JPS57166047A - Manufacture of semiconductor chip - Google Patents

Manufacture of semiconductor chip

Info

Publication number
JPS57166047A
JPS57166047A JP5075781A JP5075781A JPS57166047A JP S57166047 A JPS57166047 A JP S57166047A JP 5075781 A JP5075781 A JP 5075781A JP 5075781 A JP5075781 A JP 5075781A JP S57166047 A JPS57166047 A JP S57166047A
Authority
JP
Japan
Prior art keywords
tape
adhesive
scraps
substrate
adhered
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5075781A
Other languages
Japanese (ja)
Inventor
Tomoshi Ueda
Hiroshi Takigawa
Mitsuo Yoshikawa
Michiharu Ito
Shigeki Hamashima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP5075781A priority Critical patent/JPS57166047A/en
Publication of JPS57166047A publication Critical patent/JPS57166047A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Abstract

PURPOSE:To obtain the flawless surface of semiconductor chip by a method wherein an organic material being soluble in a solvent is applied on a wafer, a transparent tape is adhered thereon, and after it is cut into chips, an adhesive is applied on the tape, and the organic material on the substrate is dissolved to be removed selectively. CONSTITUTION:An organic material 4 of electron wax, etc., being soluble in a solvent and having comparatively low molecular weight is applied as usual on a substrate 1 formed with elements in the regions demarcated with scribe lines. Then an adhesive 5 consisting of the principal ingredient of epoxy resin, etc., is applied thereon, and transparent and adhesive tape 6 is adhered thereon making the adhesive face upwardly. Then the substrate is cut along the scribe lines, scraps and an abrasive 7 are made to adhere on the tape 6, and moreover the scraps 7 adhered on the tape are fixed using the adhesive 8. Then it is dipt in trichlene to dissolve the wax 4 selectively, and the scraps 7 are removed together with the tape being fixed on the tape as they are. Accordingly the wafer can be separated into chips without damaging the surface of substrate by scraps.
JP5075781A 1981-04-03 1981-04-03 Manufacture of semiconductor chip Pending JPS57166047A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5075781A JPS57166047A (en) 1981-04-03 1981-04-03 Manufacture of semiconductor chip

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5075781A JPS57166047A (en) 1981-04-03 1981-04-03 Manufacture of semiconductor chip

Publications (1)

Publication Number Publication Date
JPS57166047A true JPS57166047A (en) 1982-10-13

Family

ID=12867706

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5075781A Pending JPS57166047A (en) 1981-04-03 1981-04-03 Manufacture of semiconductor chip

Country Status (1)

Country Link
JP (1) JPS57166047A (en)

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