JPS57133643A - Bonding method - Google Patents

Bonding method

Info

Publication number
JPS57133643A
JPS57133643A JP56019108A JP1910881A JPS57133643A JP S57133643 A JPS57133643 A JP S57133643A JP 56019108 A JP56019108 A JP 56019108A JP 1910881 A JP1910881 A JP 1910881A JP S57133643 A JPS57133643 A JP S57133643A
Authority
JP
Japan
Prior art keywords
lead
thermode
bump
chip
pressed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP56019108A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6347142B2 (enrdf_load_stackoverflow
Inventor
Kenichi Murakami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP56019108A priority Critical patent/JPS57133643A/ja
Publication of JPS57133643A publication Critical patent/JPS57133643A/ja
Publication of JPS6347142B2 publication Critical patent/JPS6347142B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/79—Apparatus for Tape Automated Bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/014—Solder alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
JP56019108A 1981-02-13 1981-02-13 Bonding method Granted JPS57133643A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP56019108A JPS57133643A (en) 1981-02-13 1981-02-13 Bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56019108A JPS57133643A (en) 1981-02-13 1981-02-13 Bonding method

Publications (2)

Publication Number Publication Date
JPS57133643A true JPS57133643A (en) 1982-08-18
JPS6347142B2 JPS6347142B2 (enrdf_load_stackoverflow) 1988-09-20

Family

ID=11990278

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56019108A Granted JPS57133643A (en) 1981-02-13 1981-02-13 Bonding method

Country Status (1)

Country Link
JP (1) JPS57133643A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4994411A (en) * 1988-03-10 1991-02-19 Hitachi, Ltd. Process of producing semiconductor device
US5093281A (en) * 1988-07-13 1992-03-03 Mitsubishi Denki Kabushiki Kaisha method for manufacturing semiconductor devices
WO2010114495A1 (en) * 2009-04-02 2010-10-07 Trimech Technology Pte. Ltd. A thermode assembly

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4994411A (en) * 1988-03-10 1991-02-19 Hitachi, Ltd. Process of producing semiconductor device
US5093281A (en) * 1988-07-13 1992-03-03 Mitsubishi Denki Kabushiki Kaisha method for manufacturing semiconductor devices
WO2010114495A1 (en) * 2009-04-02 2010-10-07 Trimech Technology Pte. Ltd. A thermode assembly

Also Published As

Publication number Publication date
JPS6347142B2 (enrdf_load_stackoverflow) 1988-09-20

Similar Documents

Publication Publication Date Title
AU2002248684A1 (en) Flip chip interconnection using no-clean flux
JPS53149763A (en) Mounting method of semiconductor integrate circuit
MY105130A (en) Self-centering electrode for power devices.
BR8300105A (pt) Aparelho e metodo para aplicar material de solda em superficies metalicas
TW360964B (en) Process for flip-chip mounting
JPS57133643A (en) Bonding method
JPS6481330A (en) Film carrier semiconductor device
JPS5389368A (en) Production of semiconductor integrated circuit
JPS6423543A (en) Soldering by use of laser
JPS54101668A (en) Ultrasonic wire bonding method
JPS6450595A (en) Connection of semiconductor device
JP2523512Y2 (ja) フラットパッケ−ジ型ｉｃ
JPS55121656A (en) Manufacture of semiconductor device
JPS5712530A (en) Wire bonding method
JPS6450538A (en) Manufacture of semiconductor device
JPH08203904A (ja) はんだバンプ形成方法
JPS5728336A (en) Forming method for electrode of semiconductor device
JPH03196650A (ja) フリップチップボンディング方法
JPS6437077A (en) Reflow soldering
JPS5596648A (en) Wire bonding apparatus
JPS5513985A (en) Ic mounting structure
JP2805713B2 (ja) Ａｕ−Ｓｎろうのろう付け方法
JPS6420633A (en) Manufacture of semiconductor device
JPS5674934A (en) Preparation method of ic
JPS6450596A (en) Method of soldering for surface mounting component