JPS572328A - Composition for adhesive - Google Patents
Composition for adhesiveInfo
- Publication number
- JPS572328A JPS572328A JP7591180A JP7591180A JPS572328A JP S572328 A JPS572328 A JP S572328A JP 7591180 A JP7591180 A JP 7591180A JP 7591180 A JP7591180 A JP 7591180A JP S572328 A JPS572328 A JP S572328A
- Authority
- JP
- Japan
- Prior art keywords
- alkyl
- thermosetting resin
- formula
- blending
- halogen
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000853 adhesive Substances 0.000 title abstract 2
- 230000001070 adhesive effect Effects 0.000 title abstract 2
- 239000000203 mixture Substances 0.000 title abstract 2
- 125000000217 alkyl group Chemical group 0.000 abstract 3
- 150000001875 compounds Chemical class 0.000 abstract 3
- 229920005989 resin Polymers 0.000 abstract 3
- 239000011347 resin Substances 0.000 abstract 3
- 229920001187 thermosetting polymer Polymers 0.000 abstract 3
- -1 e.g. Chemical compound 0.000 abstract 2
- 229910052736 halogen Inorganic materials 0.000 abstract 2
- 150000002367 halogens Chemical class 0.000 abstract 2
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 abstract 2
- 238000002156 mixing Methods 0.000 abstract 2
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 abstract 2
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 abstract 1
- CDAWCLOXVUBKRW-UHFFFAOYSA-N 2-aminophenol Chemical compound NC1=CC=CC=C1O CDAWCLOXVUBKRW-UHFFFAOYSA-N 0.000 abstract 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 abstract 1
- FLROJJGKUKLCAE-UHFFFAOYSA-N 3-amino-2-methylphenol Chemical compound CC1=C(N)C=CC=C1O FLROJJGKUKLCAE-UHFFFAOYSA-N 0.000 abstract 1
- 239000004593 Epoxy Substances 0.000 abstract 1
- 239000002131 composite material Substances 0.000 abstract 1
Landscapes
- Laminated Bodies (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
- Epoxy Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7591180A JPS572328A (en) | 1980-06-05 | 1980-06-05 | Composition for adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7591180A JPS572328A (en) | 1980-06-05 | 1980-06-05 | Composition for adhesive |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS572328A true JPS572328A (en) | 1982-01-07 |
| JPS648037B2 JPS648037B2 (enrdf_load_stackoverflow) | 1989-02-10 |
Family
ID=13589982
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7591180A Granted JPS572328A (en) | 1980-06-05 | 1980-06-05 | Composition for adhesive |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS572328A (enrdf_load_stackoverflow) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5941358A (ja) * | 1982-08-31 | 1984-03-07 | Toshiba Chem Corp | 耐熱接着剤用組成物 |
| JPS60155224A (ja) * | 1984-01-24 | 1985-08-15 | Toshiba Chem Corp | 封止用樹脂組成物 |
| JPS60161423A (ja) * | 1984-02-01 | 1985-08-23 | Toshiba Chem Corp | 封止用樹脂組成物 |
| WO2007142140A1 (ja) * | 2006-06-06 | 2007-12-13 | Hitachi Chemical Company, Ltd. | 酸性置換基と不飽和マレイミド基を有する硬化剤の製造法並びに熱硬化性樹脂組成物、プリプレグ及び積層板 |
| JP2010229356A (ja) * | 2009-03-27 | 2010-10-14 | Hitachi Chem Co Ltd | 熱硬化性絶縁樹脂組成物、並びにこれを用いた支持体付絶縁フィルム、プリプレグ、積層板及び多層プリント配線板 |
-
1980
- 1980-06-05 JP JP7591180A patent/JPS572328A/ja active Granted
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5941358A (ja) * | 1982-08-31 | 1984-03-07 | Toshiba Chem Corp | 耐熱接着剤用組成物 |
| JPS60155224A (ja) * | 1984-01-24 | 1985-08-15 | Toshiba Chem Corp | 封止用樹脂組成物 |
| JPS60161423A (ja) * | 1984-02-01 | 1985-08-23 | Toshiba Chem Corp | 封止用樹脂組成物 |
| WO2007142140A1 (ja) * | 2006-06-06 | 2007-12-13 | Hitachi Chemical Company, Ltd. | 酸性置換基と不飽和マレイミド基を有する硬化剤の製造法並びに熱硬化性樹脂組成物、プリプレグ及び積層板 |
| US8461332B2 (en) | 2006-06-06 | 2013-06-11 | Hitachi Chemical Company, Ltd. | Method for producing curing agent having acidic substituent and unsaturated maleimide group, thermosetting resin composition, prepreg, and laminate |
| US8796473B2 (en) | 2006-06-06 | 2014-08-05 | Hitachi Chemical Company, Ltd. | Method for producing curing agent having acidic substituent and unsaturated maleimide group, thermosetting resin composition, prepreg, and laminate |
| JP2010229356A (ja) * | 2009-03-27 | 2010-10-14 | Hitachi Chem Co Ltd | 熱硬化性絶縁樹脂組成物、並びにこれを用いた支持体付絶縁フィルム、プリプレグ、積層板及び多層プリント配線板 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS648037B2 (enrdf_load_stackoverflow) | 1989-02-10 |
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