JPS57125244A - Epoxy resin composition - Google Patents

Epoxy resin composition

Info

Publication number
JPS57125244A
JPS57125244A JP1018281A JP1018281A JPS57125244A JP S57125244 A JPS57125244 A JP S57125244A JP 1018281 A JP1018281 A JP 1018281A JP 1018281 A JP1018281 A JP 1018281A JP S57125244 A JPS57125244 A JP S57125244A
Authority
JP
Japan
Prior art keywords
epoxy resin
group
epoxy
equiv
pref
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1018281A
Other languages
Japanese (ja)
Inventor
Kazutaka Matsumoto
Kazuhiko Kurematsu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP1018281A priority Critical patent/JPS57125244A/en
Publication of JPS57125244A publication Critical patent/JPS57125244A/en
Pending legal-status Critical Current

Links

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  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)

Abstract

PURPOSE: To prepare the titled composition having improved crack resistance, without lowering the heat distortion temperature, by compounding an epoxy resin with a specific polyether ester and an epoxy resin hardener.
CONSTITUTION: An epoxy resin having two or more epoxy groups in a molecule is mixed with 1W20wt% polyether ester of formulaI[R1 is CH2CH2 or group of formula II or III; R2 is (CH2)l(l is 3W5); R3 is group of formula IV, V or VI; n/(K+m+n) is 0.05W0.3](pref. having a weight average molecular weight of 10,000W100,000), stirred for 1W2.5hr under heating at 100W150°C, and cooled to room temperature. An epoxy resin hardener (e.g. acid anhydride) is added to the mixture, and the composition is defoamed if necessary, and cured by heating at 80W180°C for 1W15hr. The amount of the epoxy resin hardener is pref. 0.6W 1.2 equiv. per 1 equiv. of the epoxy group of the epoxy resin.
COPYRIGHT: (C)1982,JPO&Japio
JP1018281A 1981-01-28 1981-01-28 Epoxy resin composition Pending JPS57125244A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1018281A JPS57125244A (en) 1981-01-28 1981-01-28 Epoxy resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1018281A JPS57125244A (en) 1981-01-28 1981-01-28 Epoxy resin composition

Publications (1)

Publication Number Publication Date
JPS57125244A true JPS57125244A (en) 1982-08-04

Family

ID=11743140

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1018281A Pending JPS57125244A (en) 1981-01-28 1981-01-28 Epoxy resin composition

Country Status (1)

Country Link
JP (1) JPS57125244A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019214653A (en) * 2018-06-12 2019-12-19 国立大学法人大阪大学 Manufacturing method of hybrid resin and hybrid resin

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019214653A (en) * 2018-06-12 2019-12-19 国立大学法人大阪大学 Manufacturing method of hybrid resin and hybrid resin

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