JPS57181787A - Laser working method - Google Patents

Laser working method

Info

Publication number
JPS57181787A
JPS57181787A JP56063962A JP6396281A JPS57181787A JP S57181787 A JPS57181787 A JP S57181787A JP 56063962 A JP56063962 A JP 56063962A JP 6396281 A JP6396281 A JP 6396281A JP S57181787 A JPS57181787 A JP S57181787A
Authority
JP
Japan
Prior art keywords
laser
work
working
scanning
melts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56063962A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0159076B2 (enrdf_load_stackoverflow
Inventor
Ken Ishikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP56063962A priority Critical patent/JPS57181787A/ja
Publication of JPS57181787A publication Critical patent/JPS57181787A/ja
Publication of JPH0159076B2 publication Critical patent/JPH0159076B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
JP56063962A 1981-04-30 1981-04-30 Laser working method Granted JPS57181787A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56063962A JPS57181787A (en) 1981-04-30 1981-04-30 Laser working method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56063962A JPS57181787A (en) 1981-04-30 1981-04-30 Laser working method

Publications (2)

Publication Number Publication Date
JPS57181787A true JPS57181787A (en) 1982-11-09
JPH0159076B2 JPH0159076B2 (enrdf_load_stackoverflow) 1989-12-14

Family

ID=13244433

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56063962A Granted JPS57181787A (en) 1981-04-30 1981-04-30 Laser working method

Country Status (1)

Country Link
JP (1) JPS57181787A (enrdf_load_stackoverflow)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004528991A (ja) * 2001-06-08 2004-09-24 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド レーザーによる部分加工
JP2010228005A (ja) * 2009-03-25 2010-10-14 Samsung Mobile Display Co Ltd 基板切断装置及びこれを用いた基板切断方法
USRE43400E1 (en) 2000-09-20 2012-05-22 Electro Scientific Industries, Inc. Laser segmented cutting, multi-step cutting, or both
DE102011108405A1 (de) * 2011-07-23 2013-01-24 Volkswagen Aktiengesellschaft Verfahren und Vorrichtung zum Einbringen einer Schnittfuge in ein Werkstück
US8383983B2 (en) 2009-03-25 2013-02-26 Samsung Display Co., Ltd. Substrate cutting apparatus and method of cutting substrate using the same
DE102013204222A1 (de) * 2013-03-12 2014-09-18 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren und system zum bearbeiten eines objekts mit einem laserstrahl

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS511836U (enrdf_load_stackoverflow) * 1974-06-19 1976-01-08

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS511836U (enrdf_load_stackoverflow) * 1974-06-19 1976-01-08

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USRE43400E1 (en) 2000-09-20 2012-05-22 Electro Scientific Industries, Inc. Laser segmented cutting, multi-step cutting, or both
USRE43487E1 (en) 2000-09-20 2012-06-26 Electro Scientific Industries, Inc. Laser segmented cutting
USRE43605E1 (en) 2000-09-20 2012-08-28 Electro Scientific Industries, Inc. Laser segmented cutting, multi-step cutting, or both
JP2004528991A (ja) * 2001-06-08 2004-09-24 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド レーザーによる部分加工
DE10296913B4 (de) 2001-06-08 2014-08-21 Electro Scientific Industries, Inc. Segmentiertes Laserschneiden
JP2010228005A (ja) * 2009-03-25 2010-10-14 Samsung Mobile Display Co Ltd 基板切断装置及びこれを用いた基板切断方法
US8383983B2 (en) 2009-03-25 2013-02-26 Samsung Display Co., Ltd. Substrate cutting apparatus and method of cutting substrate using the same
US8445814B2 (en) 2009-03-25 2013-05-21 Samsung Display Co., Ltd. Substrate cutting apparatus and method of cutting substrate using the same
TWI413564B (zh) * 2009-03-25 2013-11-01 Samsung Display Co Ltd 切割基板的設備和使用其切割基板的方法
DE102011108405A1 (de) * 2011-07-23 2013-01-24 Volkswagen Aktiengesellschaft Verfahren und Vorrichtung zum Einbringen einer Schnittfuge in ein Werkstück
DE102013204222A1 (de) * 2013-03-12 2014-09-18 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren und system zum bearbeiten eines objekts mit einem laserstrahl
DE102013204222B4 (de) * 2013-03-12 2017-09-07 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren und system zum bearbeiten eines objekts mit einem laserstrahl

Also Published As

Publication number Publication date
JPH0159076B2 (enrdf_load_stackoverflow) 1989-12-14

Similar Documents

Publication Publication Date Title
US3419321A (en) Laser optical apparatus for cutting holes
US4229640A (en) Working pieces by laser beam
US3619550A (en) Laser beam machine tool with beam manipulating apparatus
JPS5794482A (en) Pattern forming device by laser
KR920702269A (ko) 박막 정밀 가공용의 야그(yag) 레이저 가공기
IT1179945B (it) Robot a fascio laser di potenza
JPS57181787A (en) Laser working method
JPS59212185A (ja) レ−ザ加工装置
EP0428610B1 (en) Cutting using high energy radiation
GB1278471A (en) Method and apparatus for working material using laser beams
RU94020443A (ru) Способ лазерного гравирования и устройство его реализующее
DE50003042D1 (de) Verfahren und vorrichtung zum durchtrennen von flachen werkstücken aus sprödbrüchigem material
JPS5739088A (en) Laser working device
JPS55154337A (en) Cutter for multicore optical fiber
JPS5913589A (ja) レ−ザ加工装置
JPS5839728A (ja) レ−ザによる焼入方法
JPH01192492A (ja) レーザー加工方法
SE8801124D0 (sv) Forfarande for skerning av vextmaterial
ES2019107B3 (es) Conjunto empuñadura-broca para maquina de corte y de soldadura por haz laser.
JPS6415292A (en) Method for cutting bearing material for plain bearing
JPS5754001A (ja) Setsusakukakoniokerukirikuzusetsudanhoho
JPS5988333A (ja) レ−ザによるガラス加工法
JPS52100699A (en) Plural beam laser machine tool
JPS55109589A (en) Laser welding method utilizing elevation of lens
GB1059249A (en) Improvements in and relating to the working of diamonds by laser beam