JPS57138151A - Bonding method for tape - Google Patents

Bonding method for tape

Info

Publication number
JPS57138151A
JPS57138151A JP56024530A JP2453081A JPS57138151A JP S57138151 A JPS57138151 A JP S57138151A JP 56024530 A JP56024530 A JP 56024530A JP 2453081 A JP2453081 A JP 2453081A JP S57138151 A JPS57138151 A JP S57138151A
Authority
JP
Japan
Prior art keywords
bonding
lead
defective
section
signal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP56024530A
Other languages
English (en)
Inventor
Kazuhiro Hayakawa
Akihiro Nishimura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Shinkawa Seisakusho Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd, Shinkawa Seisakusho Co Ltd filed Critical Shinkawa Ltd
Priority to JP56024530A priority Critical patent/JPS57138151A/ja
Publication of JPS57138151A publication Critical patent/JPS57138151A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/79—Apparatus for Tape Automated Bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
JP56024530A 1981-02-20 1981-02-20 Bonding method for tape Pending JPS57138151A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56024530A JPS57138151A (en) 1981-02-20 1981-02-20 Bonding method for tape

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56024530A JPS57138151A (en) 1981-02-20 1981-02-20 Bonding method for tape

Publications (1)

Publication Number Publication Date
JPS57138151A true JPS57138151A (en) 1982-08-26

Family

ID=12140706

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56024530A Pending JPS57138151A (en) 1981-02-20 1981-02-20 Bonding method for tape

Country Status (1)

Country Link
JP (1) JPS57138151A (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6523446B1 (en) 1997-07-18 2003-02-25 Hitachi Chemical Company, Ltd. Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame
JP2006073920A (ja) * 2004-09-06 2006-03-16 Lintec Corp テープ貼付装置、マウント装置及びマウント方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5475655A (en) * 1977-11-28 1979-06-16 Mitsubishi Electric Corp Heat exchanger

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5475655A (en) * 1977-11-28 1979-06-16 Mitsubishi Electric Corp Heat exchanger

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6523446B1 (en) 1997-07-18 2003-02-25 Hitachi Chemical Company, Ltd. Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame
US7273654B2 (en) 1997-07-18 2007-09-25 Hitachi Chemical Company, Ltd. Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame
US7449076B2 (en) 1997-07-18 2008-11-11 Hitachi Chemical Company, Ltd. Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame
JP2006073920A (ja) * 2004-09-06 2006-03-16 Lintec Corp テープ貼付装置、マウント装置及びマウント方法

Similar Documents

Publication Publication Date Title
GB1320898A (en) Strip measuring unit and split edge detector
JPS57138151A (en) Bonding method for tape
JPS6437905A (en) Auxiliary film welding apparatus of slide fastener chain
JPS57149126A (en) Wire electrode feeder of wire cut electric discharge machining device
GB1417972A (en) Apparatus for splicing a moving web
JPS5552811A (en) Automatic inspection device
GB1343114A (en) Apparatus for the detection of irregularities in a material
GB1304810A (ja)
JPS5292742A (en) Measuring method for welding groove gap
JPS52139485A (en) Follow-up apparatus for use in high-speed ultrasonic flaw detection
JPS5366168A (en) Detection method for wire disconnection
JPS5312377A (en) Inspecting apparatus for surface
JPS5740636A (en) Detecting method of sticking state for adhering powder on metal foil sheet
JPS5643156A (en) Operating method for winder
JPS5312218A (en) Automatic detection range setting circuit
JPS59206165A (ja) 溶接用ワイヤの取出し方法
JPS5748643A (en) Detector for defect of polarizing plate for automatic affixing device of self-adhesive polarizing plate
JPS5263751A (en) Automatic detection of translating specific pattern
JPS5234778A (en) Method of detecting weld lines
JPS6448742A (en) Trouble detecting method for conveying medium
JPS58109839A (ja) 磁気テ−プ貼りの貼り不良検出方法
JPS5484787A (en) Surface inspector
JPS522783A (en) Defect detecting device
JPS5317383A (en) Non-contactive detecting method and apparatus for defect in shape of strip type inspected body
JPS51146887A (en) Defect monitoring device for nondestructive inspection