JPS57195593A - Joining method for metal - Google Patents

Joining method for metal

Info

Publication number
JPS57195593A
JPS57195593A JP8096481A JP8096481A JPS57195593A JP S57195593 A JPS57195593 A JP S57195593A JP 8096481 A JP8096481 A JP 8096481A JP 8096481 A JP8096481 A JP 8096481A JP S57195593 A JPS57195593 A JP S57195593A
Authority
JP
Japan
Prior art keywords
materials
tig
cleaning
electrode
press
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8096481A
Other languages
Japanese (ja)
Inventor
Hiroshi Miyake
Akira Sato
Takao Funamoto
Takashi Fukumaki
Satoshi Ogura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP8096481A priority Critical patent/JPS57195593A/en
Publication of JPS57195593A publication Critical patent/JPS57195593A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/24—Preliminary treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Arc Welding In General (AREA)

Abstract

PURPOSE:To press-weld dissimilar materials which are difficult to joint through breakage of oxidized films by cleaning the surfaces of joining materials by the cleaning effect generated while the electrode of TIG is positive. CONSTITUTION:The inside of a chamber is evacuated and an inert gas 9 is introduced therein. The inverted current supplied from an electric power source 5 is conducted to a TIG electrode along the surface of insulated joining materials 2. The electrode is moved to the right and left to generate the TIG arc, thereby cleaning the surfaces. An insert material 8 of a m.p. lower than that of the materials 2, 2 is sandwiched between the materials 2 and 2 which are removed of oxidized films. At this time, the surface of the materials 8 is cleaned by the cleaning effect. Thereafter, these are heated by a high frequency coil 11 until the temp. lower than the m.p. of the materials 2, 2 and slightly higher than that of the material 8 is attained, and the materials 2, 2 are press-stuck from above.
JP8096481A 1981-05-29 1981-05-29 Joining method for metal Pending JPS57195593A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8096481A JPS57195593A (en) 1981-05-29 1981-05-29 Joining method for metal

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8096481A JPS57195593A (en) 1981-05-29 1981-05-29 Joining method for metal

Publications (1)

Publication Number Publication Date
JPS57195593A true JPS57195593A (en) 1982-12-01

Family

ID=13733192

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8096481A Pending JPS57195593A (en) 1981-05-29 1981-05-29 Joining method for metal

Country Status (1)

Country Link
JP (1) JPS57195593A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03171643A (en) * 1989-11-29 1991-07-25 Hitachi Ltd Jointing of metal member, method and device for manufacture of semiconductor integrated circuit device using same
WO2005071735A1 (en) * 2004-01-22 2005-08-04 Bondtech Inc. Joining method and device produced by this method and joining unit
US7168607B2 (en) * 2000-06-21 2007-01-30 Hans-Ulrich Ehrke Method and device for cleaning and then bonding substrates

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03171643A (en) * 1989-11-29 1991-07-25 Hitachi Ltd Jointing of metal member, method and device for manufacture of semiconductor integrated circuit device using same
US7168607B2 (en) * 2000-06-21 2007-01-30 Hans-Ulrich Ehrke Method and device for cleaning and then bonding substrates
WO2005071735A1 (en) * 2004-01-22 2005-08-04 Bondtech Inc. Joining method and device produced by this method and joining unit
US7784670B2 (en) 2004-01-22 2010-08-31 Bondtech Inc. Joining method and device produced by this method and joining unit
US8091764B2 (en) 2004-01-22 2012-01-10 Bondtech, Inc. Joining method and device produced by this method and joining unit
US8651363B2 (en) 2004-01-22 2014-02-18 Bondtech, Inc. Joining method and device produced by this method and joining unit

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