JPS57167635A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS57167635A JPS57167635A JP3502281A JP3502281A JPS57167635A JP S57167635 A JPS57167635 A JP S57167635A JP 3502281 A JP3502281 A JP 3502281A JP 3502281 A JP3502281 A JP 3502281A JP S57167635 A JPS57167635 A JP S57167635A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- heat treatment
- silicon
- onto
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3502281A JPS57167635A (en) | 1981-03-11 | 1981-03-11 | Manufacture of semiconductor device |
EP82301212A EP0060676B1 (en) | 1981-03-11 | 1982-03-10 | A method for the production of a semiconductor device comprising annealing a silicon wafer |
DE8282301212T DE3280219D1 (de) | 1981-03-11 | 1982-03-10 | Verfahren zur herstellung einer halbleiteranordnung mit ausgluehen eines halbleiterkoerpers. |
IE559/82A IE55966B1 (en) | 1981-03-11 | 1982-03-11 | A method for the production of a semiconductor device comprising annealing a silicon wafer |
US06/598,544 US4597804A (en) | 1981-03-11 | 1984-04-12 | Methods of forming denuded zone in wafer by intrinsic gettering and forming bipolar transistor therein |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3502281A JPS57167635A (en) | 1981-03-11 | 1981-03-11 | Manufacture of semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS57167635A true JPS57167635A (en) | 1982-10-15 |
JPS6216537B2 JPS6216537B2 (enrdf_load_stackoverflow) | 1987-04-13 |
Family
ID=12430429
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3502281A Granted JPS57167635A (en) | 1981-03-11 | 1981-03-11 | Manufacture of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57167635A (enrdf_load_stackoverflow) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6251050U (enrdf_load_stackoverflow) * | 1985-09-20 | 1987-03-30 |
-
1981
- 1981-03-11 JP JP3502281A patent/JPS57167635A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS6216537B2 (enrdf_load_stackoverflow) | 1987-04-13 |
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