JPS57206055A - Cooling system for electronic device - Google Patents

Cooling system for electronic device

Info

Publication number
JPS57206055A
JPS57206055A JP56089578A JP8957881A JPS57206055A JP S57206055 A JPS57206055 A JP S57206055A JP 56089578 A JP56089578 A JP 56089578A JP 8957881 A JP8957881 A JP 8957881A JP S57206055 A JPS57206055 A JP S57206055A
Authority
JP
Japan
Prior art keywords
metal foil
semiconductor devices
protrusions
substrate
cooling water
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56089578A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6251498B2 (enExample
Inventor
Motohiro Sato
Noriyuki Ashiwake
Akio Yasukawa
Susumu Hioki
Fumiyuki Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP56089578A priority Critical patent/JPS57206055A/ja
Publication of JPS57206055A publication Critical patent/JPS57206055A/ja
Publication of JPS6251498B2 publication Critical patent/JPS6251498B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
    • H10W40/77—Auxiliary members characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07251—Connecting or disconnecting of bump connectors characterised by changes in properties of the bump connectors during connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP56089578A 1981-06-12 1981-06-12 Cooling system for electronic device Granted JPS57206055A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56089578A JPS57206055A (en) 1981-06-12 1981-06-12 Cooling system for electronic device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56089578A JPS57206055A (en) 1981-06-12 1981-06-12 Cooling system for electronic device

Publications (2)

Publication Number Publication Date
JPS57206055A true JPS57206055A (en) 1982-12-17
JPS6251498B2 JPS6251498B2 (enExample) 1987-10-30

Family

ID=13974675

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56089578A Granted JPS57206055A (en) 1981-06-12 1981-06-12 Cooling system for electronic device

Country Status (1)

Country Link
JP (1) JPS57206055A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4531146A (en) * 1983-07-14 1985-07-23 Cutchaw John M Apparatus for cooling high-density integrated circuit packages

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6275599U (enExample) * 1985-10-30 1987-05-14
JPH01106992U (enExample) * 1988-01-06 1989-07-19

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4531146A (en) * 1983-07-14 1985-07-23 Cutchaw John M Apparatus for cooling high-density integrated circuit packages

Also Published As

Publication number Publication date
JPS6251498B2 (enExample) 1987-10-30

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