JPS57161092A - Plating apparatus - Google Patents

Plating apparatus

Info

Publication number
JPS57161092A
JPS57161092A JP4560481A JP4560481A JPS57161092A JP S57161092 A JPS57161092 A JP S57161092A JP 4560481 A JP4560481 A JP 4560481A JP 4560481 A JP4560481 A JP 4560481A JP S57161092 A JPS57161092 A JP S57161092A
Authority
JP
Japan
Prior art keywords
vessel
anode
cathode
plating
pipe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4560481A
Other languages
Japanese (ja)
Other versions
JPS613400B2 (en
Inventor
Shigeru Nishizawa
Hideo Hoshino
Chiyomatsu Akimoto
Sadao Inoue
Katsumi Nishino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP4560481A priority Critical patent/JPS57161092A/en
Publication of JPS57161092A publication Critical patent/JPS57161092A/en
Publication of JPS613400B2 publication Critical patent/JPS613400B2/ja
Granted legal-status Critical Current

Links

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  • Electroplating Methods And Accessories (AREA)

Abstract

PURPOSE: To enhance the plating efficiency by connecting an anode vessel filled with a plating soln. to a cathode vessel through a liq. carrying pipe and by spouting the plating soln. in the anode vessel into the cathode vessel from nozzles connected to the pipe in the cathode vessel.
CONSTITUTION: An anode vessel 1 and a cathode vessel 2 are set separately, and they are connected at the bottoms through a liq. carrying pipe 7 provided with a pump P and a filter F. Nozzles 8 connected to the pipe 7 are arranged in the vessel 2. A plating soln. 3 in the vessel 1 is fed under pressure through the pump P and the filter F and spouted into the vessel 2 from the nozzles 8. As a result, the current distribution in the vessel 2 is made independent of the shape of the anode 5, so the shape of the anode 5 can be changed arbitrarily, the current density of the anode 5 can be selected arbitrarily, and the plating efficiency is enhanced.
COPYRIGHT: (C)1982,JPO&Japio
JP4560481A 1981-03-30 1981-03-30 Plating apparatus Granted JPS57161092A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4560481A JPS57161092A (en) 1981-03-30 1981-03-30 Plating apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4560481A JPS57161092A (en) 1981-03-30 1981-03-30 Plating apparatus

Publications (2)

Publication Number Publication Date
JPS57161092A true JPS57161092A (en) 1982-10-04
JPS613400B2 JPS613400B2 (en) 1986-01-31

Family

ID=12723951

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4560481A Granted JPS57161092A (en) 1981-03-30 1981-03-30 Plating apparatus

Country Status (1)

Country Link
JP (1) JPS57161092A (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0373900U (en) * 1989-11-22 1991-07-25

Also Published As

Publication number Publication date
JPS613400B2 (en) 1986-01-31

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