JPS57164540A - Electric device - Google Patents

Electric device

Info

Publication number
JPS57164540A
JPS57164540A JP57019641A JP1964182A JPS57164540A JP S57164540 A JPS57164540 A JP S57164540A JP 57019641 A JP57019641 A JP 57019641A JP 1964182 A JP1964182 A JP 1964182A JP S57164540 A JPS57164540 A JP S57164540A
Authority
JP
Japan
Prior art keywords
sintered
expansion coefficient
silicon carbide
beryllium
thermal conductivity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP57019641A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0247856B2 (enExample
Inventor
Yukio Takeda
Kosuke Nakamura
Yasuo Matsushita
Tokio Ogoshi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP57019641A priority Critical patent/JPS57164540A/ja
Publication of JPS57164540A publication Critical patent/JPS57164540A/ja
Publication of JPH0247856B2 publication Critical patent/JPH0247856B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07337—Connecting techniques using a polymer adhesive, e.g. an adhesive based on silicone or epoxy
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/322—Multilayered die-attach connectors, e.g. a coating on a top surface of a core
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Die Bonding (AREA)
JP57019641A 1982-02-12 1982-02-12 Electric device Granted JPS57164540A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP57019641A JPS57164540A (en) 1982-02-12 1982-02-12 Electric device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57019641A JPS57164540A (en) 1982-02-12 1982-02-12 Electric device

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP55075601A Division JPS5815953B2 (ja) 1979-11-05 1980-06-06 電気的装置用基板

Publications (2)

Publication Number Publication Date
JPS57164540A true JPS57164540A (en) 1982-10-09
JPH0247856B2 JPH0247856B2 (enExample) 1990-10-23

Family

ID=12004847

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57019641A Granted JPS57164540A (en) 1982-02-12 1982-02-12 Electric device

Country Status (1)

Country Link
JP (1) JPS57164540A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6276525A (ja) * 1985-09-30 1987-04-08 Toshiba Corp モリブデン板とその製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5254995U (enExample) * 1975-10-18 1977-04-20
JPS572591A (en) * 1980-06-06 1982-01-07 Hitachi Ltd Electrically insulating board and method of manufacturing same

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5254995U (enExample) * 1975-10-18 1977-04-20
JPS572591A (en) * 1980-06-06 1982-01-07 Hitachi Ltd Electrically insulating board and method of manufacturing same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6276525A (ja) * 1985-09-30 1987-04-08 Toshiba Corp モリブデン板とその製造方法

Also Published As

Publication number Publication date
JPH0247856B2 (enExample) 1990-10-23

Similar Documents

Publication Publication Date Title
JPS57181356A (en) Sintered aluminum nitride body with high heat conductivity
ATE68385T1 (de) Pulvermetallverbundkoerper.
JPS6346032B2 (enExample)
GB1175780A (en) Improvements in or relating to Housings for Semiconductor Devices
KR840000049A (ko) 유전율(誘電率)이 낮은 탄화규소전기절연재 및 그 제법
JPS6490516A (en) Semiconductor porcelain material
JPS57164540A (en) Electric device
JPS56837A (en) Heat-radiating sheet
US3377522A (en) Glass molded type semiconductor device
JPS6489350A (en) Package for containing semiconductor element
JPS631269B2 (enExample)
JPS5544743A (en) Manufacture of semiconductor device
JPS52135678A (en) Semiconductor device and its productions
JPS57164550A (en) Electric device with improved heat radiating property
JPS57137356A (en) Heat conductive and electrical insulating composition
JPS63307748A (ja) 樹脂材料
JP2664063B2 (ja) 窒化アルミニウム予備焼結体、窒化アルミニウム焼結体およびそれらの製造方法
JPS57164541A (en) Electric device
JPS5752154A (en) Cooler for semiconductor
JPS57165452A (en) Resin composition having thermal conductivity
JPS6442367A (en) Aluminum nitride sintered body
JPS54111768A (en) Semiconductor device of resin sealing type
JPS5350688A (en) Production of integrated circuit device
JPS5372465A (en) Mounting method of semiconductor to radiator
JPS59111978A (ja) 電気絶縁性放熱基板材料