JPS57129710A - Molds for forming resin seal for insert - Google Patents
Molds for forming resin seal for insertInfo
- Publication number
- JPS57129710A JPS57129710A JP1507681A JP1507681A JPS57129710A JP S57129710 A JPS57129710 A JP S57129710A JP 1507681 A JP1507681 A JP 1507681A JP 1507681 A JP1507681 A JP 1507681A JP S57129710 A JPS57129710 A JP S57129710A
- Authority
- JP
- Japan
- Prior art keywords
- cavity
- insert
- resin
- roughness
- lower mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 title abstract 5
- 229920005989 resin Polymers 0.000 title abstract 5
- 230000032798 delamination Effects 0.000 abstract 1
- 238000000465 moulding Methods 0.000 abstract 1
- 239000008188 pellet Substances 0.000 abstract 1
- 230000003578 releasing effect Effects 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
- 230000003746 surface roughness Effects 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
- B29C33/424—Moulding surfaces provided with means for marking or patterning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/37—Mould cavity walls, i.e. the inner surface forming the mould cavity, e.g. linings
- B29C45/372—Mould cavity walls, i.e. the inner surface forming the mould cavity, e.g. linings provided with means for marking or patterning, e.g. numbering articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/44—Moulds or cores; Details thereof or accessories therefor with means for, or specially constructed to facilitate, the removal of articles, e.g. of undercut articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
- B29C70/72—Encapsulating inserts having non-encapsulated projections, e.g. extremities or terminal portions of electrical components
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1507681A JPS57129710A (en) | 1981-02-05 | 1981-02-05 | Molds for forming resin seal for insert |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1507681A JPS57129710A (en) | 1981-02-05 | 1981-02-05 | Molds for forming resin seal for insert |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57129710A true JPS57129710A (en) | 1982-08-11 |
| JPH0159085B2 JPH0159085B2 (enExample) | 1989-12-14 |
Family
ID=11878754
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1507681A Granted JPS57129710A (en) | 1981-02-05 | 1981-02-05 | Molds for forming resin seal for insert |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57129710A (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03218055A (ja) * | 1990-01-23 | 1991-09-25 | Matsushita Electron Corp | 樹脂封止型半導体用パッケージ |
| JPH05147045A (ja) * | 1991-12-02 | 1993-06-15 | Enplas Corp | 粗面形成金型の作成方法 |
-
1981
- 1981-02-05 JP JP1507681A patent/JPS57129710A/ja active Granted
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03218055A (ja) * | 1990-01-23 | 1991-09-25 | Matsushita Electron Corp | 樹脂封止型半導体用パッケージ |
| JPH05147045A (ja) * | 1991-12-02 | 1993-06-15 | Enplas Corp | 粗面形成金型の作成方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0159085B2 (enExample) | 1989-12-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| ES8203702A1 (es) | Procedimiento de fabricacion de piezas de plastico moldeado con recubrimiento transferido desde el molde. | |
| EP0551526A4 (en) | Method of molding multilayer molded article | |
| JPS57129710A (en) | Molds for forming resin seal for insert | |
| EP0376264A3 (en) | Process and mold for producing a multilayer molded article | |
| JPS562148A (en) | Manufacture of painted molding and its molding metal mold | |
| JPS56118830A (en) | Manufacture of foamed molding with opening | |
| JPS54131670A (en) | Production of resin molded article | |
| JPS6418617A (en) | Manufacture of synthetic resin product having skin material | |
| JPS5664458A (en) | Metallic body | |
| JPS5476658A (en) | Molding of synthetic resin article | |
| JPS57117935A (en) | Molding structure for synthetic resin molding | |
| JPS57179972A (en) | Manufacture for tape cassette | |
| JPS5519848A (en) | Semiconductor element molding die | |
| JPS5672431A (en) | Manufacture of reflective type screen | |
| JPS55146724A (en) | Double molding device using different kinds of materials | |
| JPS6447998A (en) | Manufacturing method of solidification of radioactive waste | |
| JPS56136454A (en) | Production of sealing material for battery | |
| JPS5720437A (en) | Resin sealing metal mold for semiconductor device | |
| JPS6435984A (en) | Manufacture of electric circuit molding | |
| JPS5457963A (en) | Resin sealing metallic mold of semiconductor device | |
| JPS57137129A (en) | Formation of three-dimensional pattern consisting of bright face and craped rough face | |
| JPS6422510A (en) | Molding method | |
| JPS556840A (en) | Optical semiconductor device and resin sealing method of the same | |
| JPS5788748A (en) | Semiconductor device | |
| JPS57178389A (en) | Resin sealing type hall element |