JPS57151307A - Metal mold device - Google Patents

Metal mold device

Info

Publication number
JPS57151307A
JPS57151307A JP3833281A JP3833281A JPS57151307A JP S57151307 A JPS57151307 A JP S57151307A JP 3833281 A JP3833281 A JP 3833281A JP 3833281 A JP3833281 A JP 3833281A JP S57151307 A JPS57151307 A JP S57151307A
Authority
JP
Japan
Prior art keywords
mold
heat
cooling
molding surface
elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3833281A
Other languages
Japanese (ja)
Other versions
JPS603979B2 (en
Inventor
Toshio Akiyama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yazaki Kako Corp
Original Assignee
Yazaki Kako Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yazaki Kako Corp filed Critical Yazaki Kako Corp
Priority to JP3833281A priority Critical patent/JPS603979B2/en
Publication of JPS57151307A publication Critical patent/JPS57151307A/en
Publication of JPS603979B2 publication Critical patent/JPS603979B2/en
Expired legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00Moulds or cores; Details thereof or accessories therefor
    • B29C33/02Moulds or cores; Details thereof or accessories therefor with incorporated heating or cooling means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00Moulds or cores; Details thereof or accessories therefor
    • B29C33/02Moulds or cores; Details thereof or accessories therefor with incorporated heating or cooling means
    • B29C33/04Moulds or cores; Details thereof or accessories therefor with incorporated heating or cooling means using liquids, gas or steam
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/72Heating or cooling
    • B29C45/73Heating or cooling of the mould
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/72Heating or cooling
    • B29C45/73Heating or cooling of the mould
    • B29C2045/7368Heating or cooling of the mould combining a heating or cooling fluid and non-fluid means

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

PURPOSE:To enhance cooling efficiency and capability of a metal mold device by a method wherein a thermoelectric element is placed in a mold near a molding surface, and they are brought into close contact with the mold while directing heat-absorbing surfaces of the elements toward the molding surface side so as to cool heat-radiating surfaces. CONSTITUTION:When producing a molded article S while cooling strongly a part in the vicinity of a sprue 8, the thermoelectric element 5 is provided between the main body of the fixed-side mold 1b and a nozzle support 7 while directing the heat-absorbing surfaces of the element 5 toward the molding surface side of the mold 1, utilizing the support 7. The heat-radiating surfaces of the elements 5 are cooled by cooling water passed through holes 3 for cooling. When the molded article S part is to be cooled strongly, the elements 5 are provided between a molding surface part of the movable-side metal mold 1a facing against the sprue 8 and a cooling insert 2, with the heat-absorbing surfaces of the elements 5 faced to the molding surface of the mold 1a, and the heat-radiating surfaces 5 is cooled by cooling water passing through the hole 3. In addition, water is also passed through grooves 4 for cooling so as to cool the mold 1b as in a conventional case.
JP3833281A 1981-03-17 1981-03-17 mold equipment Expired JPS603979B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3833281A JPS603979B2 (en) 1981-03-17 1981-03-17 mold equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3833281A JPS603979B2 (en) 1981-03-17 1981-03-17 mold equipment

Publications (2)

Publication Number Publication Date
JPS57151307A true JPS57151307A (en) 1982-09-18
JPS603979B2 JPS603979B2 (en) 1985-01-31

Family

ID=12522318

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3833281A Expired JPS603979B2 (en) 1981-03-17 1981-03-17 mold equipment

Country Status (1)

Country Link
JP (1) JPS603979B2 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0655306A2 (en) * 1993-11-03 1995-05-31 Schmalbach-Lubeca AG Manufacturing of multi-layer preforms with scrap PET
WO2007121934A1 (en) * 2006-04-21 2007-11-01 Tecos, Slovenian Tool And Die Development Centre Mould for thermally processing polymeric moulding materials, temperature controlled mould system and polymer processing system
EP2222427A1 (en) * 2007-11-29 2010-09-01 Husky Injection Molding Systems S.A. A gate insert
WO2012077925A2 (en) 2010-12-10 2012-06-14 Samsung Electronics Co., Ltd. Injection mold
EP2754543A1 (en) * 2013-01-11 2014-07-16 Friedrich Glas Mould core, mould insert and moulding tool for producing moulded parts

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0655306A2 (en) * 1993-11-03 1995-05-31 Schmalbach-Lubeca AG Manufacturing of multi-layer preforms with scrap PET
EP0655306A3 (en) * 1993-11-03 1995-08-02 Schmalbach Lubeca Manufacturing of multi-layer preforms with scrap PET.
WO2007121934A1 (en) * 2006-04-21 2007-11-01 Tecos, Slovenian Tool And Die Development Centre Mould for thermally processing polymeric moulding materials, temperature controlled mould system and polymer processing system
EP2222427A1 (en) * 2007-11-29 2010-09-01 Husky Injection Molding Systems S.A. A gate insert
EP2222427A4 (en) * 2007-11-29 2011-03-09 Husky Injection Molding A gate insert
WO2012077925A2 (en) 2010-12-10 2012-06-14 Samsung Electronics Co., Ltd. Injection mold
EP2648883A2 (en) * 2010-12-10 2013-10-16 Samsung Electronics Co., Ltd Injection mold
EP2648883A4 (en) * 2010-12-10 2015-01-21 Samsung Electronics Co Ltd Injection mold
EP2754543A1 (en) * 2013-01-11 2014-07-16 Friedrich Glas Mould core, mould insert and moulding tool for producing moulded parts

Also Published As

Publication number Publication date
JPS603979B2 (en) 1985-01-31

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