JPS5723418B2 - - Google Patents

Info

Publication number
JPS5723418B2
JPS5723418B2 JP561573A JP561573A JPS5723418B2 JP S5723418 B2 JPS5723418 B2 JP S5723418B2 JP 561573 A JP561573 A JP 561573A JP 561573 A JP561573 A JP 561573A JP S5723418 B2 JPS5723418 B2 JP S5723418B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP561573A
Other languages
Japanese (ja)
Other versions
JPS4888871A (US20020167097A1-20021114-C00005.png
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS4888871A publication Critical patent/JPS4888871A/ja
Publication of JPS5723418B2 publication Critical patent/JPS5723418B2/ja
Expired legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691Handling of masks or workpieces
    • G03F7/707Chucks, e.g. chucking or un-chucking operations or structural details
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S264/00Plastic and nonmetallic article shaping or treating: processes
    • Y10S264/78Processes of molding using vacuum

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP561573A 1972-02-02 1973-01-11 Expired JPS5723418B2 (US20020167097A1-20021114-C00005.png)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US22368172A 1972-02-02 1972-02-02

Publications (2)

Publication Number Publication Date
JPS4888871A JPS4888871A (US20020167097A1-20021114-C00005.png) 1973-11-21
JPS5723418B2 true JPS5723418B2 (US20020167097A1-20021114-C00005.png) 1982-05-18

Family

ID=22837573

Family Applications (1)

Application Number Title Priority Date Filing Date
JP561573A Expired JPS5723418B2 (US20020167097A1-20021114-C00005.png) 1972-02-02 1973-01-11

Country Status (8)

Country Link
US (1) US3729966A (US20020167097A1-20021114-C00005.png)
JP (1) JPS5723418B2 (US20020167097A1-20021114-C00005.png)
CA (1) CA966591A (US20020167097A1-20021114-C00005.png)
CH (1) CH542666A (US20020167097A1-20021114-C00005.png)
FR (1) FR2170279B1 (US20020167097A1-20021114-C00005.png)
GB (1) GB1371023A (US20020167097A1-20021114-C00005.png)
IT (1) IT978352B (US20020167097A1-20021114-C00005.png)
NL (1) NL7300924A (US20020167097A1-20021114-C00005.png)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3853313A (en) * 1972-11-24 1974-12-10 Ibm Wafer interlocking transport system
US3786660A (en) * 1972-11-24 1974-01-22 Ibm Wafer interlocking transport system
US4093378A (en) * 1976-11-01 1978-06-06 International Business Machines Corporation Alignment apparatus
JPS5647946Y2 (US20020167097A1-20021114-C00005.png) * 1976-11-26 1981-11-10
JPS54146580A (en) * 1978-05-09 1979-11-15 Nippon Telegr & Teleph Corp <Ntt> Thin plate flattening correction mechanism
JPS5612725A (en) * 1979-07-11 1981-02-07 Hitachi Ltd Method and apparatus for setting position of wafer in projection aligner
DE2905635C2 (de) * 1979-02-14 1987-01-22 Perkin-Elmer Censor Anstalt, Vaduz Einrichtung zum Positionieren eines Werkstückes in Z-Richtung beim Projektionskopieren
JPS5772323A (en) * 1980-10-23 1982-05-06 Hitachi Ltd Thin plate flattening equipment
JPS56130738A (en) * 1980-03-19 1981-10-13 Hitachi Ltd Method and device for exposure
JPS5734336A (en) * 1980-08-11 1982-02-24 Hitachi Ltd Exposure device
US4344160A (en) * 1980-05-02 1982-08-10 The Perkin-Elmer Corporation Automatic wafer focusing and flattening system
JPS5732629A (en) * 1980-08-07 1982-02-22 Seiko Epson Corp Mask aligner
JPS6144429Y2 (US20020167097A1-20021114-C00005.png) * 1980-08-13 1986-12-15
JPS5787129A (en) * 1980-11-19 1982-05-31 Nec Corp Exposure device
JPS57205728A (en) * 1981-06-15 1982-12-16 Fujitsu Ltd Exposure device
JPS5815237A (ja) * 1981-07-21 1983-01-28 Seiko Epson Corp 半導体製造装置
JPS5867026A (ja) * 1981-10-19 1983-04-21 Hitachi Ltd ステップアンドリピート方式の露光装置
JPS58156937A (ja) * 1982-03-12 1983-09-19 Hitachi Ltd 露光装置
US4505142A (en) * 1983-08-12 1985-03-19 Haskel, Inc. Flexible high pressure conduit and hydraulic tool for swaging
US4506184A (en) * 1984-01-10 1985-03-19 Varian Associates, Inc. Deformable chuck driven by piezoelectric means
US4607525A (en) * 1984-10-09 1986-08-26 General Signal Corporation Height measuring system
JPS611019A (ja) * 1985-05-13 1986-01-07 Hitachi Ltd 露光方法
JPS611020A (ja) * 1985-05-13 1986-01-07 Hitachi Ltd 露光装置
US5115545A (en) * 1989-03-28 1992-05-26 Matsushita Electric Industrial Co., Ltd. Apparatus for connecting semiconductor devices to wiring boards
US5319570A (en) * 1991-10-09 1994-06-07 International Business Machines Corporation Control of large scale topography on silicon wafers
KR100568032B1 (ko) * 2003-06-24 2006-04-05 동부아남반도체 주식회사 포토레지스트 코팅불량 감지방법 및 그 검출장치

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3180011A (en) * 1960-09-01 1965-04-27 Olin Mathieson Hollow article manufacture by fluid pressure
US3109264A (en) * 1961-07-06 1963-11-05 Western Electric Co Adjustable air gauge for controlling the operations of machines
US3244779A (en) * 1962-06-29 1966-04-05 Levey John Selective heating and drawing of plastics
US3496744A (en) * 1966-02-05 1970-02-24 Sumitomo Light Metal Ind Method and apparatus for controlling the contours of rolling mill rolls to obtain metal sheet or strip of superior flatness
FR1534439A (fr) * 1966-08-19 1968-07-26 Yawata Iron & Steel Co Appareil pour la mesure d'un déplacement sans pièce de contact
US3487133A (en) * 1967-02-20 1969-12-30 John Lindsay Method for making relief maps
BE704898A (US20020167097A1-20021114-C00005.png) * 1967-10-10 1968-02-15
US3599288A (en) * 1969-01-23 1971-08-17 Lab For Electronics Inc Scan average memory control system
DE1953900A1 (de) * 1969-10-25 1971-05-27 Licentia Gmbh Vorrichtung zur zwischenzeitlichen Halterung von zu bearbeitenden Gegenstaenden unterschiedlicher Groesse

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JOURNAL OF THE OPTICAL SOCIETY OF AMERICA#V45#N12#M12=1955 *

Also Published As

Publication number Publication date
GB1371023A (en) 1974-10-23
DE2304489A1 (de) 1973-08-16
FR2170279A1 (US20020167097A1-20021114-C00005.png) 1973-09-14
IT978352B (it) 1974-09-20
FR2170279B1 (US20020167097A1-20021114-C00005.png) 1976-04-30
NL7300924A (US20020167097A1-20021114-C00005.png) 1973-08-06
CA966591A (en) 1975-04-22
JPS4888871A (US20020167097A1-20021114-C00005.png) 1973-11-21
DE2304489B2 (de) 1975-07-17
CH542666A (de) 1973-10-15
US3729966A (en) 1973-05-01

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