JPS5720347A - Synthetic foil for printed wiring and its manufacture - Google Patents

Synthetic foil for printed wiring and its manufacture

Info

Publication number
JPS5720347A
JPS5720347A JP9505380A JP9505380A JPS5720347A JP S5720347 A JPS5720347 A JP S5720347A JP 9505380 A JP9505380 A JP 9505380A JP 9505380 A JP9505380 A JP 9505380A JP S5720347 A JPS5720347 A JP S5720347A
Authority
JP
Japan
Prior art keywords
manufacture
printed wiring
synthetic foil
foil
synthetic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9505380A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6134385B2 (enrdf_load_stackoverflow
Inventor
Motoaki Saiguchi
Kazuyoshi Aso
Kazuo Yajima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Denkai Co Ltd
Original Assignee
Nippon Denkai Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Denkai Co Ltd filed Critical Nippon Denkai Co Ltd
Priority to JP9505380A priority Critical patent/JPS5720347A/ja
Publication of JPS5720347A publication Critical patent/JPS5720347A/ja
Publication of JPS6134385B2 publication Critical patent/JPS6134385B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Parts Printed On Printed Circuit Boards (AREA)
  • Laminated Bodies (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP9505380A 1980-07-14 1980-07-14 Synthetic foil for printed wiring and its manufacture Granted JPS5720347A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9505380A JPS5720347A (en) 1980-07-14 1980-07-14 Synthetic foil for printed wiring and its manufacture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9505380A JPS5720347A (en) 1980-07-14 1980-07-14 Synthetic foil for printed wiring and its manufacture

Publications (2)

Publication Number Publication Date
JPS5720347A true JPS5720347A (en) 1982-02-02
JPS6134385B2 JPS6134385B2 (enrdf_load_stackoverflow) 1986-08-07

Family

ID=14127301

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9505380A Granted JPS5720347A (en) 1980-07-14 1980-07-14 Synthetic foil for printed wiring and its manufacture

Country Status (1)

Country Link
JP (1) JPS5720347A (enrdf_load_stackoverflow)

Cited By (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4619871A (en) * 1984-06-28 1986-10-28 Fukuda Metal Foil & Powder Co., Ltd. Copper foil for printed circuit board
JPS6256583A (ja) * 1985-09-05 1987-03-12 Matsushita Electric Works Ltd 積層板
JPH0373338A (ja) * 1989-05-17 1991-03-28 Fukuda Metal Foil & Powder Co Ltd 複合箔とその製法
US5413838A (en) * 1991-06-18 1995-05-09 Sumitomo Bakelite Company Limited Both-side roughened copper foil with protection film
US5779870A (en) * 1993-03-05 1998-07-14 Polyclad Laminates, Inc. Method of manufacturing laminates and printed circuit boards
WO2002024444A1 (fr) * 2000-09-22 2002-03-28 Circuit Foil Japan Co., Ltd. Feuille de cuivre pour carte de connexions ultrafine haute densite
JP2002292788A (ja) * 2001-03-30 2002-10-09 Nippon Denkai Kk 複合銅箔及び該複合銅箔の製造方法
JP2004042579A (ja) * 2002-07-16 2004-02-12 Ube Ind Ltd 銅張積層板及びその製造方法
JP2004090488A (ja) * 2002-08-30 2004-03-25 Panac Co Ltd 金属層転写シート
JP2004289109A (ja) * 2003-03-05 2004-10-14 Shinko Electric Ind Co Ltd レーザ加工方法およびこれに用いるキャリア付金属箔
JP2007186782A (ja) * 2005-12-15 2007-07-26 Furukawa Circuit Foil Kk キャリア付き極薄銅箔及びプリント配線基板
JP2007186781A (ja) * 2005-12-15 2007-07-26 Furukawa Circuit Foil Kk キャリア付き極薄銅箔及びプリント配線基板
JP2007216687A (ja) * 2007-04-20 2007-08-30 Ube Ind Ltd 銅張積層板の製造方法、電子部品用基板の製造方法
JP2012102407A (ja) * 2005-12-15 2012-05-31 Furukawa Electric Co Ltd:The キャリア付き極薄銅箔及びプリント配線板
WO2013118416A1 (ja) * 2012-02-06 2013-08-15 Jx日鉱日石金属株式会社 キャリア付銅箔、キャリア付銅箔の製造方法、プリント配線板、プリント回路板及び銅張積層板
JP5298252B1 (ja) * 2013-02-14 2013-09-25 Ｊｘ日鉱日石金属株式会社 キャリア付銅箔、キャリア付銅箔の製造方法、プリント配線板、プリント回路板、銅張積層板、及び、プリント配線板の製造方法
WO2013161334A1 (ja) * 2012-04-24 2013-10-31 Jx日鉱日石金属株式会社 キャリア付銅箔、キャリア付銅箔の製造方法及びプリント配線板
JP2015142976A (ja) * 2014-01-31 2015-08-06 セーレン株式会社 金属箔積層体、およびその製造方法
JP2015225997A (ja) * 2014-05-29 2015-12-14 富士通株式会社 配線基板の製造方法
CN108699673A (zh) * 2016-02-29 2018-10-23 三井金属矿业株式会社 带载体的铜箔、以及带布线层的无芯支撑体和印刷电路板的制造方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5156873B1 (ja) * 2012-07-25 2013-03-06 Ｊｘ日鉱日石金属株式会社 キャリア付銅箔
US9955588B1 (en) * 2016-11-28 2018-04-24 Chang Chun Petrochemical Co., Ltd. Multilayer carrier foil

Cited By (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4619871A (en) * 1984-06-28 1986-10-28 Fukuda Metal Foil & Powder Co., Ltd. Copper foil for printed circuit board
JPS6256583A (ja) * 1985-09-05 1987-03-12 Matsushita Electric Works Ltd 積層板
JPH0373338A (ja) * 1989-05-17 1991-03-28 Fukuda Metal Foil & Powder Co Ltd 複合箔とその製法
US5114543A (en) * 1989-05-17 1992-05-19 Fukuda Kinoku Hakafun Kogyo Kabushiki Kaisha Method of making thin copper foil for printed wiring board
US5413838A (en) * 1991-06-18 1995-05-09 Sumitomo Bakelite Company Limited Both-side roughened copper foil with protection film
US5779870A (en) * 1993-03-05 1998-07-14 Polyclad Laminates, Inc. Method of manufacturing laminates and printed circuit boards
US7026059B2 (en) 2000-09-22 2006-04-11 Circuit Foil Japan Co., Ltd. Copper foil for high-density ultrafine printed wiring boad
JP2006022406A (ja) * 2000-09-22 2006-01-26 Furukawa Circuit Foil Kk キャリア付き極薄銅箔
WO2002024444A1 (fr) * 2000-09-22 2002-03-28 Circuit Foil Japan Co., Ltd. Feuille de cuivre pour carte de connexions ultrafine haute densite
US7175920B2 (en) 2000-09-22 2007-02-13 Circuit Foil Japan Co., Ltd. Copper foil for high-density ultra-fine printed wiring board
JP2002292788A (ja) * 2001-03-30 2002-10-09 Nippon Denkai Kk 複合銅箔及び該複合銅箔の製造方法
JP2004042579A (ja) * 2002-07-16 2004-02-12 Ube Ind Ltd 銅張積層板及びその製造方法
JP2004090488A (ja) * 2002-08-30 2004-03-25 Panac Co Ltd 金属層転写シート
JP2004289109A (ja) * 2003-03-05 2004-10-14 Shinko Electric Ind Co Ltd レーザ加工方法およびこれに用いるキャリア付金属箔
JP2007186781A (ja) * 2005-12-15 2007-07-26 Furukawa Circuit Foil Kk キャリア付き極薄銅箔及びプリント配線基板
JP2007186782A (ja) * 2005-12-15 2007-07-26 Furukawa Circuit Foil Kk キャリア付き極薄銅箔及びプリント配線基板
JP2012102407A (ja) * 2005-12-15 2012-05-31 Furukawa Electric Co Ltd:The キャリア付き極薄銅箔及びプリント配線板
JP2007216687A (ja) * 2007-04-20 2007-08-30 Ube Ind Ltd 銅張積層板の製造方法、電子部品用基板の製造方法
WO2013118416A1 (ja) * 2012-02-06 2013-08-15 Jx日鉱日石金属株式会社 キャリア付銅箔、キャリア付銅箔の製造方法、プリント配線板、プリント回路板及び銅張積層板
WO2013161334A1 (ja) * 2012-04-24 2013-10-31 Jx日鉱日石金属株式会社 キャリア付銅箔、キャリア付銅箔の製造方法及びプリント配線板
JPWO2013161334A1 (ja) * 2012-04-24 2015-12-24 Jx日鉱日石金属株式会社 キャリア付銅箔、キャリア付銅箔の製造方法及びプリント配線板
JP5298252B1 (ja) * 2013-02-14 2013-09-25 Ｊｘ日鉱日石金属株式会社 キャリア付銅箔、キャリア付銅箔の製造方法、プリント配線板、プリント回路板、銅張積層板、及び、プリント配線板の製造方法
JP2015142976A (ja) * 2014-01-31 2015-08-06 セーレン株式会社 金属箔積層体、およびその製造方法
JP2015225997A (ja) * 2014-05-29 2015-12-14 富士通株式会社 配線基板の製造方法
CN108699673A (zh) * 2016-02-29 2018-10-23 三井金属矿业株式会社 带载体的铜箔、以及带布线层的无芯支撑体和印刷电路板的制造方法
CN108699673B (zh) * 2016-02-29 2020-09-11 三井金属矿业株式会社 带载体的铜箔、以及带布线层的无芯支撑体和印刷电路板的制造方法

Also Published As

Publication number Publication date
JPS6134385B2 (enrdf_load_stackoverflow) 1986-08-07

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