JPS57200549A - Continuous regeneration of chemical copper plating liquid - Google Patents

Continuous regeneration of chemical copper plating liquid

Info

Publication number
JPS57200549A
JPS57200549A JP8573781A JP8573781A JPS57200549A JP S57200549 A JPS57200549 A JP S57200549A JP 8573781 A JP8573781 A JP 8573781A JP 8573781 A JP8573781 A JP 8573781A JP S57200549 A JPS57200549 A JP S57200549A
Authority
JP
Japan
Prior art keywords
tank
plating
treatment
pump
valve
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8573781A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6341983B2 (enrdf_load_stackoverflow
Inventor
Hiroshi Kikuchi
Hitoshi Oka
Chiaki Nakatsuka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP8573781A priority Critical patent/JPS57200549A/ja
Publication of JPS57200549A publication Critical patent/JPS57200549A/ja
Publication of JPS6341983B2 publication Critical patent/JPS6341983B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01D—SEPARATION
    • B01D61/00—Processes of separation using semi-permeable membranes, e.g. dialysis, osmosis or ultrafiltration; Apparatus, accessories or auxiliary operations specially adapted therefor
    • B01D61/42—Electrodialysis; Electro-osmosis ; Electro-ultrafiltration; Membrane capacitive deionization
    • B01D61/44—Ion-selective electrodialysis

Landscapes

  • Engineering & Computer Science (AREA)
  • Water Supply & Treatment (AREA)
  • Health & Medical Sciences (AREA)
  • Urology & Nephrology (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Chemically Coating (AREA)
JP8573781A 1981-06-05 1981-06-05 Continuous regeneration of chemical copper plating liquid Granted JPS57200549A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8573781A JPS57200549A (en) 1981-06-05 1981-06-05 Continuous regeneration of chemical copper plating liquid

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8573781A JPS57200549A (en) 1981-06-05 1981-06-05 Continuous regeneration of chemical copper plating liquid

Publications (2)

Publication Number Publication Date
JPS57200549A true JPS57200549A (en) 1982-12-08
JPS6341983B2 JPS6341983B2 (enrdf_load_stackoverflow) 1988-08-19

Family

ID=13867147

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8573781A Granted JPS57200549A (en) 1981-06-05 1981-06-05 Continuous regeneration of chemical copper plating liquid

Country Status (1)

Country Link
JP (1) JPS57200549A (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06316769A (ja) * 1993-01-26 1994-11-15 Nippon Parkerizing Co Ltd 化学浴から金属イオンおよび混入物の間欠的除去装置および方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52119428A (en) * 1975-02-13 1977-10-06 Kollmorgen Tech Corp Method of separating deleterious byproducts from copper plating bath
JPS563666A (en) * 1979-06-19 1981-01-14 Hitachi Ltd Method and apparatus for regenerating chemical copper plating solution

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52119428A (en) * 1975-02-13 1977-10-06 Kollmorgen Tech Corp Method of separating deleterious byproducts from copper plating bath
JPS563666A (en) * 1979-06-19 1981-01-14 Hitachi Ltd Method and apparatus for regenerating chemical copper plating solution

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06316769A (ja) * 1993-01-26 1994-11-15 Nippon Parkerizing Co Ltd 化学浴から金属イオンおよび混入物の間欠的除去装置および方法

Also Published As

Publication number Publication date
JPS6341983B2 (enrdf_load_stackoverflow) 1988-08-19

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