JPS57139937A - Alignment device for discoid body with orientation flat section - Google Patents

Alignment device for discoid body with orientation flat section

Info

Publication number
JPS57139937A
JPS57139937A JP2531081A JP2531081A JPS57139937A JP S57139937 A JPS57139937 A JP S57139937A JP 2531081 A JP2531081 A JP 2531081A JP 2531081 A JP2531081 A JP 2531081A JP S57139937 A JPS57139937 A JP S57139937A
Authority
JP
Japan
Prior art keywords
wafer
alignment device
contacted
orientation flat
flat section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2531081A
Other languages
Japanese (ja)
Other versions
JPS6127906B2 (en
Inventor
Yoshio Watanabe
Yoshinobu Ono
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP2531081A priority Critical patent/JPS57139937A/en
Publication of JPS57139937A publication Critical patent/JPS57139937A/en
Publication of JPS6127906B2 publication Critical patent/JPS6127906B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
    • H01L21/67787—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks with angular orientation of the workpieces

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)

Abstract

PURPOSE:To obtain the alignment device for the discoid body with the orientation flat section, structure and operation thereof are simplified, by orienting a wafer by using a pressure fluid. CONSTITUTION:The wafer is oriented (moved and turned) automatically by using the pressure fluid such as pressure air and positioned. The wafer 30 set into the guide section 21 of an instrument such as a substrate 11 is carried by air blown from each ejecting hole 151-15n, adsorbed at the position of a sucking hole 18 and stopped once. A pressure sensor 23 detects the stoppage, and the wafer is advanced by the air of each ejecting hole 171-17m, and contacted with pins 12, 13. The wafer 30 contacted with the pins 12, 13 is turned by air blown to the back, pushed in the pin 14 direction by air blown from ejecting holes 161, 162, contacted with a pin 14 and accurately positioned.
JP2531081A 1981-02-23 1981-02-23 Alignment device for discoid body with orientation flat section Granted JPS57139937A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2531081A JPS57139937A (en) 1981-02-23 1981-02-23 Alignment device for discoid body with orientation flat section

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2531081A JPS57139937A (en) 1981-02-23 1981-02-23 Alignment device for discoid body with orientation flat section

Publications (2)

Publication Number Publication Date
JPS57139937A true JPS57139937A (en) 1982-08-30
JPS6127906B2 JPS6127906B2 (en) 1986-06-27

Family

ID=12162421

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2531081A Granted JPS57139937A (en) 1981-02-23 1981-02-23 Alignment device for discoid body with orientation flat section

Country Status (1)

Country Link
JP (1) JPS57139937A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5946026A (en) * 1982-09-09 1984-03-15 Toshiba Corp Measuring method for position of sample
ITMI20101024A1 (en) * 2010-06-09 2011-12-10 Off Mec Di Prec E G3 Di Gamba Walter DEVICE AND METHOD FOR THE PRECISELY POSITIONING OF A MINIATURIZED PIECE IN A POSITIONING SEAT

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5946026A (en) * 1982-09-09 1984-03-15 Toshiba Corp Measuring method for position of sample
ITMI20101024A1 (en) * 2010-06-09 2011-12-10 Off Mec Di Prec E G3 Di Gamba Walter DEVICE AND METHOD FOR THE PRECISELY POSITIONING OF A MINIATURIZED PIECE IN A POSITIONING SEAT

Also Published As

Publication number Publication date
JPS6127906B2 (en) 1986-06-27

Similar Documents

Publication Publication Date Title
US4618292A (en) Controls for semiconductor wafer orientor
JPH0371641U (en)
EP0366880A3 (en) Alignment device
JPS5780972A (en) Parallel production type assembly device in car assembly
ATE75809T1 (en) DEVICE FOR FILLING INSULATING GLASS WITH SPECIAL GAS.
JPS57147247A (en) Automatic inspecting device for semiconductor chip
JPS6444100A (en) Device for mounting electronic component
JPS57139937A (en) Alignment device for discoid body with orientation flat section
KR910000247A (en) Sticking device
JPS52150879A (en) Positioning device for plate supply
JPS6464334A (en) Apparatus for mounting semiconductor wafer
JPS5628443A (en) Explosion-proof processing device
JPS57160815A (en) Article supply method and jig
JPS57149129A (en) Plate material retaining device of wood boring machine
GB1405453A (en) Alignment and holding device and method
JPS5689744A (en) X-ray transfer device
JPS6480466A (en) Device for gluing front face
JPS6451300A (en) Abnormality detector for water jet robot system
JPS6159745A (en) Alignment of wafer
JPS5314575A (en) Vacuum pincette
JPS5884311A (en) Positioning device of rectangular plate piece
JPS5235665A (en) Negative pressure type consant-volume feeder for chemical solutions et c.
JPS5375866A (en) Wafer transfer device
JPS6464330A (en) Positioning method for semiconductor device
JPH02193815A (en) Method and mechanism for transferring semiconductor wafer