ID=14329740

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10252580A Pending JPS5728340A (en) 1980-07-28 1980-07-28 Sticking tool

Country Status (1)

Country Link
JP (1) JPS5728340A (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5347903U (en) * 1976-09-21 1978-04-22
JPS542372B1 (en) * 1968-05-30 1979-02-06

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS542372B1 (en) * 1968-05-30 1979-02-06
JPS5347903U (en) * 1976-09-21 1978-04-22

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