JPS57130423A - Apparatus for pattern inspection - Google Patents

Apparatus for pattern inspection

Info

Publication number
JPS57130423A
JPS57130423A JP1573681A JP1573681A JPS57130423A JP S57130423 A JPS57130423 A JP S57130423A JP 1573681 A JP1573681 A JP 1573681A JP 1573681 A JP1573681 A JP 1573681A JP S57130423 A JPS57130423 A JP S57130423A
Authority
JP
Japan
Prior art keywords
unit pattern
pattern
judged
unit
inspection section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1573681A
Other languages
Japanese (ja)
Inventor
Kiyoshi Nakagawa
Shigeaki Nakajima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP1573681A priority Critical patent/JPS57130423A/en
Publication of JPS57130423A publication Critical patent/JPS57130423A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)

Abstract

PURPOSE:To inspect the quality of unit pattern rapidly and surely by a method wherein the existence of the common defect in the unit pattern is inspected in an absolute inspection section and one unit pattern is compared with the other in turn in a relative inspection section. CONSTITUTION:A first unit pattern P1 is focused onto a linear imaging sensor 6 to recognize the configuration of the pattern P1. On the other hand, the data for forming a reticle is taken from a memory 12 and the foregoing two signals are input to a comparator 11. Since the comparator 11 is set in a comparable condition for constituting an absolute inspection section 15, the pattern signal P1 is compared with the data for forming a reticle, therefore only when the both are determined identical, the pattern P1 is judged to be acceptable. When the both are different from each other, the comparison, is continued for the unit pattern P2 which sequentially follow until a unit pattern judged to be acceptable is obtained. At the inspection for a plurality of unit patterns, when the unit pattern judged to be good may be detected, thereafter the compararator 11 serves as a relative inspection section 14 and a next unit pattern is inspected using the unit pattern judged to be acceptable as a reference.
JP1573681A 1981-02-06 1981-02-06 Apparatus for pattern inspection Pending JPS57130423A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1573681A JPS57130423A (en) 1981-02-06 1981-02-06 Apparatus for pattern inspection

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1573681A JPS57130423A (en) 1981-02-06 1981-02-06 Apparatus for pattern inspection

Publications (1)

Publication Number Publication Date
JPS57130423A true JPS57130423A (en) 1982-08-12

Family

ID=11897037

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1573681A Pending JPS57130423A (en) 1981-02-06 1981-02-06 Apparatus for pattern inspection

Country Status (1)

Country Link
JP (1) JPS57130423A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6093305A (en) * 1983-10-27 1985-05-25 Fujitsu Ltd Method for mask examination
JPS6147635A (en) * 1984-08-14 1986-03-08 Nippon Jido Seigyo Kk Pattern inspection method using pattern defect inspection apparatus
JPS61180432A (en) * 1985-02-06 1986-08-13 Hitachi Ltd Inspection of pattern
JPH02126142A (en) * 1988-11-04 1990-05-15 Nichizou Tec:Kk Can coating inspecting device
JP2004212218A (en) * 2002-12-27 2004-07-29 Toshiba Corp Sample inspection method and inspection apparatus

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6093305A (en) * 1983-10-27 1985-05-25 Fujitsu Ltd Method for mask examination
JPH0417361B2 (en) * 1983-10-27 1992-03-25 Fujitsu Ltd
JPS6147635A (en) * 1984-08-14 1986-03-08 Nippon Jido Seigyo Kk Pattern inspection method using pattern defect inspection apparatus
JPS61180432A (en) * 1985-02-06 1986-08-13 Hitachi Ltd Inspection of pattern
JPH02126142A (en) * 1988-11-04 1990-05-15 Nichizou Tec:Kk Can coating inspecting device
JP2004212218A (en) * 2002-12-27 2004-07-29 Toshiba Corp Sample inspection method and inspection apparatus

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