JPS572591A - Electrically insulating board and method of manufacturing same - Google Patents

Electrically insulating board and method of manufacturing same

Info

Publication number
JPS572591A
JPS572591A JP7560180A JP7560180A JPS572591A JP S572591 A JPS572591 A JP S572591A JP 7560180 A JP7560180 A JP 7560180A JP 7560180 A JP7560180 A JP 7560180A JP S572591 A JPS572591 A JP S572591A
Authority
JP
Japan
Prior art keywords
electrically insulating
insulating board
manufacturing same
manufacturing
same
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7560180A
Other languages
Japanese (ja)
Other versions
JPS5815953B2 (en
Inventor
Yukio Takeda
Kousuke Nakamura
Yasuo Matsushita
Tokio Oogoshi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP55075601A priority Critical patent/JPS5815953B2/en
Priority to EP80106791A priority patent/EP0028802B1/en
Priority to DE8080106791T priority patent/DE3064598D1/en
Priority to US06/203,554 priority patent/US4370421A/en
Publication of JPS572591A publication Critical patent/JPS572591A/en
Priority to US06/450,566 priority patent/US4571610A/en
Publication of JPS5815953B2 publication Critical patent/JPS5815953B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01004—Beryllium [Be]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01013—Aluminum [Al]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]

Landscapes

  • Inorganic Insulating Materials (AREA)
  • Ceramic Products (AREA)
  • Die Bonding (AREA)
JP55075601A 1979-11-05 1980-06-06 Board for electrical equipment Expired JPS5815953B2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP55075601A JPS5815953B2 (en) 1980-06-06 1980-06-06 Board for electrical equipment
EP80106791A EP0028802B1 (en) 1979-11-05 1980-11-04 Electrically insulating substrate and a method of making such a substrate
DE8080106791T DE3064598D1 (en) 1979-11-05 1980-11-04 Electrically insulating substrate and a method of making such a substrate
US06/203,554 US4370421A (en) 1979-11-05 1980-11-05 Electrically insulating substrate and a method of making such a substrate
US06/450,566 US4571610A (en) 1979-11-05 1982-12-16 Semiconductor device having electrically insulating substrate of SiC

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55075601A JPS5815953B2 (en) 1980-06-06 1980-06-06 Board for electrical equipment

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP57019641A Division JPS57164540A (en) 1982-02-12 1982-02-12 Electric device

Publications (2)

Publication Number Publication Date
JPS572591A true JPS572591A (en) 1982-01-07
JPS5815953B2 JPS5815953B2 (en) 1983-03-28

Family

ID=13580880

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55075601A Expired JPS5815953B2 (en) 1979-11-05 1980-06-06 Board for electrical equipment

Country Status (1)

Country Link
JP (1) JPS5815953B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57164540A (en) * 1982-02-12 1982-10-09 Hitachi Ltd Electric device
JPS58190873A (en) * 1982-04-30 1983-11-07 株式会社日立製作所 Sic sintered body with high heat conductive electric insulativity
JPS5969473A (en) * 1982-10-06 1984-04-19 株式会社日立製作所 Sintering silicon carbide powder composition
US4796077A (en) * 1986-08-13 1989-01-03 Hitachi, Ltd. Electrical insulating, sintered aluminum nitride body having a high thermal conductivity and process for preparing the same

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57164540A (en) * 1982-02-12 1982-10-09 Hitachi Ltd Electric device
JPH0247856B2 (en) * 1982-02-12 1990-10-23 Hitachi Ltd
JPS58190873A (en) * 1982-04-30 1983-11-07 株式会社日立製作所 Sic sintered body with high heat conductive electric insulativity
JPS5969473A (en) * 1982-10-06 1984-04-19 株式会社日立製作所 Sintering silicon carbide powder composition
JPS631269B2 (en) * 1982-10-06 1988-01-12 Hitachi Ltd
US4796077A (en) * 1986-08-13 1989-01-03 Hitachi, Ltd. Electrical insulating, sintered aluminum nitride body having a high thermal conductivity and process for preparing the same

Also Published As

Publication number Publication date
JPS5815953B2 (en) 1983-03-28

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