JPS57129732A - Resin sealing mold - Google Patents
Resin sealing moldInfo
- Publication number
- JPS57129732A JPS57129732A JP1546281A JP1546281A JPS57129732A JP S57129732 A JPS57129732 A JP S57129732A JP 1546281 A JP1546281 A JP 1546281A JP 1546281 A JP1546281 A JP 1546281A JP S57129732 A JPS57129732 A JP S57129732A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- pilot hole
- lead frame
- hole
- passed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
Abstract
PURPOSE:To greatly save the cost and time of manufacturing sealed molds by interposing a plate with a cavity determining the shape and position of sealing resin between an upper mold and a lower mold. CONSTITUTION:An electronic part 13 is placed between a lower mold 12 provided with a guage pin 17 and a runner 20 through which a sealing resin 24 is to be passed and an upper mold 11 provided with a pilot hole 22, a through hole 23 through which a plunger head 19 is to be passed, and a dent 26. And, a lead frame 14 with a hole through which the resin passes is interleaved and set between plates 1' and 1'' havng a pilot hole 2 of the same size as that of the pilot hole of the lead frame 14, positioned as the same place as the pilot hole of the frame 14 to seal up the resin 14, and a given shape of a cavity 3 at a position where the electronic part 13 on the lead frame 14 is sealed with the resin.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1546281A JPS57129732A (en) | 1981-02-04 | 1981-02-04 | Resin sealing mold |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1546281A JPS57129732A (en) | 1981-02-04 | 1981-02-04 | Resin sealing mold |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS57129732A true JPS57129732A (en) | 1982-08-11 |
Family
ID=11889457
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1546281A Pending JPS57129732A (en) | 1981-02-04 | 1981-02-04 | Resin sealing mold |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS57129732A (en) |
-
1981
- 1981-02-04 JP JP1546281A patent/JPS57129732A/en active Pending
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