JPS5724549A - Electronic device - Google Patents

Electronic device

Info

Publication number
JPS5724549A
JPS5724549A JP10024080A JP10024080A JPS5724549A JP S5724549 A JPS5724549 A JP S5724549A JP 10024080 A JP10024080 A JP 10024080A JP 10024080 A JP10024080 A JP 10024080A JP S5724549 A JPS5724549 A JP S5724549A
Authority
JP
Japan
Prior art keywords
studs
dumet
moulding
corrosion
covered
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10024080A
Other languages
Japanese (ja)
Other versions
JPS5946420B2 (en
Inventor
Yoshio Yamauchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rohm Co Ltd
Original Assignee
Rohm Co Ltd
Toyo Electronics Industry Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rohm Co Ltd, Toyo Electronics Industry Corp filed Critical Rohm Co Ltd
Priority to JP55100240A priority Critical patent/JPS5946420B2/en
Publication of JPS5724549A publication Critical patent/JPS5724549A/en
Publication of JPS5946420B2 publication Critical patent/JPS5946420B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/043—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body
    • H01L23/051—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having a conductive base as a mounting as well as a lead for the semiconductor body another lead being formed by a cover plate parallel to the base plate, e.g. sandwich type
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Lead Frames For Integrated Circuits (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To prevent lowering of airtightness or corrosion of a weld part of a semiconductor device or electron tube and make it possible to prevent deterioration of the characteristics of said device or the like, by covering the conductive studs with a humidity resistant resin. CONSTITUTION:A semiconductor element 5 is put between Dumet studs 6, and conductor leads 7 are connected with their ends. The semiconductor element 5 and the Dumet studs 6 are covered with glass tubes 4 by moulding, and then the whole of them is covered with a humidity resistant resin by moulding. The corrosion and the deterioration of the device, even under a test in a highly humid atmosphere for a long time, will be prevented because the Dumet studs are isolated from the outside air.
JP55100240A 1980-07-21 1980-07-21 Glass-sealed semiconductor device Expired JPS5946420B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP55100240A JPS5946420B2 (en) 1980-07-21 1980-07-21 Glass-sealed semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55100240A JPS5946420B2 (en) 1980-07-21 1980-07-21 Glass-sealed semiconductor device

Publications (2)

Publication Number Publication Date
JPS5724549A true JPS5724549A (en) 1982-02-09
JPS5946420B2 JPS5946420B2 (en) 1984-11-12

Family

ID=14268720

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55100240A Expired JPS5946420B2 (en) 1980-07-21 1980-07-21 Glass-sealed semiconductor device

Country Status (1)

Country Link
JP (1) JPS5946420B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01207958A (en) * 1988-02-16 1989-08-21 Fuji Electric Co Ltd Dhd type glass sealed diode

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5218662U (en) * 1975-07-28 1977-02-09

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5218662B2 (en) * 1971-11-15 1977-05-23

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5218662U (en) * 1975-07-28 1977-02-09

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01207958A (en) * 1988-02-16 1989-08-21 Fuji Electric Co Ltd Dhd type glass sealed diode

Also Published As

Publication number Publication date
JPS5946420B2 (en) 1984-11-12

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