JPS572557A - Alloy junction and glass-sealed type semiconductor device - Google Patents

Alloy junction and glass-sealed type semiconductor device

Info

Publication number
JPS572557A
JPS572557A JP7562080A JP7562080A JPS572557A JP S572557 A JPS572557 A JP S572557A JP 7562080 A JP7562080 A JP 7562080A JP 7562080 A JP7562080 A JP 7562080A JP S572557 A JPS572557 A JP S572557A
Authority
JP
Japan
Prior art keywords
glass
electrodes
alloy junction
pellet
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7562080A
Other languages
Japanese (ja)
Inventor
Kensuke Suzuki
Mitsusachi Matsuzaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP7562080A priority Critical patent/JPS572557A/en
Publication of JPS572557A publication Critical patent/JPS572557A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

Abstract

PURPOSE:To equalize the P-N alloy junction of a semiconductor device and to reduce the residual stress at the glass sealing time by interposing an auxiliary electrode between a pair of electrodes and a semiconductor pellet for holding and bonding the pellet and securing them. CONSTITUTION:A semiconductor pellet 32 having an alloy junction 5 is interposed and bonded between a pair of electrodes 2A and 2B, and is sealed with a glass sleeve 7. At this time, thin auxiliary electrodes 14A, 14B are so interposed between the pellet 32 and the electrodes 2A, 2B as to be smaller in the area of the electrode members than those. The auxiliary electrode material employs W or P type Si, the junction is thus equalized uniformly, and the influence of the sealing glass material to the thermal stress can be reduced. Thus, the P-N alloy junction can be equalized, and the residual stress at the time of sealing the glass can be reduced.
JP7562080A 1980-06-06 1980-06-06 Alloy junction and glass-sealed type semiconductor device Pending JPS572557A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7562080A JPS572557A (en) 1980-06-06 1980-06-06 Alloy junction and glass-sealed type semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7562080A JPS572557A (en) 1980-06-06 1980-06-06 Alloy junction and glass-sealed type semiconductor device

Publications (1)

Publication Number Publication Date
JPS572557A true JPS572557A (en) 1982-01-07

Family

ID=13581430

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7562080A Pending JPS572557A (en) 1980-06-06 1980-06-06 Alloy junction and glass-sealed type semiconductor device

Country Status (1)

Country Link
JP (1) JPS572557A (en)

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