JPS57201036A - Bonding mistake detector in semiconductor wire bonder - Google Patents

Bonding mistake detector in semiconductor wire bonder

Info

Publication number
JPS57201036A
JPS57201036A JP56086110A JP8611081A JPS57201036A JP S57201036 A JPS57201036 A JP S57201036A JP 56086110 A JP56086110 A JP 56086110A JP 8611081 A JP8611081 A JP 8611081A JP S57201036 A JPS57201036 A JP S57201036A
Authority
JP
Japan
Prior art keywords
wire
guide
tension
tool
bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56086110A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6229898B2 (enExample
Inventor
Kenichi Oku
Yutaka Makino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP56086110A priority Critical patent/JPS57201036A/ja
Publication of JPS57201036A publication Critical patent/JPS57201036A/ja
Publication of JPS6229898B2 publication Critical patent/JPS6229898B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/0711
    • H10W72/07141
    • H10W72/07168
    • H10W72/075
    • H10W72/07502
    • H10W72/07551
    • H10W72/50
    • H10W72/536
    • H10W72/5363
    • H10W72/932

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Wire Bonding (AREA)
JP56086110A 1981-06-03 1981-06-03 Bonding mistake detector in semiconductor wire bonder Granted JPS57201036A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56086110A JPS57201036A (en) 1981-06-03 1981-06-03 Bonding mistake detector in semiconductor wire bonder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56086110A JPS57201036A (en) 1981-06-03 1981-06-03 Bonding mistake detector in semiconductor wire bonder

Publications (2)

Publication Number Publication Date
JPS57201036A true JPS57201036A (en) 1982-12-09
JPS6229898B2 JPS6229898B2 (enExample) 1987-06-29

Family

ID=13877558

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56086110A Granted JPS57201036A (en) 1981-06-03 1981-06-03 Bonding mistake detector in semiconductor wire bonder

Country Status (1)

Country Link
JP (1) JPS57201036A (enExample)

Also Published As

Publication number Publication date
JPS6229898B2 (enExample) 1987-06-29

Similar Documents

Publication Publication Date Title
EP0354696A3 (en) Semiconductor device assembly comprising a lead frame structure
HK89384A (en) Wire bonding apparatus
JPS55118643A (en) Wire bonding process
JPS57201036A (en) Bonding mistake detector in semiconductor wire bonder
JPS5727050A (en) Lead frame and semiconductor device using said lead frame
JPS57102063A (en) Lead-tape
JPS53112060A (en) Gold wire for bonding semiconductor
ES8305534A1 (es) Procedimiento de pasivacion de dispositivos semiconductores.
JPS57106091A (en) Semiconductor laser device
JPS51140478A (en) Lead frame
FR2583028B1 (fr) Dispositif permettant de regler la tension d'un fil lors de differentes operations de transformation qu'il subit au cours de sa fabrication.
JPS536569A (en) Pellet bonding device
JPS57138150A (en) Detection of breaking of wire in wire bonding device
JPS5759341A (en) Automatic bonding method for device
JPS5378768A (en) Wire bonding method of semiconductor element
JPS5318972A (en) Monitoring method of wafer positioning state by probes
JPS5355964A (en) Automatic wire bonding device
JPS52103958A (en) Automatic wire bonding device
JPS56157040A (en) Semiconductor assembling device
JPS5467768A (en) Detector for semiconductor chip bonder
JPS5745939A (en) Semiconductor device
JPS5615056A (en) Semiconductor device
JPS5758332A (en) Manufacture of semiconductor device
JPS5467769A (en) Detector for semiconductor chip bonder
JPS55156334A (en) Wire bonding method and apparatus thereof