JPS5713770A - V-mos device with self centering multiple electrodes - Google Patents
V-mos device with self centering multiple electrodesInfo
- Publication number
- JPS5713770A JPS5713770A JP5306281A JP5306281A JPS5713770A JP S5713770 A JPS5713770 A JP S5713770A JP 5306281 A JP5306281 A JP 5306281A JP 5306281 A JP5306281 A JP 5306281A JP S5713770 A JPS5713770 A JP S5713770A
- Authority
- JP
- Japan
- Prior art keywords
- mos device
- multiple electrodes
- self centering
- centering multiple
- self
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/63—Vertical IGFETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
- H10B12/39—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells the capacitor and the transistor being in a same trench
- H10B12/395—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells the capacitor and the transistor being in a same trench the transistor being vertical
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W20/00—Interconnections in chips, wafers or substrates
- H10W20/01—Manufacture or treatment
- H10W20/031—Manufacture or treatment of conductive parts of the interconnections
- H10W20/056—Manufacture or treatment of conductive parts of the interconnections by filling conductive material into holes, grooves or trenches
Landscapes
- Semiconductor Memories (AREA)
- Electrodes Of Semiconductors (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US06/158,668 US4364074A (en) | 1980-06-12 | 1980-06-12 | V-MOS Device with self-aligned multiple electrodes |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5713770A true JPS5713770A (en) | 1982-01-23 |
| JPH0230585B2 JPH0230585B2 (https=) | 1990-07-06 |
Family
ID=22569161
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5306281A Granted JPS5713770A (en) | 1980-06-12 | 1981-04-10 | V-mos device with self centering multiple electrodes |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US4364074A (https=) |
| EP (1) | EP0042084B1 (https=) |
| JP (1) | JPS5713770A (https=) |
| CA (1) | CA1159953A (https=) |
| DE (1) | DE3165658D1 (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63135737A (ja) * | 1986-11-28 | 1988-06-08 | Shimizu Constr Co Ltd | クリ−ンル−ム |
Families Citing this family (49)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3382688T2 (de) * | 1982-02-10 | 1993-09-02 | Hitachi Ltd | Halbleiterspeicher und sein herstellungsverfahren. |
| US4567641A (en) * | 1982-04-12 | 1986-02-04 | General Electric Company | Method of fabricating semiconductor devices having a diffused region of reduced length |
| US4571512A (en) * | 1982-06-21 | 1986-02-18 | Eaton Corporation | Lateral bidirectional shielded notch FET |
| US4553151A (en) * | 1982-09-23 | 1985-11-12 | Eaton Corporation | Bidirectional power FET with field shaping |
| US4542396A (en) * | 1982-09-23 | 1985-09-17 | Eaton Corporation | Trapped charge bidirectional power FET |
| US4541001A (en) * | 1982-09-23 | 1985-09-10 | Eaton Corporation | Bidirectional power FET with substrate-referenced shield |
| JPS60152058A (ja) * | 1984-01-20 | 1985-08-10 | Toshiba Corp | 半導体記憶装置 |
| USRE33261E (en) * | 1984-07-03 | 1990-07-10 | Texas Instruments, Incorporated | Trench capacitor for high density dynamic RAM |
| US5208657A (en) * | 1984-08-31 | 1993-05-04 | Texas Instruments Incorporated | DRAM Cell with trench capacitor and vertical channel in substrate |
| US4824793A (en) * | 1984-09-27 | 1989-04-25 | Texas Instruments Incorporated | Method of making DRAM cell with trench capacitor |
| US5225697A (en) * | 1984-09-27 | 1993-07-06 | Texas Instruments, Incorporated | dRAM cell and method |
| US4797373A (en) * | 1984-10-31 | 1989-01-10 | Texas Instruments Incorporated | Method of making dRAM cell with trench capacitor |
| US4763177A (en) * | 1985-02-19 | 1988-08-09 | Texas Instruments Incorporated | Read only memory with improved channel length isolation and method of forming |
| US5102817A (en) * | 1985-03-21 | 1992-04-07 | Texas Instruments Incorporated | Vertical DRAM cell and method |
| US5017977A (en) * | 1985-03-26 | 1991-05-21 | Texas Instruments Incorporated | Dual EPROM cells on trench walls with virtual ground buried bit lines |
| US5135879A (en) * | 1985-03-26 | 1992-08-04 | Texas Instruments Incorporated | Method of fabricating a high density EPROM cell on a trench wall |
| US5164917A (en) * | 1985-06-26 | 1992-11-17 | Texas Instruments Incorporated | Vertical one-transistor DRAM with enhanced capacitance and process for fabricating |
| US4751558A (en) * | 1985-10-31 | 1988-06-14 | International Business Machines Corporation | High density memory with field shield |
| US4767722A (en) * | 1986-03-24 | 1988-08-30 | Siliconix Incorporated | Method for making planar vertical channel DMOS structures |
| US4811067A (en) * | 1986-05-02 | 1989-03-07 | International Business Machines Corporation | High density vertically structured memory |
| US4975384A (en) * | 1986-06-02 | 1990-12-04 | Texas Instruments Incorporated | Erasable electrically programmable read only memory cell using trench edge tunnelling |
| US4829017A (en) * | 1986-09-25 | 1989-05-09 | Texas Instruments Incorporated | Method for lubricating a high capacity dram cell |
| US4763180A (en) * | 1986-12-22 | 1988-08-09 | International Business Machines Corporation | Method and structure for a high density VMOS dynamic ram array |
| US4874715A (en) * | 1987-05-20 | 1989-10-17 | Texas Instruments Incorporated | Read only memory with improved channel length control and method of forming |
| US5109259A (en) * | 1987-09-22 | 1992-04-28 | Texas Instruments Incorporated | Multiple DRAM cells in a trench |
| US4979004A (en) * | 1988-01-29 | 1990-12-18 | Texas Instruments Incorporated | Floating gate memory cell and device |
| US5105245A (en) * | 1988-06-28 | 1992-04-14 | Texas Instruments Incorporated | Trench capacitor DRAM cell with diffused bit lines adjacent to a trench |
| US5225363A (en) * | 1988-06-28 | 1993-07-06 | Texas Instruments Incorporated | Trench capacitor DRAM cell and method of manufacture |
| KR920000708B1 (ko) * | 1988-07-22 | 1992-01-20 | 현대전자산업 주식회사 | 포토레지스트 에치백 기술을 이용한 트렌치 캐패시터 형성방법 |
| US5072266A (en) | 1988-12-27 | 1991-12-10 | Siliconix Incorporated | Trench DMOS power transistor with field-shaping body profile and three-dimensional geometry |
| US5057887A (en) * | 1989-05-14 | 1991-10-15 | Texas Instruments Incorporated | High density dynamic ram cell |
| US5017506A (en) * | 1989-07-25 | 1991-05-21 | Texas Instruments Incorporated | Method for fabricating a trench DRAM |
| US5045490A (en) * | 1990-01-23 | 1991-09-03 | Texas Instruments Incorporated | Method of making a pleated floating gate trench EPROM |
| US5053839A (en) * | 1990-01-23 | 1991-10-01 | Texas Instruments Incorporated | Floating gate memory cell and device |
| US4964080A (en) * | 1990-03-09 | 1990-10-16 | Intel Corporation | Three-dimensional memory cell with integral select transistor |
| US5276343A (en) * | 1990-04-21 | 1994-01-04 | Kabushiki Kaisha Toshiba | Semiconductor memory device having a bit line constituted by a semiconductor layer |
| JPH0834302B2 (ja) * | 1990-04-21 | 1996-03-29 | 株式会社東芝 | 半導体記憶装置 |
| US5250450A (en) * | 1991-04-08 | 1993-10-05 | Micron Technology, Inc. | Insulated-gate vertical field-effect transistor with high current drive and minimum overlap capacitance |
| US5122848A (en) * | 1991-04-08 | 1992-06-16 | Micron Technology, Inc. | Insulated-gate vertical field-effect transistor with high current drive and minimum overlap capacitance |
| US5229310A (en) * | 1991-05-03 | 1993-07-20 | Motorola, Inc. | Method for making a self-aligned vertical thin-film transistor in a semiconductor device |
| US6015737A (en) * | 1991-07-26 | 2000-01-18 | Denso Corporation | Production method of a vertical type MOSFET |
| US5670803A (en) * | 1995-02-08 | 1997-09-23 | International Business Machines Corporation | Three-dimensional SRAM trench structure and fabrication method therefor |
| GB2347014B (en) | 1999-02-18 | 2003-04-16 | Zetex Plc | Semiconductor device |
| US7121651B2 (en) * | 2002-05-09 | 2006-10-17 | Brother Kogyo Kabushiki Kaisha | Droplet-jetting device with pressure chamber expandable by elongation of pressure-generating section |
| US6586291B1 (en) * | 2002-08-08 | 2003-07-01 | Lsi Logic Corporation | High density memory with storage capacitor |
| US20090242941A1 (en) | 2008-03-25 | 2009-10-01 | International Business Machines Corporation | Structure and method for manufacturing device with a v-shape channel nmosfet |
| FR2986106B1 (fr) * | 2012-01-20 | 2014-08-22 | Soitec Silicon On Insulator | Procede de fabrication de substrats semi-conducteur, et substrats semi-conducteur |
| KR102721980B1 (ko) | 2022-02-24 | 2024-10-25 | 삼성전자주식회사 | 기판 정렬 장치 및 이를 이용한 기판 정렬 방법 |
| US12610605B2 (en) * | 2022-11-28 | 2026-04-21 | Globalfoundries U.S. Inc. | IC structure with gate electrode fully within V-shaped cavity |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS538076A (en) * | 1976-07-12 | 1978-01-25 | Hitachi Ltd | Production of mis semiconductor device |
| JPS5339892A (en) * | 1976-09-22 | 1978-04-12 | Siemens Ag | Semiconductor memory |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3975221A (en) * | 1973-08-29 | 1976-08-17 | American Micro-Systems, Inc. | Low capacitance V groove MOS NOR gate and method of manufacture |
| US4003036A (en) * | 1975-10-23 | 1977-01-11 | American Micro-Systems, Inc. | Single IGFET memory cell with buried storage element |
| US4065783A (en) * | 1976-10-18 | 1977-12-27 | Paul Hsiung Ouyang | Self-aligned double implanted short channel V-groove MOS device |
| US4116720A (en) * | 1977-12-27 | 1978-09-26 | Burroughs Corporation | Method of making a V-MOS field effect transistor for a dynamic memory cell having improved capacitance |
| JPS54154977A (en) * | 1978-05-29 | 1979-12-06 | Fujitsu Ltd | Semiconductor device and its manufacture |
| JPS5537250U (https=) * | 1978-08-31 | 1980-03-10 | ||
| US4225879A (en) * | 1979-01-26 | 1980-09-30 | Burroughs Corporation | V-MOS Field effect transistor for a dynamic memory cell having improved capacitance |
-
1980
- 1980-06-12 US US06/158,668 patent/US4364074A/en not_active Expired - Lifetime
-
1981
- 1981-04-10 JP JP5306281A patent/JPS5713770A/ja active Granted
- 1981-05-08 CA CA000377171A patent/CA1159953A/en not_active Expired
- 1981-05-25 DE DE8181104003T patent/DE3165658D1/de not_active Expired
- 1981-05-25 EP EP81104003A patent/EP0042084B1/en not_active Expired
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS538076A (en) * | 1976-07-12 | 1978-01-25 | Hitachi Ltd | Production of mis semiconductor device |
| JPS5339892A (en) * | 1976-09-22 | 1978-04-12 | Siemens Ag | Semiconductor memory |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63135737A (ja) * | 1986-11-28 | 1988-06-08 | Shimizu Constr Co Ltd | クリ−ンル−ム |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0230585B2 (https=) | 1990-07-06 |
| DE3165658D1 (en) | 1984-09-27 |
| EP0042084A1 (en) | 1981-12-23 |
| EP0042084B1 (en) | 1984-08-22 |
| CA1159953A (en) | 1984-01-03 |
| US4364074A (en) | 1982-12-14 |
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