JPS5672175A - Holing work method - Google Patents

Holing work method

Info

Publication number
JPS5672175A
JPS5672175A JP14747279A JP14747279A JPS5672175A JP S5672175 A JPS5672175 A JP S5672175A JP 14747279 A JP14747279 A JP 14747279A JP 14747279 A JP14747279 A JP 14747279A JP S5672175 A JPS5672175 A JP S5672175A
Authority
JP
Japan
Prior art keywords
glass
low
bored
melting point
copper wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14747279A
Other languages
Japanese (ja)
Inventor
Makoto Katsuta
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP14747279A priority Critical patent/JPS5672175A/en
Publication of JPS5672175A publication Critical patent/JPS5672175A/en
Pending legal-status Critical Current

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  • ing And Chemical Polishing (AREA)

Abstract

PURPOSE: To bore minutes holes with hig precision, by arranging a corrodible material in the holding work position and by removing said material with the etching liquid by etching, in case that minutes holes are bored in the material to be worked.
CONSTITUTION: In case that the hole of diameter B 40μm and depth A 0.5mm is bored on the gass, copper wire 2 of diameter 40μm is arranged on jig 1 and is molded by low-melting poing glass 3. Next, the material to be worked including jig 1 is put in solution of ammonia and ammonium persulfate to etch copper wire 2. Thus, by removing copper wire 2 from low-melting point glass 3, the hole is bored in glass of low-melting point 3. After that, glass of low-melting point 3 including jig 1 is cut into a prescribed thickness to complete the holding work of the minute diameter.
COPYRIGHT: (C)1981,JPO&Japio
JP14747279A 1979-11-14 1979-11-14 Holing work method Pending JPS5672175A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14747279A JPS5672175A (en) 1979-11-14 1979-11-14 Holing work method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14747279A JPS5672175A (en) 1979-11-14 1979-11-14 Holing work method

Publications (1)

Publication Number Publication Date
JPS5672175A true JPS5672175A (en) 1981-06-16

Family

ID=15431153

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14747279A Pending JPS5672175A (en) 1979-11-14 1979-11-14 Holing work method

Country Status (1)

Country Link
JP (1) JPS5672175A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0254785A (en) * 1988-08-17 1990-02-23 Mitsubishi Electric Corp Removing solution for copper plating on magnesium alloy base

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0254785A (en) * 1988-08-17 1990-02-23 Mitsubishi Electric Corp Removing solution for copper plating on magnesium alloy base

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